QFP 132 Search Results

PA44QF14C-44QF

Abstract: PA44QF16-44QF PA44QF03-44QF 44QXQF QFP 128 pin Socket Enplas Enplas fpq FPQ-44-0.8-16 qfp 0.8mm Enplas OTQ
Contextual Info: PA44QFxxx-44QF Data Sheet 44 pin QFP socket/44 pin QFP plug Supported Device/Footprints These adapters accept 44 pin QFP devices and have a removable 44 pin QFP solder-down plug. This allows QFP device to be inserted into and removed from a prototype easily.

32Q-QF

Contextual Info: PA32QF-32QF Data Sheet 32 pin QFP socket/32 pin QFP plug Supported Device/Footprints Adapter Construction These adapters accept 32 pin QFP devices and have a removable 32 pin QFP solder-down plug. This allows QFP device to be inserted into and removed from a prototype easily.

Contextual Info: PA711D3-QFP Data Sheet 44 pin QFP socket/28 pin DIP 0.6” plug Supported Device/Footprints Adapter Wiring Using this adapter, the Motorola 68HC711D3 in the QFP package can be programmed on 28 pin DIP programmers. The following chart shows the connections from the QFP device

132 pin PGA socket

Contextual Info: Part No. 95-132I25 - QFP to PGA Adapter for JEDEC 132 Position, .025 [.64] Pitch FEATURES: •Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

132 pin PGA socket

Contextual Info: Part No. 95-132I25 - QFP to PGA Adapter for JEDEC 132 Position, .025 [.64] Pitch FEATURES: •Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

Contextual Info: Part No. 95-132I25 - QFP to PGA Adapter for JEDEC 132 Position, .025 [.64] Pitch FEATURES: •Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

95-132I25

Abstract: ASTM-B16-85
Contextual Info: Part No. 95-132I25 - QFP to PGA Adapter for JEDEC 132 Position, .025 [.64] Pitch FEATURES: •Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

Contextual Info: Part No. 95-132I25 - QFP to PGA Adapter for JEDEC 132 Position, .025 [.64] Pitch FEATURES: •Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

132 pin PGA socket

Contextual Info: Part No. 95-132I25 - QFP to PGA Adapter for JEDEC 132 Position, .025 [.64] Pitch FEATURES: •Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

95-132I25

Abstract: ASTM-B16-85 MIL-T-10727
Contextual Info: Part No. 95-132I25 - QFP to PGA Adapter for JEDEC 132 Position, .025 [.64] Pitch FEATURES: •Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

Contextual Info: PA552-QFP Data Sheet 80 pin QFP socket/40 pin DIP 0.6” plug Supported Device/Footprints Adapter Wiring This adapter allows programming of the Philips 87C552 and 87C554 in a QFP package on 40 pin DIP programmers capable of programming the 87C51Fx. The following chart shows the connections from the QFP device

YAMAICHI ic357

Abstract: IC51-1284-1702 IC51-0644-1972 IC357-0484-078 IC357 ic51-1284-1702-2 IC500-1444-002P-2 YAMAICHI ic500 IC51-2084-1052-36 IC500-1004-004
Contextual Info: Series Overview *QFP Quad Flat Packages, Gullwing Leads SMT Devices *QFP variations e.g. BQFP. Series IC51 (Clamshell) QFP, PQFP, TQFP and MQUAD 0.4mm to 1.27 Pitch Part Number (Details) Specifications Insulation Resistance: Dielectric Withstanding Voltage:

cxd 158

Abstract: ot 239 IC51-128 OT 306 IC51-2564-1668-6 IC51-0444-467 IC51-1764 socket Yamaichi ic234 IC51-1764-1505-10 IC217-1444-003
Contextual Info: Series Overview *QFP Quad Flat Packages, Gullwing Leads SMT Devices *QFP variations e.g. BQFP. Series IC51 (Clamshell) QFP, PQFP, TQFP and MQUAD 0.4mm to 1.27 Pitch Part Number (Details) Speci cations Insulation Resistance: Dielectric Withstanding Voltage:

IC51-1284-1433

Abstract: IC51-807 IC51-0484-806 IC51-1444-1354-7 IC51-0644-1240 IC51-2564-1668-6 OT 306 IC51-128 IC217-2404-007 cxd 158
Contextual Info: Series Overview *QFP Quad Flat Packages, Gullwing Leads SMT Devices *QFP variations e.g. BQFP. Series IC51 (Clamshell) QFP, PQFP, TQFP and MQUAD 0.4mm to 1.27 Pitch Part Number (Details) Specifications Insulation Resistance: Dielectric Withstanding Voltage:

95-132I25

Abstract: AMS-QQ-N-290
Contextual Info: P/N 95-132I25 JEDEC 132-Position QFP-to-PGA Adapter 0.025 [0.64] Pitch FEATURES • Convert surface-mount QFP packages to a 13x13 PGA footprint. • Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using Aries patented process,

18017

Contextual Info: P/N 95-132I25 JEDEC 132-Position QFP-to-PGA Adapter 0.025 [0.64] Pitch FEATURES • Convert surface-mount QFP packages to a 13x13 PGA footprint. • Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using Aries patented process,

Contextual Info: ADVANCED , QFP Socket/Adapter System INTERCONNECTIONS Patents issued and/or pending. 5 Energy Way. P.O. Box 1019, West Warwick, Rl 02893 . Tel. 401 -823-5200 • FAX 401-823-8723 QFP Socket/Adapter System Gold,'Gold Interconnection Features: • Allows interface of QFP to SMD

FPQ-128-0

Contextual Info: PA1048C-128 Data Sheet 128 pin QFP socket/28 pin DIP 0.6" plug Supported Device/Footprints Adapter Wiring Using this adapter several 128 pin Lattice devices in QFP packages can be programmed on 28 pin DIP programmers. The following chart shows the connections from the QFP device

Contextual Info: WINSLOW ADAPTICs Data Sheet – QFP to PGA with Test Points Generic Adapters These adapters allow the prototyping of QFP and TQFP devices on a 2.54mm pitch development board. The top of the adapter has surface mount pads to which the QFP device can be soldered.

48 pins, 7mm TQFP

Contextual Info: WINSLOW ADAPTICs Data Sheet – QFP to PGA with Test Points Generic Adapters These adapters allow the prototyping of QFP and TQFP devices on a 2.54mm pitch development board. The top of the adapter has surface mount pads to which the QFP device can be soldered.

QFP-68330-L-01

Contextual Info: A1 A PGA 1 145 position, Pin Grid Array. female sockets Relative orientations (top views) PGA/MG14568330 1.500" Pin 1 1992 I.E. QFP Note: QFP base is numbered counter-clockwise from pin 1 as shown. QFP base is not symmetrical and must be aligned correctly to

camtex trays

Abstract: MIL-I-8835A TQFP Shipping Trays exposed QFP 144 QFP Shipping Trays ND07071 MIL-B-81705C Drypacked Devices ND-1414-1 CAMTEX
Contextual Info: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP

PLCC 84 PINS

Abstract: camtex trays MIL-I-8835A
Contextual Info: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP

BY 028

Abstract: 132 pin PGA socket
Contextual Info: Part No. 97-68302 QFP to PGA Adapter for Motorola MC68302 FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using