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    QFP 32 LAND PATTERN Search Results

    QFP 32 LAND PATTERN Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    8501002YC Rochester Electronics LLC Microprocessor, 16-Bit, 6MHz, CMOS, CQFP68, CERAMIC, QFP-68 Visit Rochester Electronics LLC Buy
    8501001YA Rochester Electronics LLC Microprocessor, 16-Bit, 8MHz, CMOS, CQFP68, CERAMIC, QFP-68 Visit Rochester Electronics LLC Buy
    NG82370-16 Rochester Electronics LLC Multifunction Peripheral, CMOS, PQFP100, PLASTIC, QFP-100 Visit Rochester Electronics LLC Buy
    MQ80C196KB-12 Rochester Electronics LLC Microcontroller, 16-Bit, 6MHz, CMOS, CQFP68, CERAMIC, QFP-68 Visit Rochester Electronics LLC Buy
    TMC2081KBC Rochester Electronics LLC Consumer Circuit, PQFP128, METRIC, PLASTIC, QFP-128 Visit Rochester Electronics LLC Buy

    QFP 32 LAND PATTERN Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    R50-E2Y2-24

    Abstract: sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 soic40 plcc44 pinout numbers XE4006E 68hc001
    Text: Ironwood Electronics PC.1 IC Package and Device Converters We offer over 500 adapters for converting IC packaging and device pinouts, solving many IC availability and performance issues. We also offer "fix" adapters to solve layout problems and some known chip deficiences. Custom, quick turn solutions are our speciality.


    Original     		PDF PC-ZIP/DIP20-01 PC-ZIP/DIP28-01 PC-ZIP/DIP28-02 PC-ZIP20/DIP18-01 R50-E2Y2-24 sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 soic40 plcc44 pinout numbers XE4006E 68hc001

    32Q-QF

    Abstract: No abstract text available
    Text: PA32QF-32QF Data Sheet 32 pin QFP socket/32 pin QFP plug Supported Device/Footprints Adapter Construction These adapters accept 32 pin QFP devices and have a removable 32 pin QFP solder-down plug. This allows QFP device to be inserted into and removed from a prototype easily.


    Original     		PDF PA32QF-32QF socket/32 32Q-1498 IC51-0324-1498 PQF-32 PA32QF-32QF 32Q-QF

    FP-X4KPG223-01

    Abstract: reflow profile FOR LGA COMPONENTS bga96 BGA165 BGA292 SO8A CA-SO18A-Z-J-T-01 SF-QFE352SA-L-01 BGA480B CA-PLCC44-D-P-T-01
    Text: Ironwood Electronics PB.1 Probing Adapters We offer probing adapters and logic analyzer adapters for all SMT package types, as well as socket probes for DIP and PLCC. We are Agilent and Tektronix partners. In addition, we offer adapters to facilitate the use of in-circuit emulators


    Original     		PDF XC2018, XC2018 XC3020, XC3064, XC3042, XC3090, XC3090 FP-X4KPG223-01 reflow profile FOR LGA COMPONENTS bga96 BGA165 BGA292 SO8A CA-SO18A-Z-J-T-01 SF-QFE352SA-L-01 BGA480B CA-PLCC44-D-P-T-01

    Untitled

    Abstract: No abstract text available
    Text: PA28-32-20-Dx-QF Data Sheet 28 pin DIP 0.3” socket /32 pin QFP plug Adapter Dimensions Supported Device/Footprints The PA28-32-20-Dx-QF adapters accept 28 pin DIP devices and have a removable 32 pin QFP solder-down plug. This allows DIP devices, or emulators with DIP plugs, to be used during


    Original     		PDF PA28-32-20-Dx-QF AT90S2333, AT90LS4433, AT90S4433, AT90LS4433 32QFP PA28-32-20-DZ-QF PA28-32-20DxQF 283220DQ

    footprint jedec MS-026 TQFP

    Abstract: JEDEC MS-026 footprint qfp 64 0.5 mm pitch land pattern fine BGA thermal profile schematic impulse sealer HQ208 PQ100 land pattern QFP 208 PQ208 TQ100
    Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF

    schematic impulse sealer

    Abstract: XC4010E-PQ208 JEDEC Package Code MS-026-AED XC4013E-PQ240 JEDEC MS-026 footprint MS-026-ACB footprint jedec MS-026 TQFP 128 XC4013E-BG225 PG299-XC4025E bav 21 diode
    Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF

    qfp 32 land pattern

    Abstract: 44 pin plcc package drawing PLCC18
    Text: Pin 1 PLCC 0.030" top 2 Pin 1 QFP 40 7 1 0.448" Top View 0.596" 29 0.8mm 18 1 0.297" Side View 0.050" 0.017" 0.636" 0.686" QFP 1 2 3 4 5 6 7 8 9 10 11 PLCC 7 8 9 10 11 12 13 14 15 16 17 QFP 12 13 14 15 16 17 18 19 20 21 22 PLCC 18 19 20 21 22 23 24 25 26 27


    Original     		PDF FR4/G10 PC-QFP/PLCC44-01 qfp 32 land pattern 44 pin plcc package drawing PLCC18

    PA17C42-DP-QF

    Abstract: PA17C42-DZ-QF 17C42-DQ
    Text: PA17C42-Dx-QF Data Sheet 40 pin DIP socket/44 pin QFP plug Supported Device/Footprints Adapter Dimensions The PA17C42-Dx-QF adapter accepts 40 pin DIP devices and has a removable 44 pin QFP solder-down plug. This allows DIP devices, or emulators with DIP plugs, to be used during


    Original     		PDF PA17C42-Dx-QF socket/44 PIC17C42, PIC17C42A, PIC17C43, PIC17C44 44MQFP 17C42-DQ PA17C42-DP-QF PA17C42-DZ-QF

    land pattern for TSOP 2 86 PIN

    Abstract: land pattern for TSOP 2 54 pin land pattern for TSOP 56 pin oki naming qfp 64 0.4 mm pitch land pattern TSOP 54 land pattern ic packages TSOP 66 pin Package thermal resistance SOJ 44 PCB land ED730
    Text: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS This document is Chapter 1 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS 1. PACKAGE CLASSIFICATIONS


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: PA40Dx-44QF-30 Data Sheet 40 pin DIP socket/44 pin QFP plug Adapter Dimensions Supported Device/Footprints The PA40-44-P64-Dx-QF adapter accepts 40 pin DIP devices and has a removable 44 pin QFP solder-down plug. This allows DIP devices, or emulators with DIP plugs, to be used during


    Original     		PDF PA40Dx-44QF-30 socket/44 PA40-44-P64-Dx-QF AT90S4434, AT90LS4434, AT90S8535, AT90LS8535 44QFP 404430DQ

    PA44-DP-QF

    Abstract: PA44-DZ-QF
    Text: PA44-Dx-QF Data Sheet 44 pin DIP socket/44 pin QFP plug Supported Device/Footprints Adapter Dimensions The PA44-Dx-QF adapter accepts 44 pin DIP devices and has a removable 44 pin QFP solder-down plug. This allows DIP devices, or emulators with DIP plugs, to be used during


    Original     		PDF PA44-Dx-QF socket/44 PA44-DZ-QF PA44-DP-QF PA44-DZ-QF

    PA40-44-X-DP-QF

    Abstract: PA40-44-X-DZ-QF 4044XDQ
    Text: PA40-44-X-Dx-QF Data Sheet 40 pin DIP socket/44 pin QFP plug Supported Device/Footprints Adapter Construction The PA40-44-Dx-QF adapters accepts 40 pin DIP devices and has a removable 44 pin QFP solder-down plug. This allows DIP devices, or emulators with DIP plugs, to be used during


    Original     		PDF PA40-44-X-Dx-QF socket/44 PA40-44-Dx-QF PQF-44 PA40-44-X-DP-QF PA40-44-X-DZ-QF 4044XDQ PA40-44-X-DP-QF PA40-44-X-DZ-QF

    PA705C8-DP-QF

    Abstract: PA705C8-DZ-QF 705C8DQ
    Text: PA705C8-Dx-QF Data Sheet 40 pin DIP socket/44 pin QFP plug Supported Device/Footprints Adapter Dimensions The PA705C8-Dx-QF adapter accepts 40 pin DIP devices and has a removable 44 pin QFP solder-down plug. This allows DIP devices, or emulators with DIP plugs, to be used during


    Original     		PDF PA705C8-Dx-QF socket/44 MC68HC705C8, 705C9, 705C4 44QFP 705C8DQ PA705C8-DP-QF PA705C8-DZ-QF

    PA44-PZ-QF

    Abstract: 44PPQF
    Text: PA44-Px-QF Data Sheet 44 pin PLCC socket/44 pin QFP plug Supported Device/Footprints This adapter accepts 44 pin PLCC devices or emulator plugs and has a removable 44 pin QFP solder-down plug. Test points are provided near the edges of the circuit board. Mfgr


    Original     		PDF PA44-Px-QF socket/44 PQF-44 PA44-PP-QF 44PL-Q PA44-PA-QF 44PP-Q PA44-PZ-QF PA44-PZ-QF 44PPQF

    footprint jedec MS-026 TQFP 128

    Abstract: schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228
    Text: 08 001-022_pkg.fm Page 1 Tuesday, March 14, 2000 2:15 PM Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF FG860 FG900 FG1156 footprint jedec MS-026 TQFP 128 schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228

    schematic impulse sealer

    Abstract: leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481
    Text: Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF FG860 FG900 FG1156 schematic impulse sealer leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481

    PA40-44-P64-DP-QF

    Abstract: PA40-44-P64-DZ-QF 40P64DQ vdo rd3 VDO RD4 qfp 32 land pattern 40 pin zif connector zif 40 pin socket 35 pin zif connector 40 pin zif socket
    Text: PA40-44-P64-Dx-QF Data Sheet 40 pin DIP socket/44 pin QFP plug Supported Device/Footprints Adapter Dimensions The PA40-44-P64-Dx-QF adapter accepts 40 pin DIP devices and has a removable 44 pin QFP solder-down plug. This allows DIP devices, or emulators with DIP plugs, to be used during


    Original     		PDF PA40-44-P64-Dx-QF socket/44 PIC16C64 PIC16C64A, PIC16C65, PIC16C65A, PIC16C74, PIC16C74A, PIC16C77 PA40-44-P64-DP-QF PA40-44-P64-DZ-QF 40P64DQ vdo rd3 VDO RD4 qfp 32 land pattern 40 pin zif connector zif 40 pin socket 35 pin zif connector 40 pin zif socket

    JEDEC Package Code MS-026-AED

    Abstract: EFTEC-64 schematic impulse sealer footprint jedec MS-026 TQFP PQ-208 footprint jedec MS-026 TQFP 128 QFP PACKAGE thermal resistance die down EIA standards 481 ipc-sm-786A VQ44
    Text: • Packages and Thermal Characteristics  November 20, 1997 Version 2.0 10* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF

    schematic impulse sealer

    Abstract: qfp 64 0.4 mm pitch land pattern Rotron pk100 power supply XC4013E-PQ240 EFTEC-64 XC4010E-PQ208 MO-151-AAN-1 PK100 land pattern for TSOP 2 86 PIN
    Text: Packages and Thermal Characteristics: High-Reliability Products R 0 5 PK100 v1.0 June 15, 2000 Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or 0.100").


    Original     		PDF PK100 060ROM schematic impulse sealer qfp 64 0.4 mm pitch land pattern Rotron pk100 power supply XC4013E-PQ240 EFTEC-64 XC4010E-PQ208 MO-151-AAN-1 PK100 land pattern for TSOP 2 86 PIN

    SF-PLCC84-J-01

    Abstract: PL-PLCC68-S-01 SO8A SF-PLCC44-J-01 SF-PLCC28-J-01 SF-QFE128SD-K-01 PL-PLCC68-T-01 sf 128 transistor SF 127 PLCC32 through hole socket
    Text: Ironwood Electronics Surface Mount Package Emulation SF.1 Ironwood has developed the industry's widest range of interconnection adapters for testing and socketing of surface mount technology. We offer SMT bases and thru-hole adapters for BGA, PLCC, QFP, and SOIC packages.


    Original     		PDF SK-UGA12/48A-01 SK-MGA12/48A-01 SK-MGA10/48A-01 SK-MGA13/50B-01 SK-MGA12/56A-01 SK-MGA14/56A-01 SK-MGA12/56B-01 SF-PLCC84-J-01 PL-PLCC68-S-01 SO8A SF-PLCC44-J-01 SF-PLCC28-J-01 SF-QFE128SD-K-01 PL-PLCC68-T-01 sf 128 transistor SF 127 PLCC32 through hole socket

    DS51140

    Abstract: PIC32 PICC-18 XLT28QFN4 DS51298
    Text: Transition Socket Specification  2009 Microchip Technology Inc. DS51194R Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. •


    Original     		PDF DS51194R DS51194R-page DS51140 PIC32 PICC-18 XLT28QFN4 DS51298

    DS51140

    Abstract: DS51298 PIC32 PICC-18 44-pin plcc pcb mount footprint 44L PLCC socket XLT18SO-1
    Text: Transition Socket Specification  2010 Microchip Technology Inc. DS51194S Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. •


    Original     		PDF DS51194S DS51194S-page DS51140 DS51298 PIC32 PICC-18 44-pin plcc pcb mount footprint 44L PLCC socket XLT18SO-1

    QFN-64 footprint

    Abstract: No abstract text available
    Text: Transition Socket Specification 2008 Microchip Technology Inc. DS51194Q Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. •


    Original     		PDF DS51194Q o-3-572-9526 DS51194Q-page QFN-64 footprint

    PA-PGA181-02W

    Abstract: PA-SO42-S-01 actel 14100 BGA169C PA-PGA68-01 ax 6001 mp3 PA-QIP90-01 PA-PLCC84-02 intel 82310 PA-PGA301-01
    Text: Ironwood Electronics PA.1 Prototyping Adapters Ironwood has developed over one thousand prototyping adapter designs, supporting CSP, BGA, QFP, SOIC, PGA, PLCC, QIP, and DIP packages for most popular prototyping panels and PGA DUT interfaces. We also offer adapters for


    Original     		PDF 12X12mm. FR4/G10 PA-PGA181-02W PA-SO42-S-01 actel 14100 BGA169C PA-PGA68-01 ax 6001 mp3 PA-QIP90-01 PA-PLCC84-02 intel 82310 PA-PGA301-01