QFP PACKAGE DRAWING Search Results

CRM1076DJ

Abstract: CRM-1076DJ-G crm1076 SUMITOMO g600f LQFP-100 footprint ABLEBONd 84-1 Holt 3717p 100LQFP CRM*1076
Contextual Info: 44-Lead Quad Flat Pack QFP Footprint & Package Change Product Change Notice PCN1102 (v1.0) December 01, 2011 Overview This notice describes the footprint and package changes to the 44 Lead Quad Flat Pack (QFP) Package for all of Holt’s ARINC family of devices.

XC3000

Abstract: CB100
Contextual Info: Package Drawings Ceramic Brazed QFP Packages - CB100 XC3000 Version 10-44 November 13, 1997 (Version 1.2)

on823

Abstract: TigerJet Network oN-823 tigerjet
Contextual Info: TigerJet Network Application Note TigerJet 100 pin QFP Package Outline Modification The new package dimension for 100 pin QFP will have shorter pin outline. It will be changed from 4.8mm to 3.2mm. Figure 1 shows the detail drawing of the difference in new pin outline. The new 100 pin package will have smaller L and L1 value. Table

CRM-1076DJ-G

Abstract: CRM*1076 CRM-1076 SUMITOMO g600f CRM1076DJ sumitomo crm 1076dj ABLEBONd 84-1 sumitomo crm
Contextual Info: 52-Lead Quad Flat Pack QFP Package Change & Transfer Product Change Notice PCN1103 (v1.0) December 01, 2011 Overview This notice describes the package changes to the 52 Lead Quad Flat Pack (QFP) Package for all of Holt’s ARINC 429, MILSTD 1553, and LCD Display Driver family of devices.

XC4000

Abstract: CB100 CB164
Contextual Info: Package Drawings November 13, 1997 Version 1.2 10 Package Drawings Ceramic Brazed QFP Packages - CB100, CB164, CB196 (XC4000 Version) 10-46 November 13, 1997 (Version 1.2)

lQFP256

Abstract: TEQFP208 QFP PACKAGE thermal resistance SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY BGA and QFP Package LQFP-256
Contextual Info: Technical Analysis Low-Cost Packaging Technology Using QFP Low-Cost Packaging Technology Using QFP The combination of bus bar technology and TEQFP technology is currently receiving attention in the development of a semiconductor package that realizes function

CA-QFE144SC-L-Z-01

Abstract: SF-QFE144SC-L-01 0836
Contextual Info: 1 Material: 0.0625" ± 0.007" Fr4/G10 Pins: shell material- Brass; finish2 10µ" Gold over 50µ" Nickel min. . 1.75" 2.05" 1.023" 1.148" Assembled 1 SF-QFE144SC-L-01 2 QFP SM emulator foot 0.5mm pitch 0.836" Description: Package converter Carrier adaptor; 2 piece, 144 position (0.5 mm. pitch) QFP ZIF socket adaptor with female connector to plug onto QFP

Contextual Info: QFP, PQFP, & LCC IC51/IC53 Series FEATURES • Any kind of SMT type or IC package type SOP & QFP Available. • High reliability, durability and temperature range. • Custom made also available for high pin count and fine-pitch packages. CHARACTERISTICS

SF-QFE44SH-L-01

Contextual Info: Emulates QFP package: 10.0mm body 12.6mm Tip to Tip 11.86mm [0.467"] sqr. 0.80mm typ. [0.031"] QFP Pin 1 Pad Detail 0.89mm [0.035"] 10.08mm [0.397"] 0.51mm [0.020"] Ø 0.45mm dia. [Ø 0.0177"] Top View 0.46mm [0.018"] 1.27mm typ. [0.050"] A compatible target board

CL-QFE44SE-T-01

Abstract: 08mm
Contextual Info: 28mm 12mm 12mm 26mm 8mm 10mm 0.8mm typ. 10mm 0.15mm 1.07mm min to 3.2mm (max) 0.8mm Package Specification Top View 20.47mm 8.85mm 1.5mm Pins compress 1.0 mm to make contact 3.35mm 8.94mm 12mm 13.5mm 0.85mm Side View Description: Probe Board (PB), QFP 44 position 0.8mm QFP to headers.

QFP Package 128 lead .5mm

Abstract: QFP 128 lead .5mm BGA reflow guide SI-SX72-ACQ256SFG484 A54SX72A-CQ256 BGA 256 PACKAGE thermal resistance A54SX72A-FG484
Contextual Info: 3.16mm [0.124"] 3.54mm [0.139"] 1 39.3mm [1.547"] 41.9mm [1.650"] 32.23mm [1.269"] 41.9mm [1.650"] 27mm 15.67mm [0.617"] DETAIL A Lead coplanarity 0.005" max. Side View 0.5mm Description: BGA to QFP package converter 484 position BGA surface mount GHz BGA socket 1.00mm centers, 26X26 array, 27X27mm body to 256 QFP, 0.5mm

100405-1

Abstract: TQPACK100SD Eletech Electronics AXS4643R195C AXS4803M19 IC61-0644-052 IC61-0644-053 IC61-080-079 IC61-080-081 IC61-0804-046
Contextual Info: Appendix A Reference Dimensional Drawing for Common 64-pin 0.8mm-pitch QFP Foot Pattern Package type name Manufacturer's name and package classification 64P6N-A Renesas MCU package type name IC61-0644-052 IC61-0644-053 Yamaichi Electronics Co., Ltd. IC socket type name

Contextual Info: M3T-DUMMY64 Dummy IC for 64-pin 0.8mm-pitch QFP 64P6N-A Dimensions Function This accessory tool connects the probe of an emulation pod and the target, or an MCU and the target. Its dimensions are the same as those of the MCU for the 64-pin 0.8mm-pitch QFP (64P6N-A) package.

80P6NA

Abstract: pin diagram of 08 80p6n-a
Contextual Info: M3T-DUMMY80 Dummy IC for 80-pin 0.8mm-pitch QFP 80P6N-A Dimensions Function This accessory tool connects the probe of an emulation pod and the target, or an MCU and the target. Its dimensions are the same as those of MCU for the 80-pin 0.8mm-pitch QFP (80P6N-A) package.

C4228

Contextual Info: 7.15mm [0.281"] A1 7.15mm [0.281"] 26X26X5 + 8X8 ARRAY 25mm 39.3mm [0.984"] [1.547"] 41.9mm [1.650"] 1mm [0.039"] Top View 41.9mm [1.650"] DETAIL A Lead coplanarity 0.005" max. 2.78mm [0.109"] 0.5mm Side View Description: BGA to QFP package converter 484 position BGA surface mount pads to 256 QFP, 0.5mm gull-wing leads. Pin assignment as per Actel requirements.

QFP Package 80 lead

Abstract: C4002 256-QFP 256QFP
Contextual Info: 7.15mm [0.281"] A1 7.15mm [0.281"] 26X26X5 + 8X8 ARRAY 25mm 39.3mm [0.984"] [1.547"] 41.9mm [1.650"] 1mm [0.039"] Top View 41.9mm [1.650"] DETAIL A Lead coplanarity 0.005" max. 2.78mm [0.109"] 0.5mm Side View Description: BGA to QFP package converter 484 position BGA surface mount pads to 256 QFP, 0.5mm gull-wing leads. Pin assignment as per Actel requirements.

Contextual Info: SEC pPD72002 Ordering Information 44-Pln P lastic QFP Package Part Number fiPD72002CZ-11 40-pln plastic DIP pPD72002GB-113B4 44-pln plastic QFP jttPD72002LM-11 44-pin plastic leaded chip carrier PLCC Q I k | < l i ic/> 2 il t l b lE lg z lo l o ld l o O is 13 IS la. la.

pst 39

Abstract: XCS A MCF5307 PP10 PP12 PP15
Contextual Info: REVISION NO: 1.0 REVISION DATE: 6/18/98 PAGES AFFECTED: PAGES 19-11 THROUGH 19-13 ADDED CASE DRAWINGS SECTION 19 MECHANICAL DATA 19.1 PACKAGE The MCF5307 package is a 208-pin, thermally enhanced QFP. Thermal characteristics are not yet included in this documentation.

Contextual Info: NEC /¿PD70236A 16. PACKAGE DRAWINGS 120 PIN PLASTIC QFP D28 0100010001020123020000010001230100 90 61 91 01000100010001008901000102010201 60 detail of lead end 31 120 30 1 ! ! !?! @,"!"!"!P h D\ N PI 20GD-80-5BB-3 MOTE ITEM MILLIMETERS INCHES 32.0±0.4 1.260±0.016

4572 smd 8pin

Abstract: 100 PIN "PGA" ALTERA DIMENSION CMGA17-P100E 02D-00194 altera 24pin dip drawing
Contextual Info: Altera Device Package Outlines March 1995, ver. 5 In tro d u c tio n Data Sheet This data sheet provides package outlines for all Altera devices. Package outlines are listed here in ascending pin count order. Table 1 summarizes the maximum lead coplanarity for Altera J-lead and QFP packages:

10X10

Abstract: SF-QFE100SC-L-01
Contextual Info: 1.91mm [0.075"] 1.91mm [0.075"] 15.24mm [0.600"] 13.97mm [0.550"] 0.50mm typ. 1.27mm typ. [0.050"] 13.97mm [0.550"] 15.24mm [0.600"] Top View 0.46mm dia. typ. [0.018"] 2 6.35mm [0.250"] 1 Recommended target board land dimensions QFP Package Emulated not to scale

PCI1510ZGU

Abstract: 82365SL PCI1510 PCI1510GGU PCI1510PGE PCI1510PGEG4 TPS2211A QFP Package 144 lead
Contextual Info: PCI1510 GGU/GVF PGE/ZGU/ZVF www.ti.com SLLA229 – JUNE 2006 PC Card Controllers FEATURES • • • • • • • • A 144-terminal low-profile QFP PGE , 144-terminal MicroStar BGA ball-grid array (GGU/ZGU) package, or a 209-terminal PBGA (GVF/ZVF) package

82365SL

Abstract: PCI1510 PCI1510GGU PCI1510GVF PCI1510PGE PCI1510PGEG4 PCI1510ZGU TPS2211A MTQF017A
Contextual Info: PCI1510 GGU/GVF PGE/ZGU/ZVF www.ti.com SLLA229 – JUNE 2006 PC Card Controllers FEATURES • • • • • • • • A 144-terminal low-profile QFP PGE , 144-terminal MicroStar BGA ball-grid array (GGU/ZGU) package, or a 209-terminal PBGA (GVF/ZVF) package

SLLA229

Contextual Info: PCI1510 GGU/GVF PGE/ZGU/ZVF www.ti.com SLLA229 – JUNE 2006 PC Card Controllers FEATURES • • • • • • • • A 144-terminal low-profile QFP PGE , 144-terminal MicroStar BGA ball-grid array (GGU/ZGU) package, or a 209-terminal PBGA (GVF/ZVF) package