QFP PACKAGE WEIGHT Search Results

Contextual Info: QUAD FLAT PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN PLASTIC FPT-208P-M04 208-pin plastic QFP FPT-208P-M04 208-pin plastic QFP (FPT-208P-M04) Lead pitch 0.50 mm Package width x package length 28.0 × 28.0 mm Lead shape Gullwing Sealing method Plastic mold

FPT-256P-M09

Contextual Info: QUAD FLAT PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC FPT-256P-M09 EIAJ code : P-FQFP256-28 x 28-0.40 256-pin plastic QFP FPT-256P-M09 256-pin plastic QFP (FPT-256P-M09) Lead pitch 0.40 mm Package width × package length 28.0 × 28.0 mm Lead shape

UEI 15 SP 020

Abstract: 691 OHD 3 - 115 M VMUX to3a SAA7140A SAA7140B new 60 ypf UEI 20 SP 010
Contextual Info: Philips Semiconductors Objective specification High Performance Scaler HPS CONTENTS 1 FEATURES SAA7140A; SAA7140B 14 PACKAGE OUTLINE 15 SOLDERING Introduction Reflow soldering Wave soldering QFP SO Method (QFP and SO) Repairing soldered joints 3 ORDERING INFORMATION

UEI 20 SP 010

Abstract: bord SAA7140A SAA7140B FEY G4 LQFP128 VR029 SAA7196 t3044 UL705
Contextual Info: Philips Semiconductors Objective specification High Performance Scaler HPS CONTENTS SAA7140A; SAA7140B 14 PACKAGE OUTLINE 15 SOLDERING Introduction Reflow soldering Wave soldering QFP SO Method (QFP and SO) Repairing soldered joints 1 FEATURES 2 GENERAL DESCRIPTION

T02I

Abstract: HP 1121 G1 SAA7140A SAA7140B TT 2222 Horizontal Output voltage horizontal prescaling LQFP128 SAA7140 VR029 VR07 135
Contextual Info: Philips Semiconductors Objective specification SAA 7140 A; SAA 7140 B High Performance Scaler HPS CONTENTS PACKAGE OUTLINE 15 SOLDERING Introduction Reflow soldering Wave soldering QFP SO Method (QFP and SO) Repairing soldered joints 1 FEATURES 2 GENERAL DESCRIPTION

100P6S-A

Abstract: LQFP100-P-1414-0 LQFP128-P-1420-0 QFP100-P-1420-0 128P6Q-A
Contextual Info: Renesas microcomputers M16C / 62P Group Package Dimensions SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Package Dimensions MMP 100P6S-A EIAJ Package Code QFP100-P-1420-0.65 Plastic 100pin 14✕20mm body QFP Weight g 1.58 Lead Material Alloy 42 MD e JEDEC Code –

100P6S-A

Abstract: QFP100-P-1420-0
Contextual Info: Under development This document is under development and its contents are subject to change. M16C/6N5 Group Package Dimension Package Dimension 100P6S-A MMP EIAJ Package Code QFP100-P-1420-0.65 Plastic 100pin 14✕20mm body QFP Weight g 1.58 Lead Material

100P6S-A

Abstract: QFP100-P-1420-0
Contextual Info: Under development This document is under development and its contents are subject to change. M16C/6N4 Group Package Dimension Package Dimension 100P6S-A MMP EIAJ Package Code QFP100-P-1420-0.65 Plastic 100pin 14✕20mm body QFP Weight g 1.58 Lead Material

3525A

Abstract: 136-pin LA-3525A-1 QFP package weight la-3525a
Contextual Info: UNIT : mm 335±1.0 59.5±0.5 216±0.5 24±0.5 27±0.5 54±0.1 180±1.0 A' A 126±0.5 42±0.1 PPE 38 22±0.5 HEAT PROOF NEC LA-3525A-1 38 SECTION A-A' 38 5.8 4.5 8.8 27.3 Applied Package Quantity pcs 120-Pin Plastic QFP (3.7mm thick) 136-Pin Plastic QFP (3.7mm thick)

weight

Abstract: PLCC weight
Contextual Info: Package Outlines - Integrated Circuits Dimensions in mm 68-Pin PLCC Package Weight approx. 4.8 g 61 W rnjiJTi 10 -e 26 JUUUUUULTT 27 -2 5 * I 44-Pin PLCC Package Weight approx. 2.5 g 80-Pin QFP Plastic Package Weight approx. 1.61 g - 2 3 x 0 .8 = 18.4- 65 EE

QFP64-P-1414-0

Abstract: SDIP64-P-750-1
Contextual Info: APPENDIX 3.6 Package outline 3.6 Package outline 64P6N-A Plastic 64pin 14✕14mm body QFP EIAJ Package Code QFP64-P-1414-0.80 Weight g 1.11 Lead Material Alloy 42 MD e JEDEC Code – HD 49 b2 64 ME D 1 48 I2 HE E Recommended Mount Pad Symbol A A1 A2 b c D

QFP64-P-1414-0

Abstract: SDIP64-P-750-1 3804 f
Contextual Info: APPENDIX 3.6 Package outline 3.6 Package outline 64P6N-A Plastic 64pin 14✕14mm body QFP EIAJ Package Code QFP64-P-1414-0.80 Weight g 1.11 Lead Material Alloy 42 MD e JEDEC Code – HD 64 b2 ME D 49 1 I2 48 Recommended Mount Pad HE E Symbol 33 16 A 32 L1

MO-235 FOOTPRINT

Abstract: die bond MO-235 SC-100 JEDEC 784-pin QFP PACKAGE thermal resistance LFPAK footprint mo204 ED-7311-15 fcBGA PACKAGE thermal resistance jc
Contextual Info: Products LQFP Low Profile Quad Flat Package High reliability, Standard Lead type Packages with rich line-ups • High pin-count, ideal for high-functionality, high-I/Ocount LSIs • Small size, allowing high-density mounting • Thin QFP LQFP with package mounting height of

PCI1510ZGU

Abstract: 82365SL PCI1510 PCI1510GGU PCI1510PGE PCI1510PGEG4 TPS2211A QFP Package 144 lead
Contextual Info: PCI1510 GGU/GVF PGE/ZGU/ZVF www.ti.com SLLA229 – JUNE 2006 PC Card Controllers FEATURES • • • • • • • • A 144-terminal low-profile QFP PGE , 144-terminal MicroStar BGA ball-grid array (GGU/ZGU) package, or a 209-terminal PBGA (GVF/ZVF) package

SLLA229

Contextual Info: PCI1510 GGU/GVF PGE/ZGU/ZVF www.ti.com SLLA229 – JUNE 2006 PC Card Controllers FEATURES • • • • • • • • A 144-terminal low-profile QFP PGE , 144-terminal MicroStar BGA ball-grid array (GGU/ZGU) package, or a 209-terminal PBGA (GVF/ZVF) package

144-TERMINAL

Abstract: 82365SL PCI1510 PCI1510GGU PCI1510PGE PCI1510PGEG4 PCI1510ZGU TPS2211A
Contextual Info: PCI1510 GGU/GVF PGE/ZGU/ZVF www.ti.com SLLA229 – JUNE 2006 PC Card Controllers FEATURES • • • • • • • • A 144-terminal low-profile QFP PGE , 144-terminal MicroStar BGA ball-grid array (GGU/ZGU) package, or a 209-terminal PBGA (GVF/ZVF) package

MD 202

Abstract: 100P6S-A LQFP100-P-1414-0 QFP100-P-1420-0 MEB2 JEDEC Code
Contextual Info: Mitsubishi microcomputers M16C / 62 Group SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER MMP 100P6S-A EIAJ Package Code QFP100-P-1420-0.65 Plastic 100pin 14✕20mm body QFP Weight g 1.58 Lead Material Alloy 42 MD e JEDEC Code – 81 1 b2 100 ME HD D 80 I2 Recommended Mount Pad

18mm

Abstract: JEDEC Code
Contextual Info: 72S6 Metal seal 72pin 13.2✕18mm body QFP EIAJ Package Code – JEDEC Code – Weight g 18.2±0.2 13.2±0.2 58 58 57 21 37 18.0±0.2 1 22 +0.05 0.127 –0.02 0.8±0.2 36 0.4TYP 72 57 1 37 21 23.0±0.2 72 36 22 3.07±0.5 Mar.’98

315HZ

Abstract: Teac head Dolby NR LCT-7001 CXA2559Q CXA2560Q CXA2561Q F120 MTT150 A-bex TCC-130
Contextual Info: CXA2559Q Playback Equalizer Amplifier with Music Sensor Description The CXA2559Q is an IC designed for use in car stereo cassette decks. Functions include playback equalizer amplifier and music sensor into a single chip. Features • Few external parts • Small package 40-pin QFP

Contextual Info: 80S6 Metal seal 80pin 14✕20mm body QFP EIAJ Package Code – Weight g JEDEC Code – 19.2±0.2 14±0.2 65 65 24 41 +0.05 0.127 –0.02 25 0.8±0.2 40 0.38TYP 64 1 41 24 0.75TYP 64 20±0.2 1 80 25.2±0.2 80 40 25 3.17±0.5 Mar.’98

Contextual Info: TA1360AFG TOSHIBA Bipolar Linear Integrated Circuit Silicon Monolithic TA1360AFG YCbCr/YPbPr Signal and Sync Processor for Digital TV, Progressive Scan TV and Double Scan TV The TA1360AFG integrates an analog component signal YCbCr/YPbPr processor and sync processor in a 80-pin QFP plastic package. The IC is

QFP208-P-2828-0

Contextual Info: 208P6Y-E Plastic 208pin 28✕28mm body QFP EIAJ Package Code QFP208-P-2828-0.50 Weight g 5.48 Lead Material Cu Alloy MD e JEDEC Code – b2 208 157 1 ME HD D 156 I2 Recommended Mount Pad 52 HE E Symbol 105 53 104 A L1 F b A1 c A2 e x M y L Detail F A A1 A2

QFP208-P-2828-0

Abstract: 208P6G-A
Contextual Info: 208P6G-A Plastic 208pin 28✕28mm body QFP EIAJ Package Code QFP208-P-2828-0.50 Weight g 4.61 Lead Material Alloy 42 MD e JEDEC Code – HD 208 ME D b2 157 1 156 I2 52 HE E Recommended Mount Pad Symbol 105 53 104 A L1 F A1 c A2 e b y L Detail F A A1 A2 b

QFP160-P-2424-0

Abstract: QFP160
Contextual Info: 160P6E-A Plastic 160pin 24✕24mm body QFP Weight g 3.39 JEDEC Code – Lead Material Alloy 42 MD e EIAJ Package Code QFP160-P-2424-0.50 160 b2 ME HD D 121 1 120 I2 HE E Recommended Mount Pad Symbol 81 40 41 80 A L1 F A1 c A2 e b y L Detail F A A1 A2 b c