QFP-208 FUJITSU Search Results

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC FPT-208C-A01 208-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Metal seal FPT-208C-A01 208-pin ceramic QFP (FPT-208C-A01) 31.64±0.30SQ (1.246±.012) 28.00±0.30SQ

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC To Top / Package Lineup / Package Index FPT-208C-A01 208-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Metal seal FPT-208C-A01 208-pin ceramic QFP (FPT-208C-A01)

Contextual Info: QUAD FLAT PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN PLASTIC FPT-208P-M04 208-pin plastic QFP FPT-208P-M04 208-pin plastic QFP (FPT-208P-M04) Lead pitch 0.50 mm Package width x package length 28.0 × 28.0 mm Lead shape Gullwing Sealing method Plastic mold

FPT-208C-C02

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC FPT-208C-C02 208-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Alumina FPT-208C-C02 208-pin ceramic QFP

208-PIN

Contextual Info: QUAD FLAT L-LEADED PACKAGE 208 PIN CERAMIC FPT-208C-A01 208-pin ceramic QFP Lead pitch 0.50mm Lead shape Gullwing Sealing method Metal seal FPT-208C-A01 208-pin ceramic QFP (FPT-208C-A01) 31.64±0.30SQ (1.246±.012) 28.00±0.30SQ (1.102±.012) 25.50(1.004)

FPT-208C-C02

Contextual Info: QUAD FLAT L-LEADED PACKAGE 208 PIN CERAMIC FPT-208C-C02 208-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Alumina FPT-208C-C02 208-pin ceramic QFP (FPT-208C-C02)

nitride

Abstract: Aluminum nitride QFP method 208
Contextual Info: QUAD FLAT L-LEADED PACKAGE 208 PIN CERAMIC FPT-208C-C03 208-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Aluminum nitride FPT-208C-C03 208-pin ceramic QFP (FPT-208C-C03)

nitride

Abstract: Aluminum nitride QFP C1995
Contextual Info: QUAD FLAT L-LEADED PACKAGE 208 PIN CERAMIC FPT-208C-C04 Lead pitch 0.5 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.5 mm Base ceramic material Aluminum nitride 208-pin ceramic QFP FPT-208C-C04 208-pin ceramic QFP (FPT-208C-C04)

QFP20

Abstract: QFP208-P-2828-1
Contextual Info: QUAD FLAT L-LEADED PACKAGE 208 PIN PLASTIC FPT-208P-M01 EIAJ code : ∗QFP208-P-2828-1 208-pin plastic QFP Lead pitch 0.50mm Package width x package length 28 × 28mm Lead shape Gullwing Sealing method Plastic mold FPT-208P-M01 208-pin plastic QFP (FPT-208P-M01)

208-PIN

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC To Top / Package Lineup / Package Index FPT-208C-C04 208-pin ceramic QFP Lead pitch 0.5 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.5 mm Base ceramic

FPT-208C-C02

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC To Top / Package Lineup / Package Index FPT-208C-C02 208-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC To Top / Package Lineup / Package Index FPT-208C-C03 208-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC FPT-208C-C04 208-pin ceramic QFP Lead pitch 0.5 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.5 mm Base ceramic material Alumina nitride FPT-208C-C04

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN PLASTIC FPT-208P-M04 208-pin plastic QFP Lead pitch 0.50 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method Plastic mold Thermal resistance Low thermal resistance type

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC FPT-208C-C03 208-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Alumina nitride FPT-208C-C03

QFP208-P-2828-1

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN PLASTIC To Top / Package Lineup / Package Index FPT-208P-M01 EIAJ code :∗QFP208-P-2828-1 208-pin plastic QFP Lead pitch 0.50 mm Package width x package length 28 × 28 mm Lead shape Gullwing

QFP208-P-2828-2

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN PLASTIC To Top / Package Lineup / Package Index FPT-208P-M02 EIAJ code :∗QFP208-P-2828-2 208-pin plastic QFP Lead pitch 0.50 mm Package width x package length 28 × 28 mm Lead shape Gullwing

QFP PACKAGE thermal resistance

Abstract: 208-PIN
Contextual Info: QUAD FLAT L-LEADED PACKAGE 208 PIN PLASTIC FPT-208P-M04 208-pin plastic QFP Lead pitch 0.50mm Package width x package length 28 × 28mm Lead shape Gullwing Sealing method Plastic mold Thermal resistance Low thermal resistance type available FPT-208P-M04

QFP208-P-2828-1

Abstract: FPT-208P-M01
Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN PLASTIC FPT-208P-M01 EIAJ code :∗QFP208-P-2828-1 208-pin plastic QFP Lead pitch 0.50 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method Plastic mold FPT-208P-M01

QFP208-P-2828-2

Contextual Info: QUAD FLAT L-LEADED PACKAGE 208 PIN PLASTIC FPT-208P-M02 EIAJ code : ∗QFP208-P-2828-2 208-pin plastic QFP Lead pitch 0.50mm Package width x package length 28 × 28mm Lead shape Gullwing Sealing method Plastic mold Features Heat dissipation panel inserted

pin diagrams of basic gates

Abstract: BGA and QFP Package Nand gate Crystal Oscillator 272000 astro tool HQFP-208 MCM NAND qcm 5 sim 980 CE61
Contextual Info: To Top / Lineup / Index Product Line-up FUJITSU Semicustom Products Semicustom Products Gate arrays Sea-of-Gate CMOS Macro-embedded type cell arrays CMOS Standard cell CMOS Semicustom microcontrollers QCM series* ASTRO NT Bi-CMOS SIM/PLL SERIES Bi-CMOS SAW PLL

VL82C486-FC2

Abstract: CXD1160AQ VL82C486 VL82C315 XC3042-100PQ100C XC3020-70-PQ100C NCR53C700 NCR53C720 xc3042-100pq CXD1160
Contextual Info: Issued March 1999 232-5109 Data Pack H Surface mount test clips Manufacturers device number to RS stock number cross reference Data Sheet N.B. Some devices have the same basic type numbers but are available in several package styles. Before selecting a test clip ensure that the package type matches that of the device to be tested.

CXD1160aq

Abstract: VL82C486-FC2 VL82C486FC NCR53C720 vl82c486 cxd1160 74HC125 EPM7128 d75304gf A1280
Contextual Info: Issued March 1997 232-5109 Data Pack H Surface mount test clips Manufacturers device number to RS stock number cross reference Data Sheet N.B. Some devices have the same basic type numbers but are available in several package styles. Before selecting a test clip ensure that the package type matches that of the device to be tested.

VL82C486-FC2

Abstract: NCR53C720 XCS3201FN SN74ACT8818 NCR53C700 cxd1160 VL82C316 CL-GD6440 xc3042-100pq100c CXD1160AQ
Contextual Info: Issued November 1994 018-994 Data Pack H Surface mount test clips Manufacturers device number to RS stock number cross reference Data Sheet N.B. Some devices have the same basic type numbers but are available in several package styles. Before selecting a test clip ensure that the package type matches that of the device to be tested.