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54122-407200850LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch |
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10127720-085LF
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Amphenol Communications Solutions
|
Minitek® Pwr 3.0, Dual Row, Right Angle Through Hole Header, 8 Positions, 160u\\ Matte Tin over 50u\\ Nickel plating, Non GW Compatible LCP, With Pegs, Tray Packing. |
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59112-F32-20-085
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Amphenol Communications Solutions
|
Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 40 Positions. |
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10127720-085GLF
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Amphenol Communications Solutions
|
Minitek® Pwr 3.0, Dual Row, Right Angle Through Hole Header, 8 Positions, 160u\\ Matte Tin over 50u\\ Nickel plating, GW Compatible LCP, With Pegs, Tray Packing. |
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10127720-085NLF
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Amphenol Communications Solutions
|
Minitek® Pwr 3.0, Dual Row, Right Angle Through Hole Header, 8 Positions, 160u\\ Matte Tin over 50u\\ Nickel plating, Non GW Compatible LCP, No pegs, Tray Packing. |
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