RDA Q20 Search Results

Contextual Info: scsi & ecl termination networks EU features • • • • • • Thin film construction Surface mount package Stable resistor density High resistor density Application specific design Products with lead-free terminations meet EU RoHS and China RoHS requirements

MIL-R-55342

Abstract: RDA Q20
Contextual Info: resistors RD X scsi & ecl termination networks EU features • • • • • • Thin film construction Surface mount package Stable resistor density High resistor density Application specific design Products with lead-free terminations meet EU RoHS and China RoHS requirements

on 408/10 transistor

Abstract: RDA Q20 MIL-R-55342
Contextual Info: RD X resistors scsi & ecl termination networks features • • • • • • Thin film construction Surface mount package Stable resistor density High resistor density Application specific design Products with lead-free terminations meet RoHS requirements

Contextual Info: scsi & ecl termination networks EU features • • • • • • Thin film construction Surface mount package Stable resistor density High resistor density Application specific design Products with lead-free terminations meet EU RoHS and China RoHS requirements

W16 sot 23

Abstract: 471J MIL-R-55342 511j RDA Q20
Contextual Info: dual terminator network KOA’s dual terminator network also called SCSI terminator provides proper termination of SCSI bus lines. The resistance values match the characteristic impedance of the transmission lines and help in eliminating transmission line

RDA Q20

Contextual Info: dual terminator network KOA’s dual terminator network also called SCSI terminator provides proper termination of SCSI bus lines. The resistance values match the characteristic impedance of the transmission lines and help in eliminating transmission line effects. These perfectly matched resistor pairs, Thevenin

RDA Q20

Abstract: 221J331J marking RDA 2-2-1J rdaq20
Contextual Info: Dual Terminator Network Applications D • SCSI termination ■ SCSI host adapter cards ■ All peripheral interface cards, such as printers, CD-ROMs and drives ■ Thevenin termination ■ ECL termination Electrical Characteristics Resistance Range. . . . . . 10Ω ~ 1MΩ

resistor 220

Abstract: MIL-R-55342
Contextual Info: 1733 Reader's Spreads pg1-203:document 1/27/09 4:07 PM Page 82 RD X resistors scsi & ecl termination networks EU features • • • • • • Thin film construction Surface mount package Stable resistor density High resistor density Application specific design

Contextual Info: RD X resistors scsi & ecl termination networks EU features • • • • • • Thin film construction Surface mount package Stable resistor density High resistor density Application specific design Products with lead-free terminations meet EU RoHS and China RoHS requirements

RDA Q20

Abstract: RDAQ20 marking 221j 221j
Contextual Info: Dual Terminator Network Applications D • SCSI termination ■ SCSI host adapter cards ■ All peripheral interface cards, such as printers, CD-ROMs and drives ■ Thevenin termination ■ ECL termination Electrical Characteristics Resistance Range. . . . . . 10Ω ~ 1MΩ

rnx Q24

Contextual Info: RB X , RD(X), RT(X), RNX resistors integrated passive components EU features • Thin film (metal film) resistor array on silicon wafer • Excellent resistance matching, TCR tracking and stabilities • Custom circuits are available with flexible layout (Different

Contextual Info: Advance Information Synch. MROM KM23SV64205T 2Mx32 Synchronous MASKROM FEATURES GENERAL DESCRIPTION • JEDEC standard 3.3V power supply • LVTTL compatible with multiplexed address • Address: Row address: RA0 ~ RA12 Column address: CA0 ~ CA7 x32 : CA0 ~ CA8 (x16)

Contextual Info: Advance Information Synch. MROM K3S7V2000M-TC 2Mx32 Synchronous MASKROM FEATURES GENERAL DESCRIPTION • JEDEC standard 3.3V power supply • LVTTL compatible with multiplexed address • Address: Row address: RA0 ~ RA12 Column address: CA0 ~ CA7 x32 : CA0 ~ CA8 (x16)

Contextual Info: RB X , RD(X), RT(X), RNX resistors integrated passive components EU features • Thin film (metal film) resistor array on silicon wafer • Excellent resistance matching, TCR tracking and stabilities • Custom circuits are available with flexible layout (Different

KM23SV64205T-10

Abstract: KM23SV64205T-12 KM23SV64205T-20 RA12
Contextual Info: Advance Information Synch. MROM KM23SV64205T 2Mx32 Synchronous MASKROM FEATURES GENERAL DESCRIPTION • JEDEC standard 3.3V power supply • LVTTL compatible with multiplexed address • Address: Row address: RA0 ~ RA12 Column address: CA0 ~ CA7 x32 : CA0 ~ CA8 (x16)

K3S7V2000M-TC

Abstract: K3S7V2000M-TC10 K3S7V2000M-TC12 K3S7V2000M-TC15 K3S7V2000M-TC20 K3S7V2000M-TC30 RA12
Contextual Info: K3S7V2000M-TC Synch. MROM 64M-Bit 4Mx16 /2Mx32 Synchronous MASKROM FEATURES GENERAL DESCRIPTION • JEDEC standard 3.3V power supply • LVTTL compatible with multiplexed address • Address: Row address: RA0 ~ RA12 Column address: CA0 ~ CA7 (x32): CA0 ~ CA8 (x16)

DNA 1002

Abstract: rnx w16 dn5 marking packaging resistor MARKING W16 SOT23 rnx Q24 DN6 marking diode
Contextual Info: NETWORKS TECHNOLOGY OF TOMORROW RESISTORS / CAPACITORS / DIODES 3 2 THIN FILM ON SILICON TFOS INTEGRATED PASSIVE COMPONENTS KPC STRUCTURE 1 1 2 3 4 5 6 7 Die pad Silicon substrate Circuit Bonding pad Lead Mold resin Gold wire bonding 6 5 NETWORKS (PASSIVE COMPONENTS)

Contextual Info: NETWORKS KOA´S INTEGRATED PASSIVE COMPONENTS 3 THIN FILM ON SILICON TFOS KPC STRUCTURE 2 1 1 2 3 4 5 6 7 Die pad Silicon substrate Circuit Bonding pad Lead Mold resin Gold wire bonding 6 4 IDENTIFICATION Specifications given herein may be changed at any time without prior notice.

Contextual Info: KM23SV32205T Synch. MROM 1M x32 Synchronous MASKROM FEATURES GENERAL DESCRIPTION • JEDEC standard 3.3V power supply • LVTTL compatible with multiplexed address • Switchable organization 2,097,152 x 16 word mode / 1,048,576 x 32(double word mode) • All inputs are sampled at the rising edge of the system clock

AR19

Abstract: KM23SV32205T-15 KM23SV32205T-20 KM23SV32205T-30 RA12
Contextual Info: KM23SV32205T Synch. MROM 1M x32 Synchronous MASKROM FEATURES GENERAL DESCRIPTION • JEDEC standard 3.3V power supply • LVTTL compatible with multiplexed address • Switchable organization 2,097,152 x 16 word mode / 1,048,576 x 32(double word mode) • All inputs are sampled at the rising edge of the system clock

KM23SV32205T-15

Abstract: KM23SV32205T-20 KM23SV32205T-30 RA12
Contextual Info: Preliminary Synch. MROM KM23SV32205T 1M x32 Synchronous MASKROM FEATURES GENERAL DESCRIPTION • JEDEC standard 3.3V power supply • LVTTL compatible with multiplexed address • Switchable organization 2,097,152 x 16 word mode / 1,048,576 x 32(double word mode)

AR19

Abstract: K3S6V2000M-TC15 RA12
Contextual Info: K3S6V2000M-TC Synch. MROM 1M x32 Synchronous MASKROM FEATURES GENERAL DESCRIPTION • JEDEC standard 3.3V power supply • LVTTL compatible with multiplexed address • Switchable organization 2,097,152 x 16 word mode / 1,048,576 x 32(double word mode) • All inputs are sampled at the rising edge of the system clock

rnx w16

Abstract: 471j CAPACITOR w16 sot23 511j CAPACITOR KPC T16 12w SOT23-3 appendix T16 KOA KPC appendix KOA KPC T16
Contextual Info: 抵抗器 Resistors R/C NETWORKS KPC 表面実装形薄膜抵抗/コンデンサネットワーク KOA’s Integrated Passive Components •構造図 Construction ② ① ③ ① シリコンウェハ Si wafer ② ボンディングワイヤ Bonding wire

DNA 1002

Abstract: TE-5001 n014 jis c 5201-1 511j MARKING T20 SOT23 471j CAPACITOR 470M 471J diodes tvb
Contextual Info: NETWORKS Resistors / capacitors / diodes 3 2 THIN FILM ON SILICON TFOS INTEGRATED PASSIVE COMPONENTS KPC 1 STRUCTURE 1 2 3 4 5 6 7 Die pad Silicon substrate Circuit Bonding pad Lead Mold resin Gold wire bonding 6 4 IDENTIFICATION TYPE COATING COLOR MARKING