RE9000 Search Results

Contextual Info: SERIES 9000 EQUIPMENT Aeronautical and Maritime Radiocommunication Systems VHF DATA RADIO COMMUNICATION SYSTEMS EM9000 | RE9000 „„EM9000 TRANSMITTER „„ Wide band 118-136.975 MHz „„ Output power up to 50 W for AM and D8PSK „„ Compliant New Mask for D8PSK,

Contextual Info: Multiadapters RE900-05 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.80 mm (30 mil) - Pins: 40, 44 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of

Contextual Info: Multiadapters RE900-02 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.50 mm (19.7 mil) - Pins: 28, 32, 40, 48 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of

Contextual Info: Multiadapters RE900-04 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.65 mm (26.5 mil) - Pins: 16, 24, 28, 36 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of

Contextual Info: Adapter TSOP I RE900-04 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.65 mm (26.5 mil) - Pins: 16, 24, 28, 36 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of

Contextual Info: Multiadapters RE900-03 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.50 mm (19.7 mil) - Pins: 20, 24 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of

bajo

Contextual Info: Multiadaptador SMD-TSOP I/II RE900 - epóxido FR4 1,50 mm, por dos lados 35 µm CU pth - Lado de soldadura y de componetes con una superficie quimica de níquel/oro (Ni/Au) y una mascára de inhibidora dela soldadura - distancia entre las zonas terminales:

Contextual Info: Adapter TSOP II RE900-06 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 1.27 mm (50 mil) - Pins: 20, 24, 26, 28, 32 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of

gerber

Contextual Info: Adapter TSOP II RE900-05 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.80 mm (30 mil) - Pins: 40, 44 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of

enamelled copper wire swg table

Abstract: RS-274-D for all smd components F585-34 BS4520 BS4584 PART 3 MELF 3514 dimensions jigs and fixtures mini project BS4584 102.5 cuzn40pb2
Contextual Info: 987 Technical portal and online community for Design Engineers - www.element-14.com PCB Prototyping Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Bread Boards. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . CAD Software Systems . . . . . . . . . . . . . . . . . . . . .

Contextual Info: Multiadapters RE900-01 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.40 mm (15.7 mil) - Pins: 28, 40, 48, 60 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of

Contextual Info: Adapter TSOP I RE900-03 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.50 mm (19.7 mil) - Pins: 20, 24 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of

RE900-02

Contextual Info: Multiadaptateur pour CMS TSOP I/II RE900 - fibre de verre FR4 époxyde 1,50 mm, double face 35 µm CU entièrement metallisées - côte soudure et composants avec une surface de nickel/d´or chimique (Ni/Au) et pourvus d`un masque d´arrêt de soudure - distances entre les terminales:

gerber

Contextual Info: Adapter TSOP I RE900-02 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.50 mm (19.7 mil) - Pins: 28, 32, 40, 48 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of

from TSOP Type II

Contextual Info: Multiadapter - SMD TSOP I/II RE900 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.40 mm (15.7 mil); 0.50 mm (19.7 mil); 0.65 mm (26.5 mil); 0.80 mm (30 mil); 1.27 mm (50 mil)

RE900

Contextual Info: SMD-TSOP I/II Multiadapter RE900 - Epoxyd FR4 1,50 mm, zweiseitig 35 µm CU durchkontaktiert - Löt- und Komponentenseite mit einer Oberfläche aus chem. Nickel/Gold (NI/AU) sowie Lötstopmaske - Pitch Abstände: 0,40 mm (15.7 mil); 0,50 mm (19.7 mil) 0,65 mm (26.5 mil); 0,80 mm (30 mil); 1,27 mm (50 mil)

Contextual Info: Adapter TSOP I RE900-01 - FR4 EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - solder and component side with chemical NI/AU surface and solder stop mask - pitch spacings: 0.40 mm (15.7 mil) - Pins: 28, 40, 48, 60 - hole dia Ø 1.00 mm - Gerber data for manufacture of the soldering paste imprint will be provided free of