REFLOW PROFILE 245 Search Results

Contextual Info: 1000BASE-T LOW PROFILE MAGNETICS MODULE Designed to Support 1:1 Turns Ratio Transceivers RoHS-5 peak reflow temperature rating 235°C RoHS-6 peak reflow temperature rating 245°C° Low profile package for mobile computer applications Compliant with IEEE 802.3ab standard

Contextual Info: 1000BASE-T LOW PROFILE MAGNETICS MODULE Designed to Support 1:1 Turns Ratio Transceivers RoHS-5 peak reflow temperature rating 235°C RoHS-6 peak reflow temperature rating 245°C° Low profile package for mobile computer applications Compliant with IEEE 802.3ab standard

JEDEC J-STD-020d

Abstract: TES 1-0511V J-STD-020D JEDEC J-STD-020d Moisture Sensitivity 56756 4932 45328 j 182 JSTD-020D 4925
Contextual Info: Product: TES 1 Series Single Output Models Moisture Sensitivity Level MSL Test Report as per IPC/JEDEC J-STD-020D Table of Contents page Tested Flowchart 1 Tested Data before Reflow 2 245℃ Temperature Reflow Profile 3 Tested Data after Reflow 4 Pictures

80826

Abstract: TES-2N traco 212 DSASW004049
Contextual Info: Product: TES 2N Series Moisture Sensitivity Level MSL Test Report as per IPC/JEDEC J-STD-020C Table of Contents Tested Flowchart Page 1 Tested Data before Reflow 2 245℃ Temperature Reflow Profile 3 Tested Data after Reflow 4 Pictures Conclusion 5-40 41

215C

Abstract: reflow
Contextual Info: Soldering Profile Vishay Dale Soldering Profiles RECOMMENDED PROFILES FOR SOLDER REFLOW Infrared Reflow 10 Second Max. 245°C 200 1 to 5°C/Second 1 to 5°C/Second Temperature °C 100 1 to 9°C/Second Preliminary Heating 60 Seconds 200 Seconds Time Vapor Phase Reflow

reflow profile 245

Abstract: 215C dale
Contextual Info: Soldering Profile Vishay Dale RECOMMENDED PROFILES FOR SOLDER REFLOW Infrared Reflow 10 Second Max. 245°C 200 1 to 5°C/Second 1 to 5°C/Second Temperature °C 100 1 to 9°C/Second Preliminary Heating 60 Seconds 200 Seconds Time Vapor Phase Reflow 50 Second

0501b

Contextual Info: Pb-Free Assembly Reflow Profile AP NOTE: 0501B Page 1 of 2 Figure 5-1 Classification Reflow Profile FREQUENCY CONTROLS, INC. 357 Beloit Street, P.O. Box 457, Burlington, WI 53105-0457 U.S.A. Phone 262/763-3591 FAX 262/763-2881 Email: nelsales@nelfc.com www.nelfc.com

Contextual Info: Return to Specification Page Search! E1S Series Recommended Solder Reflow Methods High Temperature Infrared/Convection Low Temperature Infrared/Convection High Temperature Manual Soldering Low Temperature Manual Soldering Solder Reflow Profile Top of Page

Contextual Info: Return to Specification Page Search! ECCM8 Series Recommended Solder Reflow Methods High Temperature Infrared/Convection Low Temperature Infrared/Convection High Temperature Manual Soldering Low Temperature Manual Soldering Solder Reflow Profile Top of Page

Contextual Info: Return to Specification Page Search! ECCM7 Series Recommended Solder Reflow Methods High Temperature Infrared/Convection Low Temperature Infrared/Convection High Temperature Manual Soldering Low Temperature Manual Soldering Solder Reflow Profile Top of Page

Contextual Info: Return to Specification Page Search! E3WC Series Recommended Solder Reflow Methods High Temperature Solder Bath Wave Solder Low Temperature Solder Bath (Wave Solder) High Temperature Manual Soldering Low Temperature Manual Soldering Solder Reflow Profile

Contextual Info: Return to Specification Page Search! E4WC Series Recommended Solder Reflow Methods High Temperature Solder Bath Wave Solder Low Temperature Solder Bath (Wave Solder) High Temperature Manual Soldering Low Temperature Manual Soldering Solder Reflow Profile

Contextual Info: Return to Specification Page Search! EU Series Recommended Solder Reflow Methods High Temperature Solder Bath Wave Solder Low Temperature Solder Bath (Wave Solder) High Temperature Manual Soldering Low Temperature Manual Soldering Solder Reflow Profile Top of Page

Contextual Info: Return to Specification Page Search! ES51F5 Series Recommended Solder Reflow Methods Low Temperature Solder Bath Wave Solder High Temperature Manual Soldering Low Temperature Manual Soldering Solder Reflow Profile Top of Page Low Temperature Solder Bath (Wave Solder)

Contextual Info: Return to Specification Page Search! EB52F5 Series Recommended Solder Reflow Methods Low Temperature Solder Bath Wave Solder High Temperature Manual Soldering Low Temperature Manual Soldering Solder Reflow Profile Top of Page Low Temperature Solder Bath (Wave Solder)

Contextual Info: Return to Specification Page Search! ES52F3 Series Recommended Solder Reflow Methods Low Temperature Solder Bath Wave Solder High Temperature Manual Soldering Low Temperature Manual Soldering Solder Reflow Profile Top of Page Low Temperature Solder Bath (Wave Solder)

Contextual Info: Return to Specification Page Search! EB51F3 Series Recommended Solder Reflow Methods Low Temperature Solder Bath Wave Solder High Temperature Manual Soldering Low Temperature Manual Soldering Solder Reflow Profile Top of Page Low Temperature Solder Bath (Wave Solder)

J-STD-020-C

Abstract: J-STD-020C JEDEC J-STD-020c 020C reflow profile JSTD020C JEDEC wave reflow profile 245
Contextual Info: Lead-Free Reflow Profile Recommendation IPC/JEDEC J-STD-020C Reflow Parameter Minimum preheat temperature (TsMIN) Maximum preheat temperature (TsMAX) Preheat time TsMAX to TL ramp-up rate Time above temperature TL (tL ) Peak temperature (TP) Time 25 °C to TP

Contextual Info: 1000Base-T Low Profile Magnetics Module Designed to Support 1:1 Turns Ratios Receivers RoHS-6 peak reflow temperature rating 245°C Low profile package for mobile computer applications Compliant with IEEE 802.3ab standard Electrical Specifications @ 25°C - Operating Temperature 0°C to 70°C

Contextual Info: 1000Base-T Low Profile Magnetics Module Designed to Support 1:1 Turns Ratios Receivers RoHS-6 peak reflow temperature rating 245°C Low profile package for mobile computer applications Compliant with IEEE 802.3ab standard Electrical Specifications @ 25°C - Operating Temperature 0°C to 70°C

HX5019BNL

Abstract: HX5180 MCT-211 HX5019
Contextual Info: 1000Base-T Low Profile Magnetics Module Designed to Support 1:1 Turns Ratios Receivers RoHS-6 peak reflow temperature rating 245°C Low profile package for mobile computer applications Compliant with IEEE 802.3ab standard Electrical Specifications @ 25°C - Operating Temperature 0°C to 70°C

Contextual Info: AN0333 APPLICATION NOTE 0333 REFLOW SOLDER PROFILE RECOMMENDATION Introduction This application note provides guidelines for Diodes semiconductor packages relating to: • the board mounting • recommended reflow solder profiles This guideline based on IPC/JEDEC J-STD-020D.1 March 2008.

pe69012t

Abstract: H0022 H0001 H0002 H0009 H0013 H0019 H0020 H0025 PE-69012
Contextual Info: 10/100 PC CARD LAN MAGNETICS MODULES RoHS-5 peak reflow temperature rating 235°C RoHS-6 peak reflow temperature rating 245°C Low profile packages from .094” 2,39mm to .078” (1,98mm) for PC card and cardbus applications Electrical Specifications @ 25°C — Operating Temperature 0°C to 70°C

H0019

Abstract: ethernet card schematic 69012 H0009 H0019NL h0020 H0001 H0002 H0013 H0022
Contextual Info: 10/100 PC CARD LAN MAGNETICS MODULES RoHS-5 peak reflow temperature rating 235°C RoHS-6 peak reflow temperature rating 245°C Low profile packages from .094” 2,39mm to .078” (1,98mm) for PC card and cardbus applications Electrical Specifications @ 25°C — Operating Temperature 0°C to 70°C