REGISTRY Search Results

QLA2200

Abstract: QLA2100 QL2200 QL220
Contextual Info: QLDIRECT QLogic Optimizing and Multipath Driver For Windows NT V4.0 and Windows 2000 Contents = OS Support Hardware Support Supported Features Release History Installing the Driver Replacing QLFILTER with QLDIRECT Reinstalling the Driver Registry Parameters

FT2232H

Abstract: ft4232 FT4232H COM16 motherboard diagram g41
Contextual Info: Future Technology Devices International Ltd. Application Note AN_132 Re-Assigning COM Port Numbers Using the Windows Registry Document Reference No.: FT_000196 Version 1.0 Issue Date: 2009-11-06 This application note illustrates how to re-assign automatically assigned FTDI COM port numbers using

PCCU32

Abstract: 2101125-AE ABB COLD START
Contextual Info: Data Sheet 2101125-AE DESCRIPTION Registry is a term that refers to a collection of data that describes the system level software and hardware reference information for an XSeries product. This information is stored in a protected area of the on-board 32K E2PROM S Drive and is

toshiba 8GB

Abstract: AP-UM008GN40CG-T Toshiba slc toshiba flash memory 8gb 180D apacer
Contextual Info: RoHS Compliant USB-Disk ModuleⅡPlus Specification May 24, 2011 Version 1.1 Apacer Technology Inc. th 4 Fl., 75 Hsin Tai Wu Rd., Sec.1, Hsichih, New Taipei City, Taiwan 221 Tel: +886-2-2698-2888 www.apacer.com Fax: +886-2-2698-2889 USB-Disk ModuleⅡPlus

X09-009PK

Abstract: PLC modem europe XH9-009PK X24-019PK XStream-PKG-RRS-232 009P "routing tables"
Contextual Info: XStream-PKG-E Ethernet RF Modem XStream Ethernet RF Modem System Setup RF Modem Operation RF Modem Configuration RF Communication Modes Appendices Product Manual v5.x00 For XStream RF Modem Part Numbers X09-001PK…-E… X24-009PK…-E. XH9-001PK…-E.

MC9SO8QE32

Abstract: XBee-PRO ZB S2B Xbee Pro Series 2 Ember EM357 Ember EM357 SPI register Xbee Pro ZS2010 ZigBee Cluster Library Specification Xbee zb smt pin diagram and of xbee
Contextual Info: XBee /XBee-PRO® ZB SMT RF Modules ZigBee RF Modules by Digi International Models: XBEE S2C, PRO S2C Hardware: S2C Firmware: 401x Digi International Inc. 11001 Bren Road East Minnetonka, MN 55343 877 912-3444 or 952 912-3444 http://www.digi.com 90002002_A

ARM926T

Abstract: ic str 6454 s11 stopping compound motorola 7824 BT OSC26M CNC DRIVES ptc temperature sensor 400c 4*4 matrix keypad 17521 rca SAMSUNG NAND FLASH K9F5608
Contextual Info: i.MX21 Applications Processor Reference Manual Document Number: MC9328MX21RM Rev. 3 04/2007 How to Reach Us: Home Page: www.freescale.com E-mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370

XDS510

Abstract: XDS510USB XDS510-USB 2.2X C2000 C6000 XDS510USB PLUS JTAG EMULATOR Spectrum Digital
Contextual Info: XDS510 USB JTAG Emulator Set-up Instructions The XDS510 USB contains: XDS510 USB USB Cable System Hardware and Software Requirements These operating platform requirements are necessary to install the Code Composer Studio CCS integrated Development Environment and support the XDS510-USB

MS-026

Abstract: MT55L256L32P MT55L256L36P MT55L256V32P MT55L256V36P MT55L512L18P MT55L512V18P
Contextual Info: 8Mb: 512K x 18, 256K x 32/36 PIPELINED ZBT SRAM 8Mb ZBT SRAM MT55L512L18P, MT55L512V18P, MT55L256L32P, MT55L256V32P, MT55L256L36P, MT55L256V36P 3.3V VDD, 3.3V or 2.5V I/O FEATURES • • • • • • • • • • • • • • • • • • •

MT55L256L18P1T-10A

Abstract: MS-026 MT55L128L32P1 MT55L128L36P1 MT55L128V32P1 MT55L128V36P1 MT55L256L18P1 MT55L256L18P1T-10 MT55L256V18P1 84 FBGA thermal
Contextual Info: PRELIMINARY 4Mb: 256K x 18, 128K x 32/36 PIPELINED ZBT SRAM 4Mb ZBT SRAM MT55L256L18P1, MT55L256V18P1, MT55L128L32P1, MT55L128V32P1, MT55L128L36P1, MT55L128V36P1 3.3V VDD, 3.3V or 2.5V I/O FEATURES • • • • • • • • • • • • • •

A67L7332

Abstract: A67L7336 A67L8316 A67L8318
Contextual Info: A67L8316/A67L8318/ A67L7332/A67L7336 Series 256K X 16/18, 128K X 32/36 Preliminary LVTTL, Pipelined DBA SRAM Document Title 256K X 16/18, 128K X 32/36 LVTTL, Pipelined DBA SRAM Revision History Rev. No. 0.0 PRELIMINARY History Issue Date Remark Initial issue

pwr4525

Contextual Info: MATERIAL DECLARATION SHEET Material Number PWR4525 SURFACE MOUNT WIREWOUND RESISTOR Product Line Compliance Date 1/1/2000 RoHS Compliant YES No. Construction Element subpart 1 LEAD WIRE 2 LEAD WIRE PLATING 3 END CAPS 4 RESISTANCE WIRE 5 EPOXY ENCAPSULANT

Contextual Info: MATERIAL DECLARATION SHEET Material Number PWR2615 SURFACE MOUNT WIREWOUND RESISTOR Product Line Compliance Date 1/1/2000 RoHS Compliant YES No. Construction Element subpart 1 LEAD WIRE 2 LEAD WIRE PLATING 3 END CAPS 4 RESISTANCE WIRE 5 EPOXY Headquarters Riverside CA

3050b

Abstract: TISP7350H3SL-S Bourns Sip IT 8572
Contextual Info: MATERIAL DECLARATION SHEET 3-SIP Package Type Product Line TSP Transistors & Thyristors Compliance Date November 30, 2004 RoHS Compliant Yes (-S suffix) MSL N/A Bourns TISP products complying with RoHS legislation are identified with a “-S ” suffix in the component part number e.g. TISP7350H3SL-S

QLA2200

Contextual Info: COMPUTER SYSTEMS GROUP PRODUCT: TYPE: TITLE: PREVIOUS VERSION: SEVERITY: REMAINING ISSUES: RELEASE NOTICE DATE: July 24, 2000 QLA2200 Software/Driver QLA2200 NETWARE 4/5 DRIVER V5.40S/2.01.14 V5.14N Suggested Change None Identified CORRECTED ISSUES: * Added 2 error cases to Mailbox_ISR to handle loopback

26.6M

Abstract: CT-26-6M copper chromium CA 5668
Contextual Info: MATERIAL DECLARATION SHEET Material Number CT-26-6M Product Line Dials Compliance Date January 1995 RoHS Compliant Yes No. 1 2 3 4 Construction Element subpart External Housing Brake Bushing Gearwheel Housing Headquarters Riverside CA MSL Homogeneous Material

DAD 5

Abstract: TO 92 leadframe 3050b TISP4240M3LMFR-S TISP4350H3LM-S
Contextual Info: MATERIAL DECLARATION SHEET Package Type DO-92 Product Line TSP Transistors & Thyristors Compliance Date November 30, 2004 RoHS Compliant Yes (-S suffix) MSL N/A Bourns TISP products complying with RoHS legislation are identified with a “-S ” suffix in the part number e.g. TISP4350H3LM-S or TISP4240M3LMFR-S.

Contextual Info: MATERIAL DECLARATION SHEET Material Number 85L CP Dual Cup Product Line Panel Control Compliance Date September 30, 2005 RoHS Compliant Yes MSL N/A Subpart mass of total wt. (%) 72 Material Mass % of total unit wt. 3.920 25 1.361 5.455 7440-50-08 3 0.163

MATERIAL DECLARATION inductor

Abstract: PM1008 material declaration MATERIAL DECLARATION SHEET inductor
Contextual Info: MATERIAL DECLARATION SHEET Material Number PM1008 Series Product Line Chip Inductor Compliance Date 01-January-2006 RoHS Compliant Yes MSL 2a No. Construction Element subpart Homogeneous Material Material Weight [g] Homogeneous Material Substance 1 Core

TAG 8926

Abstract: Lpg 899 SDC 2921 TF 6221 HEN LED display 12V+RELAY+1+C/8 pin ic sdc 3733
Contextual Info: MCIMX31 and MCIMX31L Multimedia Applications Processors Reference Manual MCIMX31RM Rev. 1 2/2006 How to Reach Us: USA/Europe/Locations Not Listed: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-521-6274 or 480-768-2130

CRT0603 marking

Contextual Info: MATERIAL DECLARATION SHEET Material Number Model CRT0603 Product Line Chip Resistors Compliance Date 18-June-2009 RoHS Compliant Yes MSL 1 Construction Element subpart Homogeneou s Material Material weight [g] Homogeneous Material\ Substances Ceramic Substrate

Contextual Info: MATERIAL DECLARATION SHEET Material Number SRU3014 Series Product Line Shielded Power Inductor Compliance Date 01-November-2006 RoHS Compliant No. 1 2 3 Construction Element subpart Core Yes MSL Homogeneous Material Ferrite Ni-Zn Series Solder Bar Solder

diode marking 226

Abstract: marking 7c fiber glass
Contextual Info: MATERIAL DECLARATION SHEET Material # CMF-RD Product Line PTC resistors Date 01/13/2009 Version A/0 RoHS Compliant Yes No. 1 Construction element Substrate Material group Ceramic Material weight [g] 0.674 Materials CAS if applicable Average mass [%] Barium

Contextual Info: MATERIAL DECLARATION SHEET Material Number SRR6028 Series Product Line SHIELDED SMD POWER INDUCTOR Compliance Date 01-July-2007 RoHS Compliant Yes No. 1 Construction Element subpart CORE MSL Homogeneous Material 1 Material weight [mg] FERRITE CORE 414.1