REWORK 80 Search Results

BGA-3000

Abstract: Intel reflow soldering profile BGA BGA-3102 BGA-3101 convection oven temperature sensor intel 3102 DIAPHRAGM PUMP rtd 2025 vacuum pump 28F008B3
Contextual Info: CSP-UG Chip-Scale Upgrade Kit for BGA-3000 Series Rework System 1 The rapidly emerging Chip-Scale Package has been associated with many challenges in both the rework and prototyping environment. This particular package demands a specifically tailored rework solution while maintaining user-friendliness.

Contextual Info: HCT-900 HCT-900 Hand Held Convection Tool SMT Component Rework A Versatile Hot Air Tool for SMT Soldering and De-soldering The OK International HCT-900 Hand Held Convection Tool offers a low cost versatile rework solution for a wide variety of production and rework

LGA rework

Abstract: AN2920 cte table flip chip substrate Solder Paste, Indium reflow process control LGA voiding AN1902 AN3241 BGA cte reflow profile FOR LGA COMPONENTS ceramic rework
Contextual Info: Freescale Semiconductor Application Note Document Number: AN3241 Rev. 1.0, 10/2009 Land Grid Array LGA Package Rework 1 Introduction This application note describes rework considerations for the Land Grid Array (LGA) style package. Freescale has introduced radio frequency (RF) modules

sdc 603

Abstract: SDC-602 plcc 52 SOCKET sdc603 MX-500P-21 sdc 606 sdc606 STTC-136 132 qfp extraction tool METCAL SP200
Contextual Info: soldering desoldering & rework systems contents and preface Contents 1 Introducing the QX2 2 QX2 system elements and functions 3 QX2 system elements and functions 4 Part numbers for the QX2 5 The power of SmartHeat 6 The power of SmartHeat 7 MX rework systems

PACE

Contextual Info: CR WJS 100 WITH P TED RI AF E D Solutions and systems for soldering, rework and repair of electronics Solder, Desolder & Rework IN THE U.S.A The New Gold Standard in Soldering Systems Introducing the WJS 100 High-Power Soldering System.from PACE. Since William Bill J. Siegel founded PACE in his basement in 1958,

stencil tension

Abstract: AN1028 AN-1028 BHARAT pcb warpage* in smt reflow
Contextual Info: Application Note AN-1028 Recommended Design, Integration and Rework Guidelines for International Rectifier’s iPOWIR BGA Packages Table of Contents Page Introduction . 1

pcb warpage in ipc standard

Abstract: JEDEC J-STD-033A J-STD-033A LGA rework JSTD033A reflow profile FOR LGA COMPONENTS AN1028 8015 j AN-1028 AN-1029
Contextual Info: Application Note AN-1028 Recommended Design, Integration and Rework Guidelines for International Rectifier’s BGA and LGA Packages by Kevin Hu, International Rectifier Table of Contents Page Introduction .1

Contextual Info: FM PEG Series EMI SUPPRESSING HEADER FEATURES • ■ • • . DUAL ROW 2 to 80 positions Dual Insulator design adds mechanical stability Suppression plates help reduce EMI/RFI interference Insulator standoffs reduce rework due to flux residue Coined tails improve solder action

Contextual Info: FMPEG Series EMI SUPPRESSING HEADER FEATURES • ■ • ■ DUAL RO W 2 to 80 positions Dual insulator design adds mechanical stability Suppression plates help reduce EMI/RFI interference Insulator standoffs reduce rework due to flu* residue Coined tails improve solder action

MOSFET B20 N03

Abstract: A09 N03 MOSFET A42 BF 331 W01 SMD mosfet lt1093 1206A102 KAT2A AVX SRDSB10PC viper 22e RAS 05 e201 siliconix
Contextual Info: OPTi Inc. OPTi 888 Tasman Drive Milpitas, CA 95035 408 486-8000 Fax: (408) 486-8001 Configuration Guide (Confidential) Product Name: Viper Xpress+ Debug Board Title: Debug Board Revision 0.0 Specification Date: January 21, 1997 Scope This document provides the specification, jumper list, rework

Contextual Info: Weller DXV80 80 Watt Desoldering Tool For WR3M Rework Station Product Details Catalog No. UPC Code Fits Station Wattage Temperature Range Voltage Supplied Tip s Iron Stand 0051318299 037103225313 WR3M 80 W 150° F to 850° F 24 V DX112 (0051314299) WDH40

Contextual Info: Weller Hot Gas Nozzle For WQB4000SOPS Rework System Product Details Catalog No. UPC Code Fits Tool s Tip Style Tip Width O/D Tip Thickness/Height/ I/D Reach/Length Packaging T0058755761 037103234506 WQB4000SOPS 4-Sided .79 in./20 mm 3.15 in./80 mm Stock Item

Contextual Info: Techclean Blue Maintenance Wipe 2359-2365 Techspray offers a large array of wipes for a variety of applications, including cleanroom, PCB rework, polishing, and maintenance. A large number of different materials are available to meet each unique requirement.

Contextual Info: ATS Series BOARD MOUNT SOCKET FEATURES Chamfered entry prevents pin stubbing High reliability tuning fork contact Insulator standoffs reduce rework due to flux residue Low profile allows tighter packaging Mates with PEG, MPEG, DPEG, LPEG, TPEG Series headers

Weller EC1302A

Abstract: EC1201A weller soldering station TC201T PES50 EC1002 weller soldering tip weller ec1503a weller DEC1001
Contextual Info: Hot Air Rework Station and Nozzles Professional Soldering Irons WP25, WP30, WP35 Series Irons Specifications: 650W Temperature Range: 122°F ~ 1022°F Voltage: 120V Features: • Compact design maximizes workspace efficiency • Controlled output maintains set temperature regardless of air flow

7280A

Abstract: eer 4445
Contextual Info: Catalog 124372 SIMM II 40° Sockets issued 5-95 Product Facts • Metal latches prevent breakage and shaving of latches and reduces customer rework ■ Retention posts keep sockets positioned for soldering ■ Polarizing posts provide proper orientation of the

Contextual Info: • • • ■ » MATI KITE TIP prevents s<rapimj of rnaiing uockot Insulator standoffs reduce rework due to flux residue Board retention option prevents unwanted movement Rounded tails improve solder action Mates with Crane's ATP, ATS sockets; JUN jumpers

Contextual Info: SINGLE ROW 1 to 40 positions . • Chamfered entry prevents pin stubbing High reliability tuning fork contact • ■ ■ Standoffs reduce rework due to flux residue Selective plating options available Mates with PEG, MPEG, DPEG, LPEG, TPEG headers jLrS.n.

Contextual Info: Identification Systems Wire and Cable Markers 5.2 Self-laminating labels, manual marking • RiteOn, Starter Pack, Material 1401 dispenser Features and Benefits These self-laminating labels provide simple and rapid identification for low volume installation and rework. The coloured text

Contextual Info: PEG Series PIN STRIP HEADER • ■ ■ ■ ■ SINGLE ROW 1 to 40 positions MATE RITE TIP prevents scraping of mating socket Insulator standoffs reduce rework due to flux residue Board retention option prevents unwanted movement Rounded tails improve solder action

Contextual Info: PEG Series PIN STRIP HEADER FEATURES • • • . SINGLE ROW I to 40 positions MATE-RITE TIP prevents scraping of mating socket Insulator standoffs reduce rework due to flux residue Board retention option prevents unwanted movement Coined tails improve solder action

Contextual Info: ATS Series • ■ ■ . Chamfered entry prevents pin stubbing High reliability tuning fork contact Insulator standoffs reduce rework due to flux residue Low profile allows tighter packaging Mates with PEG, MPEG, DPEG, LPEG, TPEG Series headers SINGLE ROW 1 to 40 positions

ceramic rework

Abstract: CCGA BGA Solder Ball collapse 90Pb 10Sn solder paste 304-pin ltcc MPC105 MPC106 MPC107 BGA PROFILING spray nozzles
Contextual Info: Ceramic Ball Grid Array Packaging, Assembly & Reliability Freescale Semiconductor 1 Outline for Discussion • • • • • • Why BGA? CBGA Introduction and Package Description PC Board Design for CBGA CBGA Assembly Rework Board-Level Solder Joint Reliability

Contextual Info: PEG Series FEATURES • ■ • > ■ SINGLE ROW 1 to 40 positions MATE-RITE TIP prevents scraping of mating socket Insulator standoffs reduce rework due to flux residue Board retention option prevents unwanted movement Rounded tails improve solder action