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Abstract: No abstract text available
Text: RMPA2263 i-Lo i L o ™ Features General Description • 40% WCDMA efficiency at +28 dBm Pout The RMPA2263 Power Amplifier Module PAM is Fairchild’s latest innovation in 50 Ohm matched, surface mount modules targeting UMTS/WCDMA/HSDPA applications. Answering the
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RMPA2263
RMPA2263
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Untitled
Abstract: No abstract text available
Text: RMPA2263 i-Lo i L o ™ Features General Description • 40% WCDMA efficiency at +28 dBm Pout The RMPA2263 Power Amplifier Module PAM is Fairchild’s latest innovation in 50 Ohm matched, surface mount modules targeting UMTS/WCDMA/HSDPA applications. Answering the
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RMPA2263
RMPA2263
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Solder Paste Indium reflow process control
Abstract: ECJ-1VB1H102K RMPA2263 SN63 SN96
Text: RMPA2263 i-Lo i L o ™ Features General Description • 40% WCDMA efficiency at +28 dBm Pout The RMPA2263 Power Amplifier Module PAM is Fairchild’s latest innovation in 50 Ohm matched, surface mount modules targeting UMTS/WCDMA/HSDPA applications. Answering the
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RMPA2263
RMPA2263
Solder Paste Indium reflow process control
ECJ-1VB1H102K
SN63
SN96
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Untitled
Abstract: No abstract text available
Text: February 2005 RMPA2263 i-Lo WCDMA Power Amplifier Module 1920–1980 MHz Features General Description • 40% WCDMA efficiency at +28 dBm Pout ■ 14% WCDMA efficiency 85 mA total current at +16 dBm Pout ■ Linear operation in low-power mode up to +19 dBm
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