RNX W16 Search Results

DNA 1002

Abstract: rnx w16 dn5 marking packaging resistor MARKING W16 SOT23 rnx Q24 DN6 marking diode
Contextual Info: NETWORKS TECHNOLOGY OF TOMORROW RESISTORS / CAPACITORS / DIODES 3 2 THIN FILM ON SILICON TFOS INTEGRATED PASSIVE COMPONENTS KPC STRUCTURE 1 1 2 3 4 5 6 7 Die pad Silicon substrate Circuit Bonding pad Lead Mold resin Gold wire bonding 6 5 NETWORKS (PASSIVE COMPONENTS)

DNA 1002

Abstract: RNX W16 marking s14 sot23 KPC T16 DNA MARKING CODE KOA KPC T16 Packaging marking code 8 lead soic-n package analog devices MARKING W16 SOT23 CODE DIODE
Contextual Info: NETWORKS TECHNOLOGY OF TOMORROW RESISTORS / CAPACITORS / DIODES 3 2 THIN FILM ON SILICON TFOS INTEGRATED PASSIVE COMPONENTS KPC STRUCTURE 1 1 2 3 4 5 6 7 Die pad Silicon substrate Circuit Bonding pad Lead Mold resin Gold wire bonding 6 5 NETWORKS (PASSIVE COMPONENTS)

rnx w16

Abstract: 471j CAPACITOR w16 sot23 511j CAPACITOR KPC T16 12w SOT23-3 appendix T16 KOA KPC appendix KOA KPC T16
Contextual Info: 抵抗器 Resistors R/C NETWORKS KPC 表面実装形薄膜抵抗/コンデンサネットワーク KOA’s Integrated Passive Components •構造図 Construction ② ① ③ ① シリコンウェハ Si wafer ② ボンディングワイヤ Bonding wire

Contextual Info: KOA THIN FILM KOA's Integrated Passive Components SPEER ELECTRONICS, INC. General Description & Background Information These thin film passive components are designed for EMI/RFI filtering and impedance matching applications. The integrated passive components are produced using a silicon based technology that

rnx w16

Contextual Info: KOA THIN FILM KOA's Integrated Passive Components SPEER ELECTRONICS, INC. General Description & Background Information These thin film passive components are designed for EMI/RFI filtering and impedance matching applications. The integrated passive components are produced using a silicon based technology that

TE-5001

Abstract: MARKING W16 SOT23 HBM W20 rnx w16 DNA 1002 TVC 2 HB IEEE resistor color code RDA Q20 W16 sot 23 acd marking code
Contextual Info: NETWORKS Resistors / capacitors / diodes 3 THIN FILM ON SILICON TFOS INTEGRATED PASSIVE COMPONENTS KPC 2 1 STRUCTURE 1 2 3 4 5 6 7 Die pad Silicon substrate Circuit Bonding pad Lead Mold resin Gold wire bonding 6 5 4 IDENTIFICATION TYPE COATING COLOR MARKING

W574

Abstract: TFK 840 mag mount cellular antenna dual band blade antenna block diagram for amateur radio WR 137 antenna NMO470C WD30S WKG144 WT63
Contextual Info: When selecting a mobile antenna, there ate a number of factors to take into consideration that significantly effect the ultimate performance of the antenna Gain requirements, electrical type, ground plane availability vs. requirements, placement on vehicle temporaiyvs, permanent mounting,

X51L

Abstract: 12c5202 Asus T0327 C3203 12G17000004J C0820 diode ICS9LPR363DGLF-T MW772 C0821
Contextual Info: 5 4 3 2 1 X51L Main BD. R2.0 BLOCK DIAGRAM CLOCK GEN. ICS9LPR363CGLF-T D D Merom CPU PAGE 29 FAN + Thermal sensor 478B uFCPGA PAGE 3,4 PAGE 50 FSB 800 MHz LVDS PAGE 46 CRT CRESTLINE 960GL PAGE 45 SiI1368 SDVO to LPFQ48 DVI DVI PAGE 45 C DDR-II SO-DIMM X 2