ROBINSON NUGENT EL Search Results

Contextual Info: Robinson Nugent- Screw Machine Terminal Strips I Solderless Backplane Socket r SBE-CP Series High reliability gas-tight connections Eliminates expensive manual soldering of backplanes Press-fit pin eliminates PCB damage Compatible with standard press-fit

Contextual Info: FINE PITCH SOCKETS Surface Mount Sockets SOCKETS The Robinson Nugent family of surface mount sockets offers a wide variety of packaging solutions to ad­ dress the most difficult, high density, low profile socketing requirements. The RN family of SMT sockets is

Contextual Info: 4 Row HDC Headers Robinson ~Nugent — PCB/Backplane Headers Single and Dual Bay HDC - H4 Series • High density up to 320 contacts single bay and 488 contacts dual bay • Dual FLEXPRESS contacts are front and rear repairable pages 339-340 for contact data

Contextual Info: 2mm Shunts Robinson — Nugent-Programming Shunts P2-PS Series * 2-position programing shunt accepts .020" square post * Dual beam contact, 2mm x 2mm center-tocenter * Low profile, side and end stackable * Low cost system for bussing, programing

Robinson Nugent idh

Abstract: BT 812 BT-224
Contextual Info: Robinson Nugent Solderless Backplane Connectors >4 Sided Press-Fit Headers .025" Sq. Post IDH-PK Series • MIL-C-83503, DIN 41651 and BT-224 Compatible • FLEXPRESS compliant pin permits solderless mounting • 4-sided body provides complete pin protection and polarization

Contextual Info: RN DIMMPAK Robinson DIMMPAK to DIMM Technology The Dual In-line Memory Module DIMM format has gained industry wide acceptance as the technology of choice for memory upgrades in current and future generations in computing. As the

DIN-48RPC-DPS-XXXX

Abstract: DIN-96RPC-DPS-XXXX Robinson Nugent cable to board
Contextual Info: Robinson Nugent 2-Piece PC Connectors .Inverse R-Form DIN ^Press-fit Backpanel Plug Connectors DIN-RP Series FLEX PRESS press-fit contacts eliminate soldering * EMLB or grounding contacts for “hot board” replacement are set by application tooling at no additional cost see page 126

Robinson Nugent

Contextual Info: 4 ROW HDC SOCKETS Robinson Nugent PCB/Backplane Sockets, Vertical Mount Single Bay HDC - R4 Series Ideal for parallel PCB stacking memmaÆSÊÊÊÊÊÊÊ 1IÉII1 High density interconnect for a variety of computer, telecom and high speed electronic equipment

ICE-246-S-TG

Abstract: ICE283STG ICE-649-S-TG30 SBQ-36P-S-100-TG ICE-203-S-TG30 NSH-80DB-SR2-TR 406-S-TG30 906-8682 ICE-183-S-TG30 ICE-406-S-TG30
Contextual Info: Robinson Nugent Boardmount and Non-Shrouded Headers and Sockets ICA Series Screw Machine Sockets NSH Series 0.025" 0.635 Square Post Non-Shrouded Headers Feature four finger beryllium copper contacts with high retention design. Low profile body with mounting holes. ÒSÓ in

Contextual Info: FINE PITCH CONNECTORS Introduction to PAK-5 and PAK-8SMT Connectors PAK-5 and PAK-8™ represent the newest high density, SMT fine pitch board to board interconnect system from Robinson Nugent, Inc. As electronic systems continue to downsize and the need for higher pin

P50E-080S-TG

Abstract: P25E-050S-TG P50E-080P1 DIN-64-CPB-SR1-TR P50E-080P1-S1-TG DIN-64CPB-SR1-TR P25E-080S-TG 9063256 P50E-100S-TG DIN-96CPC-SR1-TR
Contextual Info: Robinson Nugent PC Boardmount Connectors and Sockets CPCI PAK-2¨ Connectors Compact PCI Connectors RN PAK-50¨ P25E and P50E Series 50 MIL IDC Sockets Two piece 2 mm ´ 2 mm pin and receptacle connector system. Meets IEC61076-4-101 Level 11 requirements and

Contextual Info: RN 1C PAK Surface Mount Sockets The Robinson Nugent family of surface mount sockets offers a wide variety of packaging solutions to ad­ dress the most difficult, high density, low profile socketing requirements. The RN family of SMT sockets is designed to address miniaturized prototype and production packaging applications for memory and control

Robinson Nugent s2

Contextual Info: FINE PITCH SOCKETS E & D _ Specifications for SOP Sockets MATERIALS Body & Frame: Glass reinforced PPS UL 94V-0 Contact: Copper Alloy Plating: TT = 2.03 pm (80 pinch) Tin/Lead overall. 1.27 pm (50 pinch) Nickel underplate. ELECTRICAL Current Rating: 0.5 Ampere per contact

Robinson Nugent socket

Contextual Info: So cket s HIGH DENSITY_ 8 Byte DIMM Sockets, DIMS Series Effectively provides double density packaging Durability - 60 cycles minimum Vertical entry allows insertion/removal without disturbing “neighboring DIMMs” Superior shock and vibration performance

robinson nugent

Abstract: straddle PCMCIA Robinson Nugent socket Robinson Nugent 2.0 Robinson Nugent 2.0 mm Robinson Nugent socket connector
Contextual Info: PCMCIA_ SELECTION GUIDE MEMPAK” Receptacles Part Number MCS 068 SM A 1 TP TR30 .Contact Plating TR30-30 microinch ROBEX Memory Card Socket. Number of Contacts. 68 Position Body Style_ SM-Straddle Mount SS-Single sided, Single row SD-Single sided, Dual row

Contextual Info: Robinson —Nugent- PCMCIA RN MEMPAK Introduction PCMCIA is a technical design standard and trade associa­ tion. The acronym stands for Personal Computer Memory Card International Association. The organization’s charter is to establish, market and maintain a standard for PC cards.

ROBINSON NUGENT

Abstract: ROBINSON
Contextual Info: 50 mil Interconnect System Redundant Ribbon Contact Reliability Until now the standard pitch for PC board connectors has been 100 mil 2.54mm , but as systems become smaller and the corresponding mounting density ot PC boards increases, it becomes necessary to increase the density

96 pin DIN connector right angle

Abstract: Robinson Nugent 96 pin vme DIN connector 371D Robinson Nugent DIN-48CPC-XXX-TR DIN-96CPC-SR14A-TR Robinson Nugent 2.0 Robinson Nugent daughter Robinson Nugent cable to board
Contextual Info: DIN CONNECTORS_ Standard C-Form DIN Solder-To-Board Plug Connectors DIN-CP Series • 96 position connector used on VME, VXI, Multi-Bus II daughter cards • High temp SMT compatible insulator • EMLB groundng contacts allow “hot board” replacement see page 293

Contextual Info: RN ICPAK N uaant Specifications for TSOP Sockets MATERIALS Body: Liquid crystal polymer Plating: TT = 2.03 pm 80 pinch Tin/Lead overall. 1.27 pm (50 pinch) Nickel underplate. Frame: Glass-filled PPS Contact: Copper alloy Holder: Copper alloy Flammability: UL 94V-0

Contextual Info: DIN CONNECTORS Inverse R-Form DIN Press-fit Backpanel Plug Connectors DIN-RP Series mmmw- FLEXPRESS press-fit contacts eliminate soldering EMLB or grounding contacts for “hot board” replacement are set by application tooling at no additional cost see page 293

Contextual Info: DIN CONNECTORS_ Inverse R-Form DIN Solder-to-Board Socket Connectors DIN-RS Series — - 9 PC board mount socket applications include telecom, computer, data process­ ing, test and measurement and industrial equipment * Standard pin counts: 48, 64, 96,120,

robinson nugent

Abstract: DIN 41612 connector 96 pin DIN-96RPC-S1 wxxxx
Contextual Info: DIN CONNECTORS_ Inverse R-Form DIN Solder-to-Board Plug Connectors DIN-RP Series * Wide range of applications in telecom, computer, data processing, test and mea­ surement and industrial equipment * EMLB grounding contacts allow “hot board” replacement see page 293

MO-52

Contextual Info: R obinson — N u gen t- Sockets Sockets ELASTIC LEADED CHIP CARRIER SOCKETS PLCC-SMT Series Low profile; .200" maximum height Designed for automatic assembly Socket footprint same as device Open frame allows visual inspection of solder joints

Robinson Nugent socket

Abstract: ROBINSON NUGENT
Contextual Info: HIGH DENSITY_ 8 Byte DIMM Sockets, DIMS Series * Effectively provides double density packaging 9 Durability - 60 cycles minimum 9 Vertical entry allows insertion/removal without disturbing “neighboring DIMMs” RN DIMMPAK 9 Superior shock and vibration performance