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    S 11109-013 Search Results

    S 11109-013 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    10114829-11109LF
    Amphenol Communications Solutions 1.25mm Wire to Board Wafer, Vertical, Through Hole, 9 Positions Visit Amphenol Communications Solutions
    10005639-11109LF
    Amphenol Communications Solutions Vertical Through-Hole 240 Position DDR2 DIMM Connector, 1.00mm pitch Visit Amphenol Communications Solutions
    10114831-11109LF
    Amphenol Communications Solutions 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 9 POSITIONS, GOLD FLASH PLATING Visit Amphenol Communications Solutions
    94611-109HLF
    Amphenol Communications Solutions BergStikĀ®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 9 Positions, 2.54 mm (0.100in) Pitch. Visit Amphenol Communications Solutions
    54111-109300950LF
    Amphenol Communications Solutions BergStikĀ® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 30 Positions, 2.54mm (0.100in) Pitch. Visit Amphenol Communications Solutions