S0P20 Search Results

Contextual Info: DIP 14PIH OU TL IN E DR AWING DIP14-P-300 733 Un it in m m DIP 16PIN OUTLINE DRAWING (DIP16-P-30QA)_ Unit in m m DIP 1 SP IN OU TL IN E DR AW IN G (DIP18-P-300A) 18 U nit in mm 10 n i—i r—t i—> i—i i—i r-> -H u i i i i i ri i i ii ii i

DIP18

Abstract: DIP20 DIP40 SDIP22 SDIP24 SDIP28 SDIP30
Contextual Info: 包装仕様一覧 １．概要 新日本無線は電子機器の軽薄短小化更には自動実装による省力化のニーズに対して、スティックケース、粘着テーピング、エンボステーピ ング、トレイ及びビニール袋にて出荷しております。

SS0P20

Abstract: NJM2366 NJM2366G NJM2366V SS0P-20
Contextual Info: NJM2366 C0BS NJM 2366IÌ, 4 1 • S jfiic - e fo r t S P i S t a i t ic cfc y , £ 1/ 1 3 f r b 1/ 1 9 £ - e f f ig i:l£ $ - t ? 5 £ T o l¡t# [ • r t « in l^ J : y i/ 1 3 ~ 1 / 1 9 / U T X A ''R r t g • 5 ¡Ü *< 0 1 Ü i± # ¡!£ • • a iÄ B ä S ^ t L '

1P040

Abstract: 0FP100
Contextual Info: PACKAGE CODE • PACKAGE GODE TABLE NJRC vs. EIAJ GODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. EIAJ CODE NJRC CODE <DIP> DIP8 DIP14 DIP16 DIP18 DIP20 DIP22 DIP24

Contextual Info: RECOMMENDED MOUNTING METHOD • RECOMMENDED MOUNTING METHOD 1.Soldering Methods The recommended soldering methods for each package are shown in the following table. 1 Recommended Soldering Methods Table Through-Hole mounted device type package PKG TO-92

SSOP10

Abstract: DIP18 DIP20 DIP40 SDIP22 SDIP24 SDIP28 SDIP30
Contextual Info: PACKING SPECIFICATION TABLE • General Description NJRC delivers ICs in 4 methods, plastic tube container, two kinds of Taping, tray and vinyl bag packing. Except adhesive tape treated anti electrostatic and contain carbon are using as the ESD Electrostatic

CXD1255Q

Abstract: cxa1337 cx-7925b sony frequency synthesizer pll ILX501 lhi 778 cn/A/U 237 BG CXD1149 Semicon volume 1 IU02 icx024
Contextual Info: Semiconductor IC Semiconductor Integrated Circuit Data Book 1992 List of Model Names/ Index by Usage Description CCD Image Sensor Color CCD Image Sensor (Black/White) CCD Image Sensor System Scanning System IC for Video Camera Signal Processing IC for Video

Contextual Info: PACKAGE CODE • PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE EIAJ CODE <DIP> DIP8 DIP14 DIP16 DIP18 DIP20 DIP22 DIP24

BA1405F

Abstract: BA1335 BA6U BA8221 BA34168L ba843 BA8221AN BA3528FP 4236L BA-1320
Contextual Info: ICs for Audio Applications Block Diagram of Typical Applications 3V FM/AM stereo headphone system Front end B A 4425 20mW X 2 Mute sensor Í B A 3708 j VD 3V 32 n f HEADPHONES Stereo double cassette recorder system with radio and CD player IF+MPX U tM P X

CDB455C3

Abstract: CXA1184M CXA1184N CDB455 QFP Package 128 lead .5mm
Contextual Info: CXA1184M/N Sony. Low-voltage FM IF Amplifier Unit: mm Package Outline CXA1184M Description C X A 1 184 M and C X A 1 184N are designed for FM communication devices. They incorporate a paging system, mixer, IF limiter, FM detector, operational amplifier, comparator, and others.

DIP20

Abstract: DMP16 QFP44 SDIP22 SDIP24 SDIP28 SDIP42 SDMP30 S0P20
Contextual Info: 包装仕様一覧 １．概要 新日本無線は電子機器の軽薄短小化更には自動実装による省力化のニーズに対して、スティックケース、粘着テーピング、エンボステーピ ング、トレイ及びビニール袋にて出荷しております。

50PCS

Abstract: DIP18 DIP20 DIP32 DIP40 SDIP22 SDIP24 SDIP28
Contextual Info: 包装仕様一覧 １．概要 新日本無線は電子機器の軽薄短小化更には自動実装による省力化のニーズに対して、スティックケース、エンボステーピング、トレイ及び ビニール袋にて出荷しております。

SS0P24

Abstract: SS0P-24 QFP64-E1 SS0P14 144/QFP64-E1
Contextual Info: csa RECOMMENDED MOUNTING METHOD A • RECONENDED MOUNTING METHOD 1.Solderins Methods The recommended soldering methods for each package are shown in the following table. 1 Recommended Soldering Methods Table Through-Hole mounted device type package PKG TO-92

DIP18

Abstract: DIP20 DIP40 SDIP22 SDIP24 SDIP28 SDIP30
Contextual Info: 包装仕様一覧 １．概要 新日本無線は電子機器の軽薄短小化更には自動実装による省力化のニーズに対して、スティックケース、粘着テーピング、エンボステーピ ング、トレイ及びビニール袋にて出荷しております。

Contextual Info: •SIP/HSIP{POWER TYPE /ZIP/SZIP T0220FP TO-92 ¿ 3 .2 ± 0 .1 n I 2.8 ?T 0.5±0.1 1.27 ! I 0 .45±D. I 1.27 2 .5 4 ± 0 .5 [2 .5 4 ± 0 . 5 Q‘ S ^ a SIPS P ll.8±0.2 2.d±0.2 □ U °-6 U 3 _c I °_'._55±0-1 I I 0.8 0 45±Q. I I".3 2.54 ]2.64 ^ SIPS SIP7

Contextual Info: SONY. C X L 1 5 0 4 M CMOS-CCD 1 H Delay line for NTSC D e s c rip tio n C X L 1 50 4M is a delay line used in conjunction with an external low pass filier. Through P a c k a g e O u tlin e U n it mm 20 pin SOP plastic negative phase input and positive phase output

S4 6ba

Contextual Info: TOSHIBA TLCS-47E Series TMP47C102/202 CMOS 4-Bit Microcontroller The 47C102/202 are high speed and high performance 4-bit single chip microcomputer, integrating ROM, RAM, input/out­ put ports and timer/counters on a chip. The 47C102/202 are the standard type devices in the TLCS-47E series.

T0220FP-5-V5

Contextual Info: Packaging Specifications Monolithic 1C ^ Monolithic ICs _ Quick reference of packaging specifications Package Container type DIP/SDIP Tube container SIP/HSIP/ZIP/SZIP Tube container Packaging specification code Tube container SO P/SSO P/HSO P Paper tape on reel

NJM2366

Abstract: NJM2366G NJM2366V SSOP20
Contextual Info: NJM2366 i « * NJM2366IÌ» £ • *icr*-r. * M » * J | M t Œ £ i/ i3 f r 61/19 mm • P*3S?fitn;iC ef c y i / 1 3 ~ 1 / 1 9 / W 7 X A < B l | | g • 5¡Ü*ICD*E£± • « » * * * • ffi*lW3ÌEA<*£l' • • ' I ' M i t / t v ' r — is SS0P-20

25pcs

Abstract: DIP20 DMP16 SDIP22 SDIP24 SDIP28 SDIP42 SDMP30
Contextual Info: PACKING SPECIFICATION TABLE 1. GENERAL DESCRIPTION NJRC delivers ICs in 4 method of plastic tube container, two kind of Taping, tray and vinyl bag packing. Expect adhesive tape treated anti electrostatic and contain carbon are using as the ESD Electrostatic Discharge

DIP18

Abstract: DIP20 DIP40 SDIP22 SDIP24 SDIP28 SDIP30 QFP-56
Contextual Info: 包装仕様一覧 １．概要 新日本無線は電子機器の軽薄短小化更には自動実装による省力化のニーズに対して、スティックケース、粘着テーピング、エンボステーピ ング、トレイ及びビニール袋にて出荷しております。