SAMSUNG 2012 Search Results

Contextual Info: SPECIFICATION • Supplier : Samsung electro-mechanics • Samsung P/N: RC2012F*CS • Product : Thick - Film chip RESISTOR • Description : 2012, ±1%, 1Ω~1㏁ , 1/8W A. Samsung Part Number RC 2012 F * CS ① ③ ④ ⑤ ② ① Code designation Samsung Thick - Film Chip Resistor

Contextual Info: SPECIFICATION • Supplier : Samsung electro-mechanics • Samsung P/N: RC2012G*CS • Product : Thick - Film chip RESISTOR • Description : 2012, ±2%, 1Ω~1㏁ , 1/8W A. Samsung Part Number RC 2012 G * CS ① ③ ④ ⑤ ② ① Code designation Samsung Thick - Film Chip Resistor

S3FM02G

Contextual Info: S3FM02G 32-Bit CMOS Microcontrollers Revision 1.34 August 2012 User's Manual  2012 Samsung Electronics Co., Ltd. All rights reserved. Important Notice Samsung Electronics Co. Ltd. "Samsung" reserves the right to make changes to the information in this publication

Contextual Info: SPECIFICATION • Supplier :Samsung electro-mechanics • Product : Tantalum capacitor • Samsung P/N : TCSCS0J336MPAR • User Part No : • Description : CAP,TANTAL,33㎌,6.3V,±20%,2012-12 • Date : Aug 23, 2013 1. Samsung Part Number TC ① ① ② ③

chip resistor 2012

Abstract: samsung 2012
Contextual Info: SPECIFICATION • Supplier : Samsung electro-mechanics • Samsung P/N: RC2012J*CS • Product : Thick - Film chip RESISTOR • Description : 2012, ±5%, 1Ω~10㏁ , 1/8W A. Samsung Part Number RC 2012 J * CS ① ③ ④ ⑤ ② ① Code designation

Contextual Info: S3FM02G 32-Bit CMOS Microcontrollers Revision 1.20 October 2011 User's Manual  2011 Samsung Electronics Co., Ltd. All rights reserved. Important Notice Samsung Electronics Co. Ltd. "Samsung" reserves the right to make changes to the information in this publication

MMZ1608S121AT

Abstract: nc10 samsung 45-D2 Samsung ddr2 7SZ14 BA09-00009A INTEL945GMS SMD y8 samsung nc10 bios Socket AM2
Contextual Info: 4 3 1 2 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. Table of Contents D RIMINI CPU : INTEL YONAH-ULV

Q514

Abstract: du508 Samsung ddr2 MIC500 EMI502 BA59-01869A BA09-00009A samsung hd50 d4.0 34C1 mx25l8005m2c-15g
Contextual Info: 4 3 2 1 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. Table of Contents D RIMINI CPU : INTEL YONAH-ULV

ST T4 D560

Abstract: ST D560 T4 ST 1803 DHI B-566 u574 j5512 46d1 BA09-00009A SAMSUNG GDDR3 54B4
Contextual Info: 4 3 2 1 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. Table of Contents CICHLID 3 CPU :Intel Yonah 533/667 Merom

c945 g 528

Abstract: RX781M smd diode ae c604 SLG8SP628VTR 88E8057 RX781 SB700 slg8sp628v 22p smd H8S-2110B
Contextual Info: 4 3 2 1 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. Table of Contents QingDao-D D Model Name PBA Name

AES2501

Abstract: ICS954305 TP960 C703 diode tp1332 VDD3310 TP950 33B3 diode DEBUG32 block diagram of intel 8254 chip
Contextual Info: 4 3 2 1 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. TABLE OF CONTENTS D FIRENZE-R C B CPU : Chip Set :

MEC1308-NU

Abstract: APW7141QAITRG AMD CPU S1g3 rx881 RX881M DIODE SMD AE22 TPS51125 N25 3KV SEC APW7141 mec1308
Contextual Info: 4 3 2 1 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. Table of Contents Page. 1 Page. 2 Page. 3 Page. 4

Contextual Info: ISSUE NO : Rev: DATE OF ISSUE : 2012.11.19 SPECIFICATION MODEL : SPSWH1S16S2G White Side View CUSTOMER : CUSTOMER CHECKED CHECKED APPROVED SAMSUNG ELECTRONICS CO., LTD. DRAWN CHECKED APPROVED SAMSUNG ELECTRONICS CO,.LTD. SAN #24 NONGSEO-DONG, GIHEUNGGIHEUNG-GU,

Contextual Info: ISSUE NO : Rev: DATE OF ISSUE : 2012.11.19 SPECIFICATION MODEL : SPSWH2S25S3G WHITE SIDE VIEW CUSTOMER : CUSTOMER CHECKED CHECKED APPROVED SAMSUNG ELECTRONICS DRAWN CHECKED APPROVED SAMSUNG ELECTRONICS CO,.LTD. SAN #24 NONGSEO-DONG, GIHEUNGGIHEUNG-GU, YONGINYONGIN-CITY,

B30C300

Abstract: 29A4 samsung electronics 10K 34C1 TP678 gfx E3 diode diode 39b2 TP730 NC7SZ175P6X_NL HDR-10P-SMD
Contextual Info: 4 3 2 1 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. Table of Contents Sheet 1. COVER Sheet 2 - 7. DIAGRAM Block/Power & ANNOTATIONS

BA41-00695A

Abstract: TP1274 CONN-50P-FPC Socket AM2 samsung 30 pin lvds diagram 25a44 SMD AC P27 CY28447 samsung electronics ba41 GND103
Contextual Info: 4 3 2 1 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. Table of Contents D Sheet 1. COVER Sheet 2 - 7. DIAGRAM Block/Power & ANNOTATIONS

Contextual Info: ISSUE NO : Rev: DATE OF ISSUE : 2012.11.19 SPECIFICATION MODEL : SPSWH2S26S2G WHITE SIDE VIEW CUSTOMER : CUSTOMER CHECKED CHECKED APPROVED SAMSUNG ELECTRONICS CO., LTD. DRAWN CHECKED APPROVED SAMSUNG ELECTRONICS CO., Ltd. td. SAN #24 NONGSEONONGSEO-DONG, DONG, GIHEUNGGIHEUNG-GU,

K4X2G323PD8GD8

Abstract: K9HFGY8S5A-HCK0 K4H511638JLCCC samsung eMMC 5.0 KLMBG4GE2A-A001 K9K8G08U0D-SIB0 K4X51163PK-FGD8 KLMAG2GE4A k4h561638n-lccc K4G10325FG-HC03
Contextual Info: PRODUCT SELECTION GUIDE Displays, Memory and Storage 2H 2012 Samsung Semiconductor, Inc. Samsung continues to lead the industry with the broadest portfolio of memory products and technology. Its DRAM, flash, mobile, and graphics memory are found in computers—from

Contextual Info: SPECIFICATION • Supplier :Samsung electro-mechanics • Product : Tantalum capacitor • Samsung P/N : TCSHS0J226MPAR • User Part No : • Description : CAP,TANTAL,22㎌,6.3V,±20%,2012-12 • Last Revision Date :December.28.2009 • Date :November 16. 2009

88E8057

Abstract: M82-SCE-XT BA41-00XXXA HDR-10P-1R-SMD RX781M 11070 J2 HDR-4P-1R-SMD R5538 SI2315BDS-T1 U528
Contextual Info: 4 3 2 1 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED 4 BY SAMSUNG. D Cambridge g n l u a s i t m n a e S fid n o

samsung ddr3 ram MTBF

Abstract: KLM2G1HE3F-B001 KLM4G1FE3B-B001 KLMAG2GE4A-A001 k4B2G1646 KLMAG KLM8G2FE3B-B001 K4B2G0446 klm8g k4x2g323pd
Contextual Info: PRODUCT SELECTION GUIDE LCD, Memory and Storage | 1H 2012 + Samsung Semiconductor, Inc. Samsung continues to lead the industry with the broadest portfolio of memory products and technology. Its DRAM, flash, SRAM products are found in computers—from ultra-mobile notebooks

S3FN60D

Abstract: S3FN60D_UM_REV1.30
Contextual Info: S3FN60D USB Remote 32-bit MCU Revision 1.30 January 2012 User's Manual  2012 Samsung Electronics Co., Ltd. All rights reserved. Important Notice Samsung Electronics Co. Ltd. “Samsung” reserves the right to make changes to the information in this publication

Contextual Info: Rev: 0.0 ISSUE NO : DATE OF ISSUE : Feb. 27 2012 SPECIFICATION MODEL : SPFCW04301BL High Power Flash LED CUSTOMER : CUSTOMER : CHECKED CHECKED APPROVED SAMSUNG LED DRAWN CHECKED APPROVED SAMSUNG LED CO,.LTD. Nongseo-dong, Giheung-gu, Yongin-si, Gyeonggi-do, 446-711 KOREA

Contextual Info: Rev: 0.0 ISSUE NO : DATE OF ISSUE : Feb. 27 2012 SPECIFICATION MODEL : SPFCW14311BD High Power Flash LED CUSTOMER : CUSTOMER : CHECKED CHECKED APPROVED SAMSUNG LED DRAWN CHECKED APPROVED SAMSUNG LED CO,.LTD. Nongseo-dong, Giheung-gu, Yongin-si, Gyeonggi-do, 446-711 KOREA