SC555 Search Results

HM51W16405

Contextual Info: Package Information There are four types of package for the Hitachi IC Memories, Plastic Mold DIP, CERDIP, Flat Package and Chip Carrier. Please select a suitable package in consideration o f your circumstance. When you use the package that has the material variation, please write down the package name in a form in

HT 1200-4

Abstract: YAMAICHI ic234 PT740 AB TSSOP YAMAICHI SOCKET FP-20-0.65-01 IC51-1444-1354-7 PT817 Enplas drawings IC51-2084-1052-11 IC 7418 IC51-0242-1341
Contextual Info: Hitachi Semiconductor Package Data Book ADE–410–001B 3rd Edition March/97 Semiconductor & Integrated Circuit Devision, Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher functional

SC 2272

Contextual Info: Package Information There are four types of package for the Hitachi IC Memories, Plastic Mold DIP, CERDIP, Flat Package and Chip Carrier. Please select a suitable package in consideration o f your circumstance. When you use the package that has the material variation, please write down the package name in a form in

HC912D60

Abstract: 68hc11a8 X68HC805P18PGMR 68HC05P18 68HC711K4 M68HC705E6PGMR* dip 28 68HC05e6 motorola 68hc711K4 programmer 68HC11L6 68hC711KA2
Contextual Info: SG188/D Rev. 2 Microcontroller Development Tool Configuration and Order Information January, 2001 http://www.mcu.motsps.com Development tool information for: 8-Bit 68HC05, 68HC08, and 68HC11 16-Bit 68HC12 and 68HC16 32-Bit 683XX and M•CORE 68HC05 Development Kits

NEC A39A

Abstract: NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B
Contextual Info: IC PACKAGE MANUAL 1991, 1992, 1994, 1996 Document No. C10943XJ6V0IF00 Previous No. IEI-635, IEI-1213 Date Published January 1996 P Printed in Japan CHAPTER 1 PACKAGE OUTLINES AND EXPLANATION CHAPTER 2 CHAPTER 3 1 THROUGH HOLE PACKAGES 2 SURFACE MOUNT PACKAGES

SC-606-B

Abstract: HM62256B MS-024BB HM6207H HM6208H HM6264B HM6287 HM6288 HM9264B 024bb
Contextual Info: Package Information There are four types of package for the Hitachi IC Memories, Plastic Mold DIP, CERDIP, Flat Package and Chip Carrier. Please select a suitable package in consideration of your circumstance. When you use the package that has the material variation, please write down the package name in a form in

HC912D60

Abstract: 68hc811e2 68HC711K4 M68HC11EVBU2 M68SPGMR08 68HC05E6 m68spgmr11 motorola 68hc05 PGMR m68spgmr11 software 68HC705e6
Contextual Info: SG188/D Rev. 1 Microcontroller Development Tool Configuration and Order Information February, 2000 http://www.mcu.motsps.com Development tool information for: 8-Bit 68HC05, 68HC08, and 68HC11 16-Bit 68HC12 and 68HC16 32-Bit 683XX and M•CORE 68HC05/68HC08 Development Kits

Contextual Info: Packing Magazine Name MD300-09A SC-300-7P 24 pin DIP 300 mil 24 13 1 12 A K I L P J H F G D C N M NOTES 1) Each lead centerline is located within 0.25 mm (0.01 inch) of its true position (T.P.) at maximum material condition. 2) ltem "K" to center of leads when formed parallel.

IC Package Names and Code Designations

Abstract: data sheet IC 7408 7404 not gate ic MSP 044 THERMISTOR enplas otq-100-0.5 IC 7404 7406 IC51-1004-809 ic 7404 datasheet HLP40R ic 7408
Contextual Info: Hitachi Semiconductor Package DATA BOOK ADE 410-001A Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher functional capacity and higher density and developing packages

EDR-7311

Abstract: MS-024BB MO-142BO HN27C256A
Contextual Info: Package Information There are four types of package for the Hitachi IC Memories, Plastic Mold DIP, CERDIP, Flat Package and Chip Carrier. Please select a suitable package in consideration o f your circumstance. When you use the package that has the material variation, please write down the package name in a form in

Contextual Info: Packing Magazine Name MD300-09A SC-300-7P 24 pin DIP 300 mil 24 13 1 12 A K I L P J H G C F D M B N R M NOTES 1) Each lead centerline is located within 0.25 mm (0.01 inch) of its true position (T.P.) at maximum material condition. 2) Item "K" indicates the distance between the center locations

SC-606-B

Abstract: SC-555-24A BP-119 SC-639 MO-142BA MO-061-AB
Contextual Info: Package Information Package Names and Code Designations T he package nam e assigned by the com pany is a package code indicating the shape of the package, the package m aterial, and the num ber o f pins. The diagram below show s the content o f the code designation.

trapper

Abstract: SC517 padp2 cqr trapper MA100T connection EN54-11 JB730 hydrosure EB823 JB720 door bell with security alarm
Contextual Info: CQR | DETECTION Full range of flush & sur face magnetic contacts Mass inertia shock sensors & analysers TRAPPER. intelligent shock detector & analyser w w w. c q r. c o . u k INNOVATIVE SOLUTIONS CQR | DETECTION CQR is one of the major manufacturers of security products in the UK, and as a