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    SG-BGA-6075 Search Results

    SG-BGA-6075 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    84500-102LF
    Amphenol Communications Solutions 300 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
    55714-002LF
    Amphenol Communications Solutions 81 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
    74217-101
    Amphenol Communications Solutions 240 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array Visit Amphenol Communications Solutions
    74390-201
    Amphenol Communications Solutions 400 Position BGA Receptacle, 8mm Component Height, 1.27mm x 1.27mm Array Visit Amphenol Communications Solutions
    55724-001
    Amphenol Communications Solutions 200 Position BGA Receptacle, 6mm Component Height, 1.27mm x 1.27mm Array Visit Amphenol Communications Solutions

    SG-BGA-6075 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SG-BGA-6075
    Ironwood Electronics GHz BGA Sockets-0.8mm; IC Size X (mm): 8; IC Size Y (mm): 8; IC Array X: 8; IC Array Y: 8; Max Pincount: 64; Top Pitch (mm): 0.8; IC Ball Coplanarity (mm): 0.1; IC Ball Diameter Max (mm): 0.45; IC Ball Height Max (mm): 0.41; IC Ball Height Min (mm): 0.31; IC Size Tolerance (mm): 0.1; IC Total Height Max (mm): 1.5; Max Package Code: BGA64F; Backing Plate: no; Cavity Down: no; Heat Sink: no; IC Top Surface: Flat; Socket Lid: Screws; Part Description: GHz BGA Socket (ZIF)-HD Original PDF