|
SG-BGA-6077
|
|
Ironwood Electronics
|
GHz BGA Sockets-1.0mm; IC Size X (mm): 23; IC Size Y (mm): 23; IC Array X: 22; IC Array Y: 22; Max Pincount: 228; Top Pitch (mm): 1; IC Ball Coplanarity (mm): 0.2; IC Ball Diameter Max (mm): 0.7; IC Ball Height Max (mm): 0.6; IC Ball Height Min (mm): 0.4; IC Size Tolerance (mm): 0.2; IC Total Height Max (mm): 1.56; Max Package Code: BGA228F; Backing Plate: no; Cavity Down: yes; Heat Sink: no; IC Top Surface: Flat; Socket Lid: Swivel; Part Description: GHz BGA Socket (ZIF) |
Original |
PDF
|
66.57KB |
4 |