SG-BGA-6080 |
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Ironwood Electronics
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GHz BGA Sockets-1.0mm; IC Size X (mm): 40; IC Size Y (mm): 40; IC Array X: 39; IC Array Y: 39; Max Pincount: 1521; Top Pitch (mm): 1; IC Ball Coplanarity (mm): 0.2; IC Ball Diameter Max (mm): 0.7; IC Ball Height Max (mm): 0.6; IC Ball Height Min (mm): 0.4; IC Size Tolerance (mm): 0.2; IC Total Height Max (mm): 3.52; Max Package Code: Backing Plate: yes; Cavity Down: no; Heat Sink: yes; IC Top Surface: Flat; Socket Lid: Screws; Part Description: GHz BGA Socket (ZIF) |
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