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    SG-BGA-6177 Search Results

    SG-BGA-6177 Result Highlights (4)

    Part ECAD Model Manufacturer Description Download Buy
    TMS320C28345ZEPQ
    		Texas Instruments Delfino Microcontroller 256-BGA Visit Texas Instruments
    TMS320C28346ZEPQ
    		Texas Instruments Delfino Microcontroller 256-BGA Visit Texas Instruments
    TMS320C28342ZEPQ
    		Texas Instruments Delfino Microcontroller 256-BGA Visit Texas Instruments
    TMS320C28343ZEPQ
    		Texas Instruments Delfino Microcontroller 256-BGA Visit Texas Instruments

    SG-BGA-6177 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF PDF Size Page count
    SG-BGA-6177
    		Ironwood Electronics GHz BGA Sockets-1.0mm; IC Size X (mm): 27; IC Size Y (mm): 27; IC Array X: 26; IC Array Y: 26; Max Pincount: 676; Top Pitch (mm): 1; IC Ball Coplanarity (mm): 0.15; IC Ball Diameter Max (mm): 0.78; IC Ball Height Max (mm): 0.6; IC Ball Height Min (mm): 0.4; IC Size Tolerance (mm): 0.2; IC Total Height Max (mm): 3.32; Max Package Code: BGQ676; Backing Plate: yes; Cavity Down: no; Heat Sink: no; IC Top Surface: Mold Cap; Socket Lid: Screws; Part Description: GHz BGA Socket (ZIF) Original PDF 181.8KB 5