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    SG-BGA-6225 Search Results

    SG-BGA-6225 Result Highlights (4)

    Part ECAD Model Manufacturer Description Download Buy
    TMS320C28346ZEPQ
    		Texas Instruments Delfino Microcontroller 256-BGA Visit Texas Instruments
    TMS320C28342ZEPQ
    		Texas Instruments Delfino Microcontroller 256-BGA Visit Texas Instruments
    TMS320C28345ZEPQ
    		Texas Instruments Delfino Microcontroller 256-BGA Visit Texas Instruments
    TMS320C28343ZEPQ
    		Texas Instruments Delfino Microcontroller 256-BGA Visit Texas Instruments

    SG-BGA-6225 Datasheets (1)

    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    SG-BGA-6225
    		Ironwood Electronics GHz BGA Sockets-1.0mm; IC Size X (mm): 18; IC Size Y (mm): 20; IC Array X: 17; IC Array Y: 19; Max Pincount: 323; Top Pitch (mm): 1; IC Ball Coplanarity (mm): 0.2; IC Ball Diameter Max (mm): 0.68; IC Ball Height Max (mm): 0.57; IC Ball Height Min (mm): 0.41; IC Size Tolerance (mm): 0.2; IC Total Height Max (mm): 1.7; Max Package Code: BGA323; Backing Plate: yes; Cavity Down: no; Heat Sink: no; IC Top Surface: Mold Cap; Socket Lid: Swivel; Part Description: GHz BGA Socket (ZIF) Original PDF 75.86KB 4