SI 3102 V Search Results

TLE3103

Contextual Info: 47E D ~ v -*/ ; ‘- • fl235b05 00348^3 1 H S I E G SIEMENS AKTIENSESELLSCHAF 'T - \ *Ò TLE 3101 TLE 3102 TLE 3103 TLE 3104 Features • • • • • • • • Bipolar IC Direct supply from ac line possible Low power consum ption, typically 2.4 mA

photon coupled interrupter 3101

Abstract: photon coupled interrupter photon coupled interrupter nte 3100 npn phototransistor npn photo interrupter module darlington IR phototransistor Si pin photodiode module npn 940 T018 T046
Contextual Info: INFRARED EMITTING DIODES NTE type Number 3017 3027 3028 3029A 3099 30001 Typical Total External Radiated Power mW Diagram Number Description PN Gallium Arsenide Bi-Directional Bi-Directional Maximum Forward Voltage (Volts) Reverse Voltage (Volts) DC Forward

Contextual Info: 10 S D -73251-046 MATERIALS AND FINISHES: .312 BODY. NUT. & LOCKWASHER ST. STEEL LOCKWASHER.312, HEX 7.92 FINISH - SEE TABULATION ¡HEX CENTER CONTACT BERYLLIUM COPPER PER ASTM B196, PLATED GOLD .000050 INCHES MIN PER MIL-G-45204. 250 6.35 0 ^ ^ M IN CRIMP TUBE, BRASS PER ASTM-B16,

Contextual Info: Figure 16. Turn-Off Time vs. Temperature Ambient Temperature °C Figure 14. Switch Offset Voltage vs. LED Current Ambient Temperature (°C) Figure 17. Turn-On Time vs. LED Current 10 20 30 40 50 LED Forward Current (mA) LED Forward Current (mA) Figure 15. Turn-on Time vs. Temperature

SMA-JR

Contextual Info: SD-73251-084 MATERIALS AND FINISHES: BODY STAINLESS STEEL PASSIVATED CENTER CONTACT BERYLLIUM COPPER PLATED GOLD 375 r INSULATOR TEFLON GROUNDING RING ACCEPTS 0.020/0.51 PIN .110/2.79 MAX. DEPTH 7.59 PART n 73251-0840 MIL-STD-348, FIGURE 310-2 INTERFACE

MIL-STD-348

Contextual Info: SD-73386-006 MATERIALS AND FINISHES: BODY STAINLESS STEEL PASSIVATED CENTER CONTACT BERYLLIUM COPPER PLATED GOLD INSULATOR TEFLON 1.000 REF 25.40 .500/12.70 ACROSS FLATS- PART « 73386-0062 MIL-STD-348, FIGURE 313-2 TNC INTERFACE MIL-STD-348, FIGURE 310-2

Contextual Info: Tem ic SÌ9925DY Se m ic o n d u c to r s Dual N-Channel Enhancement-Mode MOSFET Product Summary V d s V 20 rDS(on) (Q ) I d (A) 0.05 @ Vqs = 4.5 V ±5.0 0.06 @ VGs = 3.0 V ±4.2 0.08 @ Vos = 2.5 V ±3.6 u D2 D2 1 U SO-8 Si [ T ~8~1 D, Gì T 1 G l D, Ï1 0 —

U235

Contextual Info: CALOGIC CORP 4ÖE D 1044322 000030b 5 «CGC calocflc CORPORATION T m-m U231-U235 FEATURES A B S O L U T E MAXIMUM RATINGS Ta - 25°C unless otherwise specified • G oo d M atching C h aracteristics Gate-Source or Gate-Drain Voltage(Note 1) .-50V

U232

Abstract: U231 U233 U235 to-71 transistor U234 XU232 XU233 XU234 TRANSISTOR TO-71
Contextual Info: CALOGIC CO RP M8E D CO RPORA TION 1SMM3SS 0000381. 5 « C G C Dual N-Channel JFET Genera! Purpose Amplifier o U231-U235 FEATURES A B S O L U T E MAXIMUM RATINGS Ta - 25°C unless otherwise specified • G oo d Matching Characteristics Gate-Source or Gate-Drain Voltage (Note 1) . -50V

Contextual Info: OEssc-'.’ilO pop? use ;• OATS f i E OVEO ^•L S -2 2-S i| />•/'•.* . ^• — .— *,i .G. .005 SP C -6 !,S : £UTRV C M '- ^ E T g R I1 IK IM U H ~ÔWÏ C O N TAC T 02 1 RGCOMMENDSD MOUN'TiNG HOLE LOCK W ~ S HE R ' 0 ' PiK'G electrical TTc^'ncrT4"óebanc<i < 5>viìsr* 55“

Contextual Info: T M S 3101 LC, N C - D U A L 100-BIT S T A T I C S H IF T RE G I S T ER T M S 3102 LC. N C - D U A L 80-BIT STA TI C S H I F T R E G I S T E R T M S 3103 LC, N C - D U A L 64-BIT S T A T I C S H IF T R E G I S T E R features • £ DC to 2.5-M H z operation

Contextual Info: SD-73251-086 MATERIALS AND FINISHES: BODY STAINLESS STEEL PASSIVATED CENTER CONTACT BERYLLIUM COPPER PLATED GOLD 375, INSULATOR TEFLON GROUNDING RING ACCEPTS 0.018/0.46 PIN .110/2.79 MAX. DEPTH 7.59 PART » 73251-0860 MIL-STD-348, FIGURE 310-2 INTERFACE

Contextual Info: SD-73251-090 MATERIALS AND FINISHES: BODY STAINLESS STEEL PASSIVATED CENTER CONTACT BERYLLIUM COPPER PLATED GOLD 375, INSULATOR TEFLON GROUNDING RING ACCEPTS 0.012/0.30 PIN .110/2.79 MAX. DEPTH 7.59 PART » 73251-0900 MIL-STD-348, FIGURE 310-2 INTERFACE

Contextual Info: SD-73251-088 MATERIALS AND FINISHES: BODY STAINLESS STEEL PASSIVATED CENTER CONTACT BERYLLIUM COPPER PLATED GOLD 375, INSULATOR TEFLON GROUNDING RING ACCEPTS 0.015/0.38 PIN .110/2.79 MAX. DEPTH 7.59 PART » 73251-0880 MIL-STD-348, FIGURE 310-2 INTERFACE

1j63

Contextual Info: SD-73251-080 MATERIALS AND FINISHES: BODY STAINLESS STEEL PASSIVATED .500 SO 12.70 CENTER CONTACT BERYLLIUM COPPER PLATED GOLD INSULATOR TEFLON .340 TYP 8.64 GROUNDING RING ACCEPTS 0.018/0.46 PIN .110/2.79 MAX. DEPTH 7.59 PART » 73251-0800 MIL-STD-348, FIGURE 310-2 INTERFACE

Contextual Info: SD-73251-096 MATERIALS AND FINISHES: BODY STAINLESS STEEL PASSIVATED CENTER CONTACT BERYLLIUM COPPER PLATED GOLD INSULATOR TEFLON .190 4.83 GROUNDING RING .400 10.16 ,5 5 0 13.97 ACCEPTS 0.020/0.51 PIN .110/2.79 MAX. DEPTH 7.59 PART » 73251-0960 MIL-STD-348, FIGURE 310-2 INTERFACE

Contextual Info: SD-73251-102 MATERIALS AND FINISHES: BODY STAINLESS STEEL PASSIVATED CENTER CONTACT BERYLLIUM COPPER PLATED GOLD INSULATOR TEFLON .190 4.83 GROUNDING RING .400 10.16 ,5 5 0 13.97 ACCEPTS 0.012/0.30 PIN .110/2.79 MAX. DEPTH 7.59 PART » 73251-1020 MIL-STD-348, FIGURE 310-2 INTERFACE

shift register ttl

Abstract: A 3101 8 pin td 3101 n D021 PW02 SN74I
Contextual Info: T M S 3101 LC, N C -DUAL 100-BIT STATIC SHIFT REGISTER T M S 3102 LC, N C -DUAL 80-BIT STATIC SHIFT REGISTER T M S 3103 LC, N C -DUAL 64-BIT STATIC SHIFT REGISTER features • > z DC to 2.5-M H z operation • Low power dissipation § 3 „•< • D irect interface w ith D T L /T T L

1j63

Contextual Info: SD-73251-092 MATERIALS AND FINISHES: BODY STAINLESS STEEL PASSIVATED CENTER CONTACT BERYLLIUM COPPER PLATED GOLD INSULATOR TEFLON GROUNDING RING ACCEPTS 0.018/0.46 PIN .110/2.79 MAX. DEPTH 7.59 PART » 73251-0920 MIL-STD-348, FIGURE 310-2 INTERFACE P S-89675-2910

Contextual Info: SD-73251-082 MATERIALS AND FINISHES: BODY STAINLESS STEEL PASSIVATED .500 SO 12.70 CENTER CONTACT BERYLLIUM COPPER PLATED GOLD INSULATOR TEFLON .340 TYP 8.64 GROUNDING RING ACCEPTS 0.015/0.38 PIN .110/2.79 MAX. DEPTH 7.59 PART » 73251-0820 MIL-STD-348, FIGURE 310-2 INTERFACE

Contextual Info: SD-73251-100 MATERIALS AND FINISHES: BODY STAINLESS STEEL PASSIVATED CENTER CONTACT BERYLLIUM COPPER PLATED GOLD INSULATOR TEFLON .190 4.83 GROUNDING RING .400 10.16 ,550 13.97 ACCEPTS 0.015/0.38 PIN .110/2.79 MAX. DEPTH 7.59 PART » 73251-1000 MIL-STD-348, FIGURE 310-2 INTERFACE

4-Hole Flange Mount Jack Receptacle extended

Abstract: ASTM-582 SD-73251-041
Contextual Info: SD-73251-041 1/ MATERIALS AND FINISHES: BODY STEEL PER ASTM-582, PASSIVATED CENTER CONTACT BERYLLIUM COPPER PER ASTM-B196, PLATED GOLD .000050 INCHES MIN PER ASTM-G -45204 PART » 73251-0410 MIL-STD-348, FIGURE 310-2 INTERFACE P S -896 75-2 820 SPECIFICATION

Contextual Info: SD-73251-098 MATERIALS AND FINISHES: BODY STAINLESS STEEL PASSIVATED CENTER CONTACT BERYLLIUM COPPER PLATED GOLD INSULATOR TEFLON .190 4.83 GROUNDING RING .400 10.16 ,5 5 0 13.97 ACCEPTS 0.018/0.46 PIN .110/2.79 MAX. DEPTH 7.59 PART » 73251-0980 MIL-STD-348, FIGURE 310-2 INTERFACE

SD-73251-042

Contextual Info: SD-73251-042 MATERIAL5 AND FINISHES: BODY STAINLESS STEEL PASSIVATED 1080 REF 27.43 CENTER CONTACT BERYLLIUM COPPER PLATED GOLD INSULATOR TEFLON .481 12.21 .625 15.88 REF PLANE PART » 73251-0420 MIL-STD-348, FIGURE 310-2 INTERFACE P S -896 75-2 820 ELECTRO/MECH PERFORMANCE