Untitled
Abstract: No abstract text available
Text: HV3 . HV5 HV3 . HV5 Fast Switching High Voltage Si-Rectifiers Schnelle Si-Hochspannungs-Gleichrichter Version 2007-07-02 HV3 Nominal current Nennstrom HV5 200 mA Repetitive peak reverse voltage Periodische Spitzensperrspannung +0.5 Ø3 -0.1 Ø 0.8±0.05
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DO-41
DO-15
UL94V-0
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Untitled
Abstract: No abstract text available
Text: HV3, HV5 Fast Switching High Voltage Si-Rectifiers Schnelle Si-Hochspannungs-Gleichrichter Version 2004-11-23 DO-41 DO-15 Type ±0.5 62.5 ±0.05 200 mA Repetitive peak reverse voltage Periodische Spitzensperrspannung Plastic case Kunststoffgehäuse 6.3 ±0.1
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DO-41
DO-15
UL94V-0
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PDF
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Untitled
Abstract: No abstract text available
Text: HV3 . HV6 HV3 . HV6 Fast Switching High Voltage Si-Rectifiers Schnelle Si-Hochspannungs-Gleichrichter Version 2008-04-09 HV3 Nominal current Nennstrom HV5, HV6 200 mA Repetitive peak reverse voltage Periodische Spitzensperrspannung +0.5 Ø3 -0.1 Ø 0.8±0.05
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DO-41
DO-15
UL94V-0
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PDF
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Untitled
Abstract: No abstract text available
Text: HV3 . HV5 HV3 . HV5 Fast Switching High Voltage Si-Rectifiers Schnelle Si-Hochspannungs-Gleichrichter Version 2006-11-23 HV3 HV5 Nominal current Nennstrom 200 mA Repetitive peak reverse voltage Periodische Spitzensperrspannung Ø 3+0.5 Ø 0.8±0.05 Plastic case
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DO-41
DO-15
UL94V-0
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PDF
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Untitled
Abstract: No abstract text available
Text: HV3 . HV5 HV3 . HV5 Fast Switching High Voltage Si-Rectifiers Schnelle Si-Hochspannungs-Gleichrichter Version 2006-04-27 HV3 HV5 ±0.1 Plastic case Kunststoffgehäuse 1500.2000 V HV3 HV5 DO-41 DO-15 Weight approx. Gewicht ca. 6.3 Type ±0.5 62.5 -0.1
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DO-41
DO-15
UL94V-0
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PDF
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HV5622
Abstract: No abstract text available
Text: Supertex inc. HV5622 Die Specification Pad Layout 24 13 14 15 16 12 17 18 19 20 21 22 23 25 26 11 27 10 9 28 8 29 7 30 6 31 5 32 4 33 3 34 2 35 1 0,0 45 44 43 42 41 40 39 38 37 Back Side Bonding Pad Material GND Al/Cu/Si 36 Die Specifications Die Dimensions
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HV5622
HV5622
A031110
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PDF
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HV5522
Abstract: No abstract text available
Text: Supertex inc. HV5522 Die Specification Pad Layout 24 13 14 15 16 12 17 18 19 20 21 22 23 25 26 11 27 10 9 28 8 29 7 30 6 31 5 32 4 33 3 34 2 35 1 0,0 45 44 43 42 41 40 39 38 37 Back Side Bonding Pad Material GND Al/Cu/Si 36 Die Specifications Die Dimensions
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HV5522
HV5522
A031110
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PDF
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HV5530
Abstract: No abstract text available
Text: Supertex inc. HV5530 Die Specification Pad Layout 24 13 14 15 16 12 17 18 19 20 21 22 23 25 26 11 27 10 9 28 8 29 7 30 6 31 5 32 4 33 3 34 2 35 1 0,0 45 44 43 42 41 40 39 38 37 Back Side Bonding Pad Material GND Al/Cu/Si 36 Die Specifications Die Dimensions
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HV5530
HV5530
A031110
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PDF
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IT 153
Abstract: HV5122
Text: Supertex inc. HV5122 Die Specification Pad Layout 24 13 14 15 16 12 17 18 19 20 21 22 23 25 26 11 27 10 9 28 8 29 7 30 6 31 5 32 4 33 3 34 2 35 1 0,0 45 44 43 42 41 40 39 38 37 Back Side Bonding Pad Material GND Al/Cu/Si 36 Die Specifications Die Dimensions
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HV5122
HV5122
A031110
IT 153
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PDF
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M81500
Abstract: AG3G DD1800 AG3B by12 AG3M DD1200 DD1400 DD1600 DD300
Text: Package 6.3 16 2 21 65±0.5 6.3±0.1 Type Ø 3±0.05 62.5±0.5 ±0.05 Ø 1.2 Si-A 3000/1350-2.5 23 ±0.05 Ø 0.8 36 -0.1 5.1 Type ±0.5 62.5 12±0.5 24+3 55 Voltage VRRM [V] 24+3 6.5±0.5 27 27 Voltage VRRM [V] M8 HV1.5 0.5A 1500 1500 1500 2000 HV2 (0.5A)
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DD300
DD600
SI-A1125/500-6
SI-A1750/775-4
DD1200
DD1000
DO-15
DO-41
M81500
AG3G
DD1800
AG3B
by12
AG3M
DD1200
DD1400
DD1600
DD300
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PDF
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hv5812wg
Abstract: No abstract text available
Text: Supertex inc. HV5812 20-Channel, Serial-Input, Vacuum-Fluorescent Display Driver for Anode/Grid General Description Features ►► ►► ►► ►► ►► ►► ►► HVCMOS technology for high performance Operating voltage up to 80V High speed source driver
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20-Channel,
HV5812
HV5812
20-bit
DSFP-HV5812
B040811
hv5812wg
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PDF
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Untitled
Abstract: No abstract text available
Text: HV5812 20-Channel, Serial-Input, Vacuum-Fluorescent Display Driver for Anode/Grid General Description Features ► ► ► ► ► ► ► HVCMOS technology for high performance Operating voltage of to up to 80V High speed source driver 5.0V CMOS logic circuitry
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HV5812
20-Channel,
HV5812
20-bit
DSFP-HV5812
A032409
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PDF
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diagram
Abstract: HV5812PJ HV5812P HV5812 B0410
Text: Supertex inc. HV5812 20-Channel, Serial-Input, Vacuum-Fluorescent Display Driver for Anode/Grid General Description Features ► ► ► ► ► ► ► HVCMOS technology for high performance Operating voltage up to 80V High speed source driver 5.0V CMOS logic circuitry
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Original
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HV5812
20-Channel,
HV5812
20-bit
DSFP-HV5812
A032910
diagram
HV5812PJ
HV5812P
B0410
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PDF
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HV5812P
Abstract: 16Strobe diagram HV5812 HV5812PJ 2.65mm A0324 uA78
Text: HV5812 20-Channel, Serial-Input, Vacuum-Fluorescent Display Driver for Anode/Grid General Description Features ► ► ► ► ► ► ► HVCMOS technology for high performance Operating voltage of to up to 80V High speed source driver 5.0V CMOS logic circuitry
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Original
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HV5812
20-Channel,
HV5812
20-bit
DSFP-HV5812
A040309
HV5812P
16Strobe
diagram
HV5812PJ
2.65mm
A0324
uA78
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PDF
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Untitled
Abstract: No abstract text available
Text: Supertex inc. HV5812 20-Channel, Serial-Input, Vacuum-Fluorescent Display Driver for Anode/Grid Features ►► HVCMOS technology for high performance ►► Operating voltage up to 80V ►► High speed source driver ►► 5.0V CMOS logic circuitry ►► Up to 5.0MHz data input rate
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HV5812
20-Channel,
HV5812
20-bit
DSFP-HV5812
C072413
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PDF
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thermoelectric generator
Abstract: THERMOELECTRIC POWER GENERATOR eTEG transformer 30 mW of resistor of 1.5 K thick film heater 15VOC
Text: eTEGTM HV56 Power Generator Evaluation Kit V.5 eTEG HV5 56 Evaluatio on Kit Description: i i The eTEG HV56 Evaluation Kit is an easy-touse, self-contained kit for conducting desktop demonstrations of Nextreme’s HV56 TEG device. The evaluation kit consists of the following:
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APS0021
thermoelectric generator
THERMOELECTRIC POWER GENERATOR
eTEG
transformer 30 mW
of resistor of 1.5 K
thick film heater
15VOC
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PDF
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HV514
Abstract: No abstract text available
Text: HV514 Die Specification Pad Layout 5 6 7 8 9 10 11 12 13 4 14 3 2 16 17 1 0,0 25 24 23 22 21 20 19 18 Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 134 91 20 ± 1.0 None 1 (mils) HV514 1 (mils) Back Side Bonding Pad
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HV514
HV514
A013009
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PDF
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B0411
Abstract: V518P Top marks EB
Text: Supertex inc. HV518 32-Channel Vacuum-Fluorescent Display Driver Features General Description ► ► ► ► ► ► The HV518 is designed for vacuum fluorescent or DC plasma applications, where it can serve as a segment, digit or matrix display driver. Each device has 32 outputs, 32 latches and a
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32-Channel
HV518
HV518
32-bit
DSFP-HV518
B041111
B0411
V518P
Top marks EB
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PDF
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Untitled
Abstract: No abstract text available
Text: Supertex inc. HV518 32-Channel Vacuum-Fluorescent Display Driver Features General Description The HV518 is designed for vacuum luorescent or DC plasma applications, where it can serve as a segment, digit or matrix display driver. Each device has 32 outputs, 32 latches and a
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HV518
32-Channel
HV518
32-bit
DSFP-HV518
B041111
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PDF
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Untitled
Abstract: No abstract text available
Text: Supertex inc. HV518 32-Channel Vacuum-Fluorescent Display Driver Features ► ► ► ► ► ► 32 output lines 90V output swing Active pull-down Latches on all outputs Up to 6.0MHz @ VDD = 5.0V -40°C to +85°C operation Applications ► Vacuum flourescent displays
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HV518
32-Channel
HV518
32-bit
DSFP-HV518
C072413
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PDF
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HV509
Abstract: No abstract text available
Text: HV509 Die Specification Pad Layout 17 16 18 19 20 15 14 21 13 12 22 11 10 23 9 8 24 7 6 25 5 4 26 3 2 0,0 1 29 28 27 Die Specifications Die Dimensions Device Length1 Width1 Thickness mils Back Side Metal 94 58 20 ± 1.0 None (mils) HV509 (mils) Back Side
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HV509
HV509
A020509
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PDF
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HV514
Abstract: Bl 370
Text: Supertex inc. HV514 Die Specification Pad Layout 5 6 7 8 9 10 11 12 13 4 14 3 2 16 0,0 17 1 25 24 23 22 21 20 19 18 Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 134 91 19 - 28 None 1 (mils) HV514 1 (mils) 2 Back
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HV514
HV514
A031110
Bl 370
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HV509
Abstract: No abstract text available
Text: Supertex inc. HV509 Die Specification Pad Layout 17 18 16 19 20 15 14 21 13 12 22 11 10 23 9 8 24 7 6 25 5 4 26 3 2 1 0,0 28 29 27 Die Specifications Die Dimensions Device Length Width Thickness mils Back Side Metal 94 58 19 - 28 None 1 (mils) HV509 Note:
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HV509
HV509
A031110
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PDF
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Untitled
Abstract: No abstract text available
Text: OUTLINE NO ; cJK l w AMP^ - o H O U SI N G ±0.1 •«>1. 1 22.1 -gH >. CIRCUIT :W: ;£ : : 3/a : : OOUl £ - G : OF H E A D E R D I A 1. 1 ± 0 .1 3PLACES ±0.1 XJl>~7k-JV 2 - 0 3 _ DI A 3 ± 0 . 1 2PLACES 5 9 y F 2-04-M IN ROUND D IA 4M IN
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OCR Scan
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2-04-M
ECO-11-005030
14APK
20/MAR/
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PDF
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