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    SIDC50D60C8 Search Results

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    SIDC50D60C8 Price and Stock

    Infineon Technologies AG SIDC50D60C8X1SA1

    Diode Switching 200A DIE Wafer - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIDC50D60C8X1SA1)
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    Avnet Americas SIDC50D60C8X1SA1 Waffle Pack 20 Weeks 4,680
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    EBV Elektronik SIDC50D60C8X1SA1 21 Weeks 1
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    SIDC50D60C8 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    Contextual Info: SIDC50D60C8 Fast switching diode chip in Emitter Controlled 3 -Technology A Features: • 600V Emitter Controlled 3 technology 70 µm chip • soft, fast switching • low reverse recovery charge • small temperature coefficient This chip is used for: • Power module


    Original     		SIDC50D60C8 L4032M, PDF