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    SIDE BRAZED CERAMIC DUAL-IN-LINE PACKAGES Search Results

    SIDE BRAZED CERAMIC DUAL-IN-LINE PACKAGES Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    SIDE BRAZED CERAMIC DUAL-IN-LINE PACKAGES Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    LT1460BCS3-10

    Abstract: marking code LTGG LTGF marking code sot 23 MARK LTGG LTKD MARKING CODE ltbw LM 3937 LT1460BCS3-2 LT1521CS8-3 LTHS
    Text: PACKAGE PACKAGE CROSSDIMENSIONS REFERENCE LCC METAL CAN CERDIP Ceramic Dual-In-Line METAL CANS SSOP Shrink Small Outline TSSOP Thin Shrink Small Outline SIDE BRAZED PACKAGE OUTLINE DESCRIPTION LTC NSC MOT TI LINFIN MAXIM 8-Lead Side Brazed Hermetic D8 D


    Original     		PDF 20-Lead 20-Lead 28-Lead LT1613CS5 LT1615CS5 LT1615CS5-1 LT1617CS5 LT1617CS5-1 LT1761ES5-1 LT1761ES5-2 LT1460BCS3-10 marking code LTGG LTGF marking code sot 23 MARK LTGG LTKD MARKING CODE ltbw LM 3937 LT1460BCS3-2 LT1521CS8-3 LTHS

    DD 127 D TRANSISTOR

    Abstract: FK 231 SA 220 transistor fn 1016 LTC DWG FN 1016 dp 502 t TO 220 MOT E SO18 TI 3-Lead Plastic DD Pak ltc m 5-Lead Plastic DD Pak ltc Q
    Text: PACKAGE PACKAGE CROSSDIMENSIONS REFERENCE LCC METAL CAN CERDIP Ceramic Dual-In-Line METAL CANS SSOP Shrink Small Outline TSSOP Thin Shrink Small Outline SIDE BRAZED PACKAGE OUTLINE DESCRIPTION LTC NSC MOT TI LINFIN MAXIM 8-Lead Side Brazed Hermetic D8 D


    Original     		PDF 20-Lead 20-Lead 28-Lead O-226) DD 127 D TRANSISTOR FK 231 SA 220 transistor fn 1016 LTC DWG FN 1016 dp 502 t TO 220 MOT E SO18 TI 3-Lead Plastic DD Pak ltc m 5-Lead Plastic DD Pak ltc Q

    Untitled

    Abstract: No abstract text available
    Text: 3.0 ORDERING INFORMATION RadHard MSI - 14-Lead Packages: Military Temperature Range UT54 * * - * * * * Lead Finish: A = Solder (C) = Gold (X) = Optional Screening: (C) = Mil Temp Package Type: (P) = 14-lead ceramic side-brazed DIP (U) = 14-lead ceramic bottom-brazed dual-in-line Flatpack


    Original     		PDF 14-Lead 16-lead 20-lead MIL-PRF-38535

    Untitled

    Abstract: No abstract text available
    Text: Precision, ±5 g, Dual-Axis, High Temperature iMEMS Accelerometer ADXL206 FEATURES GENERAL DESCRIPTION High performance, dual-axis accelerometer on a single IC −40°C to +175°C ambient temperature range Long life: guaranteed 1000 hours at TA = 175°C 13 mm x 8 mm × 2 mm side-brazed ceramic dual in-line


    Original     		PDF ADXL206 ADXL206 ADXL206HDZ 07-08-2010-B D09600-0-4/11

    Untitled

    Abstract: No abstract text available
    Text: Precision, ±5 g, Dual-Axis, High Temperature iMEMS Accelerometer ADXL206 FEATURES GENERAL DESCRIPTION High performance, dual-axis accelerometer on a single IC −40°C to +175°C ambient temperature range Long life: guaranteed 1000 hours at TA = 175°C 13 mm x 8 mm × 2 mm side-brazed ceramic dual in-line


    Original     		PDF ADXL206 ADXL206 07-08-2010-B ADXL206HDZ D09600-0-4/11

    AA10

    Abstract: PIC16C54 32816 C038A
    Text: PACKAGING Commercial/Industrial Outlines and Parameters PART NUMBER SUFFIX DESIGNATIONS: Examples: XXXXXXXXXX - XX X/XX XXX QTP, SQTP, or ROM Code or Special Requirements Case D J K L P S W CB JN JW PQ SJ SL SM SN SO SP SS TS VS 27C256T - 15I/J PIC16C54 - RCI/SO


    Original     		PDF 27C256T 15I/J PIC16C54 14-Lead DS00049F-page AA10 32816 C038A

    191 ISOLATION TRANSFORMER

    Abstract: HI-1567PSI TQ1553 HI-1567 TQ1553-2 HI-1568 HI-1569 Holt Applications Note AN-500
    Text: HI-1567, HI-1568 MIL-STD-1553 / 1760 5V Monolithic Dual Transceivers November 2004 DESCRIPTION PIN CONFIGURATIONS To minimize the package size for this function, the transmitter outputs are internally connected to the receiver inputs, so that only two pins are required for connection to


    Original     		PDF HI-1567, HI-1568 MIL-STD-1553 HI-1569 MIL-STD-1553A MIL-STD-1760, 44-pin 20-PIN 191 ISOLATION TRANSFORMER HI-1567PSI TQ1553 HI-1567 TQ1553-2 HI-1568 Holt Applications Note AN-500

    HI-1573PST

    Abstract: HI-1573PSI HI-1573PCT HI-1573 hi-1573pci HI-1574PCT HI-1573CDM HI_1573PSI HI1573PSI HI-1573CDI
    Text: HI-1573, HI-1574 MIL-STD-1553 3.3V Monolithic Dual Transceivers May 2003 DESCRIPTION PIN CONFIGURATIONS To minimize the package size for this function, the transmitter outputs are internally connected to the receiver inputs, so that only two pins are required for connection to


    Original     		PDF HI-1573, HI-1574 MIL-STD-1553 MIL-STD-1553A 44-pin 20-PIN HI-1573PST HI-1573PSI HI-1573PCT HI-1573 hi-1573pci HI-1574PCT HI-1573CDM HI_1573PSI HI1573PSI HI-1573CDI

    HI1574PSI

    Abstract: 1573PCI HI1573PS HI-1573PCT HI-1574CDI HI-1573CDI
    Text: HI-1573, HI-1574 MIL-STD-1553 3.3V Monolithic Dual Transceivers August 2005 DESCRIPTION PIN CONFIGURATIONS To minimize the package size for this function, the transmitter outputs are internally connected to the receiver inputs, so that only two pins are required for connection to


    Original     		PDF HI-1573, HI-1574 MIL-STD-1553 HI-1573 HI-1574 20-PIN 44-PIN HI1574PSI 1573PCI HI1573PS HI-1573PCT HI-1574CDI HI-1573CDI

    HI-1573CDI

    Abstract: Holt Applications Note AN-500 20-PIN HI-1574CDI HI-1574PSI
    Text: HI-1573, HI-1574 MIL-STD-1553 3.3V Monolithic Dual Transceivers March 2004 DESCRIPTION PIN CONFIGURATIONS To minimize the package size for this function, the transmitter outputs are internally connected to the receiver inputs, so that only two pins are required for connection to


    Original     		PDF HI-1573, HI-1574 MIL-STD-1553 HI-1573 HI-1574 20-PIN 44-PIN HI-1573CDI Holt Applications Note AN-500 HI-1574CDI HI-1574PSI

    c1651

    Abstract: 200B 28CXX CLCC footprint 14047 Packaging Diagrams HA 1100 soic
    Text: PACKAGING Commercial/Industrial Outlines and Parameters PART NUMBER SUFFIX DESIGNATIONS: XXXXXXXXXX Device Type Options -XX X Speed or Temperature Frequency /XX XXX Package Pattern Examples: 24LC65-I/SN PIC16C54-RCI/SO Memory Products Mircocontroller Products


    Original     		PDF 24LC65-I/SN PIC16C54-RCI/SO 28CXX 93LCXX DS00049H-page c1651 200B CLCC footprint 14047 Packaging Diagrams HA 1100 soic

    TO metal package aluminum kovar

    Abstract: Side Brazed Ceramic Dual-In-Line Packages ceramic pin grid array package lead finish gold CERAMIC FLATPACK socket CERAMIC LEADLESS CHIP CARRIER LCC 52 socket metal can equivalent national
    Text: Hermetic Packages National Semiconductor offers a wide variety of ceramic and metal can packages for through-hole and surface mount applications. These ceramic and metal can packages are offered as solutions for high reliability and often high performance applications, and are extensively used in military/


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: HI-3182, HI-3183, HI-3184, HI-3185 HI-3186, HI-3187, HI-3188 February 2001 GENERAL DESCRIPTION The HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187 and HI-3188 bus interface products are silicon gate CMOS devices designed as a line driver in accordance with the ARINC 429 bus


    Original     		PDF HI-3182, HI-3183, HI-3184, HI-3185 HI-3186, HI-3187, HI-3188

    HI-3182

    Abstract: HI-3183 HI-3184 HI-3185 HI-3186 HI-3187 HI-3188 HI-8382 HI-8383 HS-3182
    Text: HI-3182, HI-3183, HI-3184, HI-3185 HI-3186, HI-3187, HI-3188 March 2001 GENERAL DESCRIPTION The HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187 and HI-3188 bus interface products are silicon gate CMOS devices designed as a line driver in accordance with the ARINC 429 bus


    Original     		PDF HI-3182, HI-3183, HI-3184, HI-3185 HI-3186, HI-3187, HI-3188 HI-3182 HI-3183 HI-3184 HI-3185 HI-3186 HI-3187 HI-3188 HI-8382 HI-8383 HS-3182

    3188 diode

    Abstract: 124 008r
    Text: HI-3182, HI-3183, HI-3184, HI-3185 HI-3186, HI-3187, HI-3188 ARINC 429 DIFFERENTIAL LINE DRIVER December 2003 GENERAL DESCRIPTION The HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187 and HI-3188 bus interface products are silicon gate CMOS devices designed as a line driver in accordance with the ARINC 429 bus


    Original     		PDF HI-3182, HI-3183, HI-3184, HI-3185 HI-3186, HI-3187, HI-3188 3188 diode 124 008r

    HEXFETs FETs

    Abstract: I-242 I-239 160 P2 0 075A 5V 2N7335 IRFG110 IRFG9110 JANTXV2N7335 fg91
    Text: Data Sheet No. PD-9.397E INTERNATIONAL RECTIFIER I R HEXFET TRANSISTORS 4PCHANNEL POWER MOSFETb 14 LEAD DUAL-IN-LINE QUAD CERAMIC SIDE BRAZED PACKAGE -100 Volt, 1.4 Ohm (P-Channel) IRFG9HO 2N 7335 JANTXSN7335 JANTXVSN7335 [REF: MIL-S-1S500/59S] Product Summary


    OCR Scan     		PDF IRFG9110 2N7335 JANTXSN7335 JANTXV2N7335 MIL-S-19500/599] I-242 IRFG9110, I-243 HEXFETs FETs I-242 I-239 160 P2 0 075A 5V IRFG110 JANTXV2N7335 fg91

    AX2022

    Abstract: TACT2150 D6142
    Text: TACT2150 512 X 8 CACHE ADDRESS COMPARATOR D 2 9 9 3 . JA N U A R Y 1 9 8 7 - R E V IS E D SEPTEM BER 1967 Address to MATCH Valid Time TACT2150-20 . . . 20 ns max TACT2150-30 . . . 30 ns max DW, JD . OR NT PACKAGE 300-Mil 24-Pin Ceramic Side-Brazed or Plastic Dual-In-Line or Small Outline


    OCR Scan     		PDF TACT2150 300-Mil 24-Pin AX2022 D6142

    Untitled

    Abstract: No abstract text available
    Text: 27C64 M ic r o c h ip 64K 8K x 8 CMOS EPROM FEATURES DESCRIPTION • High speed performance —120 ns access time available • CMOS Technology for low power consumption —20 mA Active current — 100 nA Standby current • Factory programming available


    OCR Scan     		PDF 27C64 27C64 28-Lead, 44-Lead, 10x10mm) bl03201 001DS11 DS00049E

    AY0438/P001

    Abstract: No abstract text available
    Text: AY0438 M ic r o c h ip 32-Segment CMOS LCD Driver FEATURES PIN CONFIGURATION 40-LEAD DUAL INLINE • Drives up to 32 LCD segments of arbitrary configuration • CMOS process for: wide supply voltage range, lowpower operation, high-noise immunity, wide temperature range


    OCR Scan     		PDF AY0438 32-Segment 40-LEAD 28-Lead, 44-Lead, 10x10mm) bl03201 001DS11 DS00049E AY0438/P001

    Untitled

    Abstract: No abstract text available
    Text: $ M 27C512 ic r o c h ip 512K 64K x 8 CMOS EPROM FEATURES DESCRIPTION • High speed performance — 90 ns access time available • CMOS Technology for low power consumption — 35 mA Active current — 100 |iA Standby current • Factory programming available


    OCR Scan     		PDF 27C512 28-pin 32-pin 28-Lead, 44-Lead, 10x10mm) DS00049E

    68A40

    Abstract: timer 6840 Thomson TV tuner module 68B40 EF68A40 EF68A40CM EF68B40 EF68A40JM EF6840CV ds1906
    Text: 1 O THOMSON COMPOSANTS MILITAIRES ET SPATIAUX EF 6840 NMOS PROGRAMMABLE TIMER MODULE PTM DESCRIPTION The EF 6840 is a programmable subsystem component of the 6800 family designed to provide variable system time in­ tervals. The EF6840 has three 16-bit binary counters, three corres­


    OCR Scan     		PDF EF6840 16-bit DSEF6840T/0692 68A40 timer 6840 Thomson TV tuner module 68B40 EF68A40 EF68A40CM EF68B40 EF68A40JM EF6840CV ds1906

    Untitled

    Abstract: No abstract text available
    Text: ^EDI High Density ZIP Electronic Design« Inc. • Superior Vertical Packaging With ever increasing memory speeds and corresponding higher speed drivers, engineers must consider any and all .100" ZIP aspects of board level performance optimization, while also


    OCR Scan     		PDF

    voltage follower

    Abstract: ICL7664 723C 8001C 8001M ICL7660 ICL7663 ICL7665 LH2110 LH2111
    Text: Voltage Followers Type Vos mV Description •in ("A) Slew Output Rate Swing (V/pS) (V) Av (min) 3 dB B/W (V/V) (MHz) Ta (°C) •supp (mA) Packages* 0.999 — — ±10 4.0 - 5 5 , +125 F, T 0.999 — — ±10 — - 5 5 , +125 J, F, T 0.9985 15 30 ±10 4.0


    OCR Scan     		PDF LH2110 LH2310 ICL8069 voltage follower ICL7664 723C 8001C 8001M ICL7660 ICL7663 ICL7665 LH2111

    HI-8482

    Abstract: No abstract text available
    Text: HI-8482 HOLE INTEGRATED CIRCUITS ARINC 429 DUAL LINE RECEIVER PIN CONFIGURATIONS GENERAL DESCRIPTION The HI-8482 bus interface unit is a silicon gate CMOS de­ vice designed as a dual line receiver in accordance with the requirements of the ARINC 429 bus specification. It


    OCR Scan     		PDF HI-8482 HI-8482 RM3183.