SIEMENS PACKAGE OUTLINES Search Results

Siemens Aktiengesellschaft

Contextual Info: Package Outlines Siemens Aktiengesellschaft 245 Summary of Package Outlines Memory Components Siemens Aktiengesellschaft 246 Summary of Package Outlines Siemens Aktiengesellschaft 247 Summary of Package Outlines Memory Modules Siemens Aktiengesellschaft 248

TO-220AB Option E3045 Package

Abstract: TO-220AB Option E3044 Package
Contextual Info: Gehäusemaßbilder Package Outlines SIEMENS Gehäusemaßbilder Package Outlines Maße in mm, wenn nicht anders angegeben (Dimensions in mm, unless otherwise specified) Bild 9 Semiconductor Group Figure 9 135 GehäusemaBbllder Package Outlines SIEMENS - 15 -14.8-

Circuit Diagrams

Abstract: siemens Package Outlines ECONOPACK
Contextual Info: SIEMENS Package Outlines and Circuit Diagrams Fig. 1 W eight: 150 g Dim ensions in mm Fig. 2 W eight: 250 g Dim ensions in mm SIS00026 Sem iconductor Group 302 SIEMENS Package Outlines and Circfuit Diagrams Fig. 3 W eight: 190 g Dim ensions in mm Fig. 4 W eight: 420 g

BUP101

Abstract: bup transistor A 671 transistor
Contextual Info: • 823SbD5 QDSlBb^ 2 O S I E G SIEMENS SIEMENS AKTIENGESELLSCHAF 47E I> r-3 3 -13 BUP101 SIRET Siemens Ring Emitter Transistor VGe = 1000 V /0 =15 A • N channel • Breakdown-proof • Package: TO-218 AA TO P-3 1) Type Ordering code B U P 101 C 6 7 060-A 1000-A 2

MARKING SMD T43

Abstract: siemens Package Outlines Plastic Package siemens Package Outlines smd marking l5 7750a
Contextual Info: Package Outlines SIEMENS Mem ory Com ponents P-DIP-20-2 Plastic Package Plastic dual in-line package P-SOJ-26/20-1 (SMD) Plastic Package (Plastic small outline J-lead) P-SOJ-26/20-5 (SMD) Plastic Package (Plastic dual in-line package) P-SO J-28-2 (SMD) Plastic Package

siemens Package Outlines

Abstract: l20x
Contextual Info: Summary of Types in Alphanumerical Order Semiconductor Group - Addresses Information on Literature Package Outlines SIEMENS P-SOJ-28-2 SMD Plastic Package (small outline J-lead) P-SOJ-40-1 (SMD) Plastic Package (small outline J-lead) P-SOJ-26/24-1 (300 mil) (SMD)

Contextual Info: 47E D ÔE35bOS QG2175S 7 «IS IE G SIEMENS SIEMENS AKTIENGESELLSCHAF 7 ^ j 9 - / 3 BUZ 230 SIPMOS Power MOS Transistor Vos la ^D S on = 1000 V = 5.5 A = 2.0 Q • N channel • FREDFET • Enhancement mode • Package: T O -204A A (T O -3 )1) Type Ordering code

Contextual Info: H ISIE G â235bG5 0020077 s SIEMENS SIEMENS A KT IE NGESELLSCHAF 47E T> T -39-/5 SIMOPAC MOSFET Module ^03 A ^DS on) • • • • • • BSM 121 AR (C) = 200 V = 130 A '=» 20 mfl Power module Single switch N channel Enhancement mode Package with insulated metal base plate

BSM300GA120DN2E3166

Abstract: C67070-A2007-A70 D273 siemens igbt BSM300GA120DN2
Contextual Info: SIEMENS BSM300GA120DN2E3166 IGBT Power Module Preliminary data • Single switch • Including fast free-wheeling diodes • Enlarged diode area • Package with insulated metal base plate Type BSM300GA120DN2E3166 VCE 1200V 430A Package Ordering Code SINGLE SWITCH 1

Contextual Info: SIEMENS BSM150GB120DN2E3166 IGBT Power Module Preliminary data • Half-bridge • Including fast free-wheeling diodes • Enlarged diode area • Package with insulated metal base plate BSM150GB120DN2E3166 h 1200V 210A 111 Type Package Ordering Code HALF-BRIDGE 2

microwave transistor siemens

Abstract: Siemens Microwave A 1887 transistor siemens p1
Contextual Info: SIEMENS HiRel Discrete and Microwave Semiconductors 5 Package Outlines HiRel 5.1 Package Outlines of Diode Packages SYMBOL B B1 D D1 d di F L MILLIMETRES MIN MAX 3.10 3.56 3.00 3.30 1.70 1 30 055 0.65 0.10 0.15 025 0.40 2.40 2.60 5.50 « Anode / D1 Cathode end

BSM50GD60DN2E3226

Contextual Info: SIEMENS BSM50GD60DN2E3226 IGBT Power Module • Power module • 3-phase full-bridge • Including fast free-wheel diodes • Package with insulated metal base plate • E3226: long terminals, limited current per terminal Type VCE lc Package Ordering Code

VQE 13E

Contextual Info: SIEMENS BSM150GB170DN2 E3166 IGBT Power Module Preliminary data • Half-bridge • Including fast free-wheeling diodes • Enlarged diode area • Package with insulated metal base plate • ^G on.min = Ohm Type BSM150GB170DN2 E3166 h Vcz 1700V 220A Package

Contextual Info: SIEMENS BXY 42BA-6 Silicon PIN Diode • Fast switching • Coax package * E SD : Electrostatic discharge sensitive device, observe handling precautions! Type Marking Ordering C ode Pin Configuration Package* B X Y 42BA-6 - Q62702-X146 Í D ki o EHA07001

siemens igbt

Contextual Info: SIEMENS BSM300GA170DN2 E3166 IGBT Power Module Prelim inary data • Half-bridge • Including fast free-wheeling diodes • Enlarged diode area • Package with insulated metal base plate • on.min = 5-6 Ohm Type Kce BSM300GA170DN2 E3166 1700V 440A 1c Package

siemens Package Outlines

Contextual Info: SIEMENS SDA 5650/X Package Outlines P-DIP-14-1 Plastic Dual In-line Package 7ß to2 1.5mex 2.54 0.45 84 -os 7.8 woai 14x 14 8 1 u u y y u a 7 r F? F I Fi_£3_E3-E3-E3. 17.6 . 0.25max Q a. O Index Marking P-DSO-20-1 (Plastic Dual Small Outline Package) 0.35x46'

Contextual Info: SIEMENS 6 SD A 5642-6/X Package Outlines P-DSO-20-1 Plastic Dual Small Outline Package 1,27 0.85•to* a 41MÌ 20x 1) Does not Include plastic or metal protrusion of 0.15 max. per side 2) Does not Include damber protrusion to CL O Sorts of Packing Package outlines for tubes, trays etc. are contained in our

Motorola SMD code

Abstract: PSB21525-N
Contextual Info: SIEMENS High-Level Serial Communications Controller Extended HSCX-TE PSB 21525 Version 2.1 1 CMOS Features Package Besides P-LCC-44-1 and P-MQFP-44-2, the HSCX-TE PSB 21525 is available also in P-TQFP-64-1 package. Type Ordering Code Package PSB 21525 N Q67100-H6672

Contextual Info: SIEMENS BSM150 GT 120 DN2 IGBT Power Module Preliminary data • Solderable Power module • 3-phase full-bridge • Including fast free-wheel diodes • Package with insulated metal base plate Type BSM 150 GT 120 DN2 K ce 1200V 200A Package Ordering Code

NS160H

Contextual Info: SIEMENS BSM 100G D120 DN2 IGBT Power Module Preliminary data • Solderable Power module • 3-phase full-bridge • Including fast free-wheel diodes • Package with insulated metal base plate Type BSM 100 GD 120 DN2 h VCE 1200V 150A Package Ordering Code

VPS053

Contextual Info: SIEMENS Gehäusebauformen Package Outlines Dieses Gehäuse ist nicht mehr lieferbar! This package is not available! / i1— - 4.75 T — VMT05Î60 13.5 — * 1 5.5 i t 1— 2.54 5.2 3 TO-18 Pin Gewicht etwa 0,3 g Approx. weight 0.3 g 1 2 3 S G D Figure 1

Contextual Info: SIEMENS BSM 150 GB 170 DN2 IGBT Power Module Preliminary data • Half-bridge • Including fast free-wheeling diodes • Package with insulated metal base plate • on.min = 10 Ohm BSM 150 GB 170 DN2 1C 1700V 220A LU Type Package Ordering Code HALF-BRIDGE 2

siemens igbt BSM 300

Abstract: GT120DN2
Contextual Info: SIEMENS BSM 200 GT 120 DN2 IGBT Power Module Preliminary data • Solderable Power module • 3-phase full-bridge • Including fast free-wheel diodes • Package with insulated metal base plate Type VCE BSM 200 GT 120 DN2 1200V 300A h Package Ordering Code

siemens igbt BSM 300 gb

Abstract: siemens igbt BSM 300
Contextual Info: SIEMENS BSM 400 GB 60 DN2 IGBT Power Module Preliminary data • Half-bridge • Including fast free-wheeling diodes • Package with insulated metal base plate Type BSM 400 GB 60 DN2 VCE 600V 475A Package Ordering Code HALF-BRIDGE 2 C67070-A2120-A67 Maximum Ratings