SIGNETICS APPLICATION Search Results

SIGNETICS

Abstract: 10X10MM TQFN 72-QFN
Contextual Info: Data Sheet Signetics Signetics Flip Chip Package Data Sheet Signetics QFN Sawn Signetics TQFN, WQFN, and UQFN The Signetics QFN package is a low cost, lead frame packaging solution that offers excellent thermal and electrical performance with minimal costs. Electrical performance

Signetics

Abstract: 19X19 19X19MM
Contextual Info: Data Sheet Signetics Data Sheet Signetics Flip Chip Package Signetics FBGA Signetics Fine Pitch Ball Grid Array Package FBGA is a laminate-based, nearly chip-scale package. They provide excellent electrical performance and can be customized for use in an infinite number of applications. This

SIGNETICS

Abstract: QFP minimum pitch size qfp 0.4mm lead frame QFP lead frame gold wire MQFP
Contextual Info: Data Sheet Signetics Signetics Flip Chip Package Data Sheet Signetics QFP Signetics MQFP, MQFP LOC, MQFP H/S, LQFP, LQFP Sensor, QFP EPP, and TQFP The Signetics QFP package family is a lead frame based package with gull wing style leads on four sides. Signetics offers an array of QFP’s including standard MQFP,

JEDEC TSSOP 28 LEAD PACKAGE

Abstract: SIGNETICS TSSOP 28 Ablestik 12-1
Contextual Info: Signetics Flip Chip Package Data Sheet Signetics Data Sheet Signetics TSSOP Signetics Thin Shrink Small Outline Package Cross Section View of TSSOP Mold Compound Gold Wire Lead frame Die Die Attach Adhesive Signetics’ s TSSOP packages are available in 8 - 56 lead counts with 0.50 / 0.65mm lead

signetics 723

Abstract: 20L8D M7MJ PLUS20R8
Contextual Info: PLUS20L8, PLUS20R8 Signetics PAL -Type Devices Signetics Programmable Logic Product Specification Military Application Specific Products • Series 24 FEATURES DESCRIPTION • Ultra high-speed The Signetics PLUS20XX family is an ultra high-speed version of existing Series

t-con Application Note

Abstract: 8XC752
Contextual Info: Philips Components-Signetics Application Specific Product Section 3 - 80C51 family derivatives 8XC752 OVERVIEW The Signetics 83C752/87C752 is a single-chip control oriented microcontroller fabricated with Signetics high-density CMOS technology minimizing CMOS latch-up sensi­

TSOP 48 thermal resistance

Abstract: TSOP 48 thermal resistance type1 thin TSOP 8x20 package tray TSOP 32 thermal resistance TSOP 48 package tray JEDEC tray standard 13 Ablestik 12-1 signetics TSOP package tray TSOP1-48
Contextual Info: Signetics Flip Chip Package Data Sheet Signetics Data Sheet Signetics TSOP Type 1 Signetics Thin Small Outline Package Type1 Cross Section View of TSOP Type 1 Mold Compound Gold Wire Lead frame Die Die Attach Adhesive Signetics’ s TSOP Type1 packages are available in 32 - 48 lead counts with 0.50mm lead

SIGNETICS

Abstract: JEDEC tray standard 13 Signetics OR Mullard package tray outline 12X20 signetics data
Contextual Info: Signetics Flip Chip Package Data Sheet Signetics Data Sheet Signetics TSOP Type 2 Signetics Thin Small Outline Package Type2 Cross Section View of TSOP Type 2 Mold Compound Gold Wire Lead frame Die Die Attach Adhesive Signetics’ s TSOP Type 2 package is available in 50 lead counts with 0.80mm lead pitches

SIGNETICS

Abstract: 10X10MM FLGA
Contextual Info: Data Sheet Signetics Signetics Flip Chip Package Data Sheet Signetics FLGA Signetics Fine Pitch Land Grid Array Package FLGA is a laminate-based, nearly chip-scale package. They provide excellent electrical performance and are cost effective because they are manufactured in a high-utilization

textool socket dil 40

Abstract: 30A27 47 16L xn PAL 007 B MO-C47AA textool socket dil 24 c16v8 PLC16V8-25 PAL 007 E 16H8
Contextual Info: a^E D NAPC/ SIGNETICS • bbS3TS4 QGSMQMO 1 ■ T~*U>- 3rH7 c Signetics PLC16V8-25/-35 Erasable and OTP Universal PALMype Devices Signetics Programmable Logic Product Specification Application Specific Products • Series 20 FEATURES • 20-pln Universal Programmable

signetics

Abstract: epbga EBGA epbga 304 signetics data book
Contextual Info: Data Sheet Signetics Data Sheet Signetics Flip Chip Package Signetics EPBGA Signetics Enhanced Performance Ball Grid Array Package EPBGA is a cavity-down package that uses a laminate substrate mounted to a copper heat spreader. The package offers superior electrical and thermal performance by the

signetics

Contextual Info: Data Sheet Signetics Data Sheet Signetics Flip Chip Package Signetics STBGA Signetics Tape Ball Grid Array Package STBGA is a cavity-down package that uses a tape-based substrate mounted to a copper heat spreader. The package offers superior electrical performance by the

signetics

Contextual Info: Data Sheet Signetics Signetics Flip Chip Package Data Sheet Signetics Stacked CSP Signetics Stacked Chip Scale Package Stacked CSP is a laminate-based, nearly chip-scale package containing at least two die that are stacked vertically. This package solution provides a very high silicon content

hspbga

Contextual Info: Data Sheet Signetics Signetics Flip Chip Package Data Sheet Signetics PBGA / HSPBGA Signetics Plastic Ball Grid Array Package PBGA packages have a wire bonded die mounted to a laminate substrate which is then over molded. This configuration offers excellent performance and cost that enables use

tfbga

Abstract: SIGNETICS 48TFBGA 48-TFBGA
Contextual Info: Data Sheet Signetics Data Sheet Signetics Flip Chip Package Signetics TFBGA Signetics Tape Fine Pitch Ball Grid Array Package TFBGA is a package that uses a tape-based substrate with plastic over mold, offering a near chip scale solution. TFBGA packages are cost efficient and provide excellent

pin configuration of logic gates

Abstract: logic gates pin configuration "OR Gates" application of programmable array logic and gates or gates PLS173 24 SIGNETICS signetics PLHS173
Contextual Info: Signetics PLHS173 Field Programmable Logic Array 2 2 x 4 2 x 10 Signetics Programmable Logic Application Specific Products • Series 24 DESCRIPTION The PLHS173 is a high-speed version of the PLS173 FPLA. The Signetics stateof-the-art Oxide Isolated Bipolar fabrica­

60c31

Abstract: AD347 AD7ME 80C31BH 80C31BH/BQA
Contextual Info: Signetics 80C31BH/80C51BH CMOS Single-Chip 8-Bit Microcontroller Product Specification Military Microprocessor Products DESCRIPTION The Signetics 80C31BH/80C51BH is a high-performance microcontroller fabri­ cated with Signetics high-density CMOS technology.

Contextual Info: Philips Components-Signetics Quality and Reliability Data Communication Products SIGNETICS QUALITY Signetics has put together winning processes for manufacturing. Our standard is zero defects, and current customer quality statistics demonstrate our commitment to this

SCC2691AC1N24

Abstract: diagram remote control receiver and transmitter SCC2691AC1A28 T-75-37-05 SCC2691 SCC2691AA1D24 SCC2691AA1N24 SCC2691AC1D24 bts312 bbS312
Contextual Info: S'îE D NAPC/ SIGNETICS Signetics bbS3T24 GDSSIST 1 .7=7Sr-37-ar SCC2691 Universal Asynchronous Receiver/Transmitter UART Product Specification Communications and Industrial Products Group c PIN CONFIGURATIONS DESCRIPTION FEATURES The Signetics SCC2691 Universal Asyn­

hef4750

Abstract: hall marking code A04 hef4750 application an1993 philips TDA7052 application note Application Notes Compandor cookbook signetics rf data handbook 433Mhz RV Transmitter receiver SCHEMATIC DIAGRAMS signetics Analogue IC Dat ne602
Contextual Info: RF Communications Handbook Signetics Philips Semiconductors PHILIPS PHILIPS Signetics reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, describedorcontained herein in orderto improve design and/or performance. Signetics assumes no responsibility or liability for the use

NE602 application note

Abstract: NE602 equivalent NE602 ic NE602 application ne602 NE602 mixer Signetics NE602 operation limiter circuit in basic vm demodulation 10.7Mhz 15Khz crystal filter signetics rf Receiver Circuits
Contextual Info: Philips Components-Signetics Application Note Document Signetics Author. December 1988 Date RF Communications ABSTRACT This paper discusses four high sensitivity receivers and IF Intermediate Frequency strips which utilize intermediate frequencies of 10.7MHz or

scn2692

Abstract: PAL Decoder 16L8 PHD48N22 SYSTEM GENERAL TURPRO-1 PHD48N22
Contextual Info: Philips Components-Signetics Programmable High-Speed Decoders PHD Application Note Programmable Logic Devices INTRODUCTION A recent Philips Com ponents-Signetics Application Note described how to perform microprocessor "High Speed Address Decode". This document

Contextual Info: NAPC/ SIGNETICS ETE D • bbSBTSM QQS S1 3t a Ô ■ T -y s ~ ? 7 - o r Signetics SCC68692 Dual Asynchronous Receiver/ Transmitter DUART Product Specification Microprocessor Division DESCRIPTION The Signetics SCC68692 Dual Universal Asynchronous Receiver/Transmitter (DUART) is a single-chip CMOS-LSI commu­

14.5M 1982

Contextual Info: Philips Components-Signetics Application Specific Products Section 7 - Package outlines 24-PIN HERMETIC CERDIP 300 mil wide Philips Components-Signetics Application Specific Products Section 7 - Package outlines 24-PIN PLASTIC DUAL IN-LINE (300 mil wide)