SIGNETICS
Abstract: 10X10MM TQFN 72-QFN
Text: Data Sheet Signetics Signetics Flip Chip Package Data Sheet Signetics QFN Sawn Signetics TQFN, WQFN, and UQFN The Signetics QFN package is a low cost, lead frame packaging solution that offers excellent thermal and electrical performance with minimal costs. Electrical performance
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10x10MM
C/-65
C/100%
15PSIG,
168hrs
SIGNETICS
10X10MM
TQFN
72-QFN
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Signetics
Abstract: 19X19 19X19MM
Text: Data Sheet Signetics Data Sheet Signetics Flip Chip Package Signetics FBGA Signetics Fine Pitch Ball Grid Array Package FBGA is a laminate-based, nearly chip-scale package. They provide excellent electrical performance and can be customized for use in an infinite number of applications. This
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19x19MM
168hr,
192hr,
C/-55
C/100%
15PSIG,
168hrs
Signetics
19X19
19X19MM
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SIGNETICS
Abstract: QFP minimum pitch size qfp 0.4mm lead frame QFP lead frame gold wire MQFP
Text: Data Sheet Signetics Signetics Flip Chip Package Data Sheet Signetics QFP Signetics MQFP, MQFP LOC, MQFP H/S, LQFP, LQFP Sensor, QFP EPP, and TQFP The Signetics QFP package family is a lead frame based package with gull wing style leads on four sides. Signetics offers an array of QFP’s including standard MQFP,
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JEDEC TSSOP 28 LEAD PACKAGE
Abstract: SIGNETICS TSSOP 28 Ablestik 12-1
Text: Signetics Flip Chip Package Data Sheet Signetics Data Sheet Signetics TSSOP Signetics Thin Shrink Small Outline Package Cross Section View of TSSOP Mold Compound Gold Wire Lead frame Die Die Attach Adhesive Signetics’ s TSSOP packages are available in 8 - 56 lead counts with 0.50 / 0.65mm lead
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TSOP 48 thermal resistance
Abstract: TSOP 48 thermal resistance type1 thin TSOP 8x20 package tray TSOP 32 thermal resistance TSOP 48 package tray JEDEC tray standard 13 Ablestik 12-1 signetics TSOP package tray TSOP1-48
Text: Signetics Flip Chip Package Data Sheet Signetics Data Sheet Signetics TSOP Type 1 Signetics Thin Small Outline Package Type1 Cross Section View of TSOP Type 1 Mold Compound Gold Wire Lead frame Die Die Attach Adhesive Signetics’ s TSOP Type1 packages are available in 32 - 48 lead counts with 0.50mm lead
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12x20
TSOP 48 thermal resistance
TSOP 48 thermal resistance type1
thin TSOP 8x20 package tray
TSOP 32 thermal resistance
TSOP 48 package tray
JEDEC tray standard 13
Ablestik 12-1
signetics
TSOP package tray
TSOP1-48
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SIGNETICS
Abstract: JEDEC tray standard 13 Signetics OR Mullard package tray outline 12X20 signetics data
Text: Signetics Flip Chip Package Data Sheet Signetics Data Sheet Signetics TSOP Type 2 Signetics Thin Small Outline Package Type2 Cross Section View of TSOP Type 2 Mold Compound Gold Wire Lead frame Die Die Attach Adhesive Signetics’ s TSOP Type 2 package is available in 50 lead counts with 0.80mm lead pitches
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SIGNETICS
JEDEC tray standard 13
Signetics OR Mullard
package tray outline
signetics data
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SIGNETICS
Abstract: 10X10MM FLGA
Text: Data Sheet Signetics Signetics Flip Chip Package Data Sheet Signetics FLGA Signetics Fine Pitch Land Grid Array Package FLGA is a laminate-based, nearly chip-scale package. They provide excellent electrical performance and are cost effective because they are manufactured in a high-utilization
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10X10MM
168hr,
192hr,
C/-55
C/100%
15PSIG,
168hrs
SIGNETICS
10X10MM
FLGA
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signetics
Abstract: epbga EBGA epbga 304 signetics data book
Text: Data Sheet Signetics Data Sheet Signetics Flip Chip Package Signetics EPBGA Signetics Enhanced Performance Ball Grid Array Package EPBGA is a cavity-down package that uses a laminate substrate mounted to a copper heat spreader. The package offers superior electrical and thermal performance by the
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100um
31x31MM
192hr,
C/-65
C/100%
15PSIG,
168hrs
signetics
epbga
EBGA
epbga 304
signetics data book
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signetics
Abstract: No abstract text available
Text: Data Sheet Signetics Data Sheet Signetics Flip Chip Package Signetics STBGA Signetics Tape Ball Grid Array Package STBGA is a cavity-down package that uses a tape-based substrate mounted to a copper heat spreader. The package offers superior electrical performance by the
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40x40MM
100um
192hr,
C/-65
C/100%
15PSIG,
168hrs
signetics
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signetics
Abstract: No abstract text available
Text: Data Sheet Signetics Signetics Flip Chip Package Data Sheet Signetics Stacked CSP Signetics Stacked Chip Scale Package Stacked CSP is a laminate-based, nearly chip-scale package containing at least two die that are stacked vertically. This package solution provides a very high silicon content
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696hr,
192hr,
C/-65
C/100%
15PSIG,
168hrs
signetics
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hspbga
Abstract: No abstract text available
Text: Data Sheet Signetics Signetics Flip Chip Package Data Sheet Signetics PBGA / HSPBGA Signetics Plastic Ball Grid Array Package PBGA packages have a wire bonded die mounted to a laminate substrate which is then over molded. This configuration offers excellent performance and cost that enables use
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192hr,
C/-65
C/100%
15PSIG,
168hrs
hspbga
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RDRAM SOP
Abstract: SIGNETICS Bt epoxy rohs
Text: Data Sheet Signetics Signetics Flip Chip Package Data Sheet Signetics BOC Signetics Board On Chip BOC is a laminate-based, nearly chip-scale package with the die mounted topside down. Wire bonds are made through a cavity in the center of the substrate and both
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696hr,
C/-65
C/100%
15PSIG,
168hrs
RDRAM SOP
SIGNETICS
Bt epoxy rohs
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tfbga
Abstract: SIGNETICS 48TFBGA 48-TFBGA
Text: Data Sheet Signetics Data Sheet Signetics Flip Chip Package Signetics TFBGA Signetics Tape Fine Pitch Ball Grid Array Package TFBGA is a package that uses a tape-based substrate with plastic over mold, offering a near chip scale solution. TFBGA packages are cost efficient and provide excellent
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168hr,
C/-65
C/100%
15PSIG,
168hrs
tfbga
SIGNETICS
48TFBGA
48-TFBGA
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signetics 723
Abstract: 20L8D M7MJ PLUS20R8
Text: PLUS20L8, PLUS20R8 Signetics PAL -Type Devices Signetics Programmable Logic Product Specification Military Application Specific Products • Series 24 FEATURES DESCRIPTION • Ultra high-speed The Signetics PLUS20XX family is an ultra high-speed version of existing Series
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24-pin
PLUS20L8,
PLUS20R8
PLUS20XX
8/20R8D
1B/27
ZL30/30A
30A31
20L8/20L8D
signetics 723
20L8D
M7MJ
PLUS20R8
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textool socket dil 40
Abstract: 30A27 47 16L xn PAL 007 B MO-C47AA textool socket dil 24 c16v8 PLC16V8-25 PAL 007 E 16H8
Text: a^E D NAPC/ SIGNETICS • bbS3TS4 QGSMQMO 1 ■ T~*U>- 3rH7 c Signetics PLC16V8-25/-35 Erasable and OTP Universal PALMype Devices Signetics Programmable Logic Product Specification Application Specific Products • Series 20 FEATURES • 20-pln Universal Programmable
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20-pln
300mil-wide
20-PIN
textool socket dil 40
30A27
47 16L xn
PAL 007 B
MO-C47AA
textool socket dil 24
c16v8
PLC16V8-25
PAL 007 E
16H8
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pin configuration of logic gates
Abstract: logic gates pin configuration "OR Gates" application of programmable array logic and gates or gates PLS173 24 SIGNETICS signetics PLHS173
Text: Signetics PLHS173 Field Programmable Logic Array 2 2 x 4 2 x 10 Signetics Programmable Logic Application Specific Products • Series 24 DESCRIPTION The PLHS173 is a high-speed version of the PLS173 FPLA. The Signetics stateof-the-art Oxide Isolated Bipolar fabrica
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PLHS173
PLHS173
PLS173
22x42x10)
pin configuration of logic gates
logic gates pin configuration
"OR Gates"
application of programmable array logic
and gates
or gates
24 SIGNETICS
signetics
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60c31
Abstract: AD347 AD7ME 80C31BH 80C31BH/BQA
Text: Signetics 80C31BH/80C51BH CMOS Single-Chip 8-Bit Microcontroller Product Specification Military Microprocessor Products DESCRIPTION The Signetics 80C31BH/80C51BH is a high-performance microcontroller fabri cated with Signetics high-density CMOS technology.
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80C31BH/80C51BH
80C31BH/80C51BH
80C31BH/
80C51
80C31BH/80C51
16-bit
60c31
AD347
AD7ME
80C31BH
80C31BH/BQA
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Untitled
Abstract: No abstract text available
Text: Philips Components-Signetics Quality and Reliability Data Communication Products SIGNETICS QUALITY Signetics has put together winning processes for manufacturing. Our standard is zero defects, and current customer quality statistics demonstrate our commitment to this
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SCC2691AC1N24
Abstract: diagram remote control receiver and transmitter SCC2691AC1A28 T-75-37-05 SCC2691 SCC2691AA1D24 SCC2691AA1N24 SCC2691AC1D24 bts312 bbS312
Text: S'îE D NAPC/ SIGNETICS Signetics bbS3T24 GDSSIST 1 .7=7Sr-37-ar SCC2691 Universal Asynchronous Receiver/Transmitter UART Product Specification Communications and Industrial Products Group c PIN CONFIGURATIONS DESCRIPTION FEATURES The Signetics SCC2691 Universal Asyn
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SCC2691
7sr-37-aT
SCC2691
24-pin
SCC2691AC1N24
diagram remote control receiver and transmitter
SCC2691AC1A28
T-75-37-05
SCC2691AA1D24
SCC2691AA1N24
SCC2691AC1D24
bts312
bbS312
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hef4750
Abstract: hall marking code A04 hef4750 application an1993 philips TDA7052 application note Application Notes Compandor cookbook signetics rf data handbook 433Mhz RV Transmitter receiver SCHEMATIC DIAGRAMS signetics Analogue IC Dat ne602
Text: RF Communications Handbook Signetics Philips Semiconductors PHILIPS PHILIPS Signetics reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, describedorcontained herein in orderto improve design and/or performance. Signetics assumes no responsibility or liability for the use
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Signeti161
hef4750
hall marking code A04
hef4750 application
an1993 philips
TDA7052 application note
Application Notes Compandor cookbook
signetics rf data handbook
433Mhz RV Transmitter receiver SCHEMATIC DIAGRAMS
signetics Analogue IC Dat
ne602
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NE602 application note
Abstract: NE602 equivalent NE602 ic NE602 application ne602 NE602 mixer Signetics NE602 operation limiter circuit in basic vm demodulation 10.7Mhz 15Khz crystal filter signetics rf Receiver Circuits
Text: Philips Components-Signetics Application Note Document Signetics Author. December 1988 Date RF Communications ABSTRACT This paper discusses four high sensitivity receivers and IF Intermediate Frequency strips which utilize intermediate frequencies of 10.7MHz or
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AN1993
NE602
NE604A,
NE605
NE/SA604A
NE/SA602
AN1982-Applying
NE602 application note
NE602 equivalent
NE602 ic
NE602 application
NE602 mixer
Signetics NE602
operation limiter circuit in basic vm demodulation
10.7Mhz 15Khz crystal filter
signetics rf Receiver Circuits
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scn2692
Abstract: PAL Decoder 16L8 PHD48N22 SYSTEM GENERAL TURPRO-1 PHD48N22
Text: Philips Components-Signetics Programmable High-Speed Decoders PHD Application Note Programmable Logic Devices INTRODUCTION A recent Philips Com ponents-Signetics Application Note described how to perform microprocessor "High Speed Address Decode". This document
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PHD16N6-5
scn2692
PAL Decoder 16L8
PHD48N22
SYSTEM GENERAL TURPRO-1 PHD48N22
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Untitled
Abstract: No abstract text available
Text: NAPC/ SIGNETICS ETE D • bbSBTSM QQS S1 3t a Ô ■ T -y s ~ ? 7 - o r Signetics SCC68692 Dual Asynchronous Receiver/ Transmitter DUART Product Specification Microprocessor Division DESCRIPTION The Signetics SCC68692 Dual Universal Asynchronous Receiver/Transmitter (DUART) is a single-chip CMOS-LSI commu
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SCC68692
S68000
1/16-bit
00S5157
SCC68692
T-75-37-05
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14.5M 1982
Abstract: No abstract text available
Text: Philips Components-Signetics Application Specific Products Section 7 - Package outlines 24-PIN HERMETIC CERDIP 300 mil wide Philips Components-Signetics Application Specific Products Section 7 - Package outlines 24-PIN PLASTIC DUAL IN-LINE (300 mil wide)
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24-PIN
40-LEAD
VS040;
OT158A)
44-PIN
80-LEAD
OT219)
14.5M 1982
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