SILICON FOOTPRINT ESD Search Results

MA4E2513L-1289

Abstract: MA4E2513L-1289W MA4E2513-1289
Contextual Info: SURMOUNTTM Low Barrier Tee “0301” Footprint Silicon Schottky Diodes Features • Extremely Low Parasitic Capitance and Inductance • Extremely Small “0301” 1000 x 300um Footprint • Surface Mountable in Microwave Circuits, No Wirebonds Required

0201 footprint

Abstract: MA4E2501-1290 MA4E2501L-1290 MA4E2501L-1290W
Contextual Info: MA4E2501-1290 Series SURMOUNTTM Low Barrier 0201 Footprint Silicon Schottky Diodes Rev. V1 Features A • Extremely Low Parasitic Capitance and Inductance • Extremely Small 0201 600x300um Footprint • Surface Mountable in Microwave Circuits , No Wirebonds

0201 footprint

Abstract: MA4E2501-1290 MA4E2501L-1290 MA4E2501L-1290T MA4E2501L-1290W
Contextual Info: SURMOUNTTM Low Barrier 0201 Footprint Silicon Schottky Diodes Features • Extremely Low Parasitic Capitance and Inductance • Extremely Small 0201 600x300um Footprint • Surface Mountable in Microwave Circuits, No Wirebonds Required • Rugged HMIC Construction with Polyimide

Silicones

Abstract: Tyco SESD feeder SESD0201C-006-058 SESD0402S-005-054
Contextual Info: Silicon ESD Protection Devices Silicon ESD Protection Devices NEW Silicon ESD SESD devices help protect electronic circuits against damage from electrostatic discharge (ESD) events. The 0201-sized SESD device’s miniature footprint – measuring 0.6mm x 0.3mm x 0.3mm - is

SESD0402P

Abstract: Mark B1 SESD0201P SESD0402P1BN-0450-090
Contextual Info: Silicon ESD Protection Devices Silicon ESD Protection Devices NEW Silicon ESD SESD devices help protect electronic circuits against damage from electrostatic discharge (ESD) events. The 0201-sized SESD device’s miniature footprint – measuring 0.6mm x 0.3mm x 0.3mm - is

Contextual Info: MA4E2513L-1289 SURMOUNTTM Low Barrier Tee “0301” Footprint Silicon Schottky Diodes Features • Extremely Low Parasitic Capitance and Inductance • Extremely Small “0301” 1000 x 300 um Footprint • Surface Mountable in Microwave Circuits, No Wire•

500 platinum Hot wire

Abstract: MA4E2513L-1289 MA4E2513L-1289W MACOM Schottky Diode
Contextual Info: MA4E2513L-1289 SURMOUNTTM Low Barrier Tee “0301” Footprint Silicon Schottky Diodes Features • Extremely Low Parasitic Capitance and Inductance • Extremely Small “0301” 1000 x 300 um Footprint • Surface Mountable in Microwave Circuits, No Wire•

varactor

Contextual Info: DATA SHEET SMV2019 to SMV2023: Silicon Hyperabrupt Varactor Diode Chips Features High Q for low loss resonators Low leakage current ● High tuning ratio for wideband VCOs ● SPICE model parameters ● Small footprint chip design ● ● Description Skyworks silicon hyperabrupt junction varactor diode chips are

HP85047A

Abstract: 15KV IEC1000-4-2 WLP200 WLP200-01 WLP200-02 WLP-20
Contextual Info: WLP200 CALIFORNIA MICRO DEVICES Wafer Level Package Evaluation RC Filter Network Features Applications • 6 Filters per device • Ultra small footprint, 0.5mm pitch • EMI filter for Mobile Equipment e.g. Cellular Phones • Silicon substrate • Evaluation Device

15KV

Abstract: 30KV IEC1000-4-2 WLP200 WLP200-01 WLP200-02
Contextual Info: WLP200 CALIFORNIA MICRO DEVICES Wafer Level Package Evaluation RC Filter Network Features Applications • 6 Filters per device • Ultra small footprint, 0.5mm pitch • EMI filter for Mobile Equipment e.g. Cellular Phones • Silicon substrate • Evaluation Device

WLP200

Abstract: 15KV IEC1000-4-2 WLP200-01 WLP200-02
Contextual Info: WLP200 CALIFORNIA MICRO DEVICES Wafer Level Package Evaluation RC Filter Network Features Applications • 6 Filters per device • Ultra small footprint, 0.5mm pitch • EMI filter for Mobile Equipment e.g. Cellular Phones • Silicon substrate • Evaluation Device

QFN-12

Abstract: IBM3115Q012 NC12 QFN12
Contextual Info: IBM3115Q012 Product Overview Tri-Band GSM Integrated Voltage Controlled Oscillator Advance Features Applications • IBM Silicon Germanium BiCMOS 5DM Technology with Cu Metallurgy • GSM/DCS/PCS tri-band direct conversion receivers • Small-footprint, low-profile QFN-12 package

AP4341

Abstract: MAGJACK application pcb H5007 lan driver SCHEMATIC DIAGRAM OF intel 8086 DA82562EM 82562EZ bob smith termination grid tie inverter schematic diagram intel ic 8086 MAG-JACK
Contextual Info: 82562EZ EX /82540EM Dual Footprint LOM Design Guide Application Note (AP-434) Networking Silicon Notice: This document contains information on products in the design phase of development. Product features and specifications are subject to change without notice. Verify with your local

Contextual Info: BGA725L6 Silicon Germanium Low Noise Amplifier for Global Navigation Satellite Systems GNSS in ultra small package with 0.77mm² footprint Data Sheet Revision 2.0, 2012-03-09 Preliminary RF & Protection Devices Edition 2012-03-09 Published by Infineon Technologies AG

BGA925L6

Abstract: 925L BGA925
Contextual Info: BGA925L6 Silicon Germanium GNSS Low Noise Amplifier in ultra small package with 0.77mm² footprint Data Sheet Revision 3.0, 2012-01-13 RF & Protection Devices Edition 2012-01-13 Published by Infineon Technologies AG 81726 Munich, Germany 2012 Infineon Technologies AG

Contextual Info: BGA925L6 Silicon Germanium GNSS Low Noise Amplifier in ultra small package with 0.77mm² footprint Data Sheet Revision 3.0, 2012-01-13 RF & Protection Devices Edition 2012-01-13 Published by Infineon Technologies AG 81726 Munich, Germany 2012 Infineon Technologies AG

Contextual Info: DATA SHEET SMV1405-040LF: Surface Mount, 0402 Silicon Abrupt Tuning Varactor Diode Applications • Wide bandwidth VCOs • Wide range voltage-tuned phase shifters and filters Features • Low series resistance: 0.8 Ω typical • High Q: 3200 typical • Industry-standard 0402 footprint

SMV2020-000

Abstract: SMV2019 SMV2019-000 SMV2020 SMV2021 SMV2021-000 SMV2022 SMV2022-000 SMV2023 SMV2023-000
Contextual Info: DATA SHEET SMV2019 to SMV2023: Silicon Hyperabrupt Varactor Diode Chips Features High Q for low loss resonators Low leakage current ● High tuning ratio for wideband VCOs ● SPICE model parameters ● Small footprint chip design ● Available lead Pb -free, RoHS-compliant, and Green

Contextual Info: DATA SHEET SMV2019 to SMV2023: Silicon Hyperabrupt Varactor Diode Chips Features High Q for low loss resonators Low leakage current ● High tuning ratio for wideband VCOs ● SPICE model parameters ● Small footprint chip design ● Available lead Pb -free, RoHS-compliant, and Green

SMV1405-040LF

Abstract: varactor diode SPICE model
Contextual Info: DATA SHEET SMV1405-040LF: Surface Mount, 0402 Silicon Abrupt Tuning Varactor Diode Applications • Wide bandwidth VCOs • Wide range voltage-tuned phase shifters and filters Features • Low series resistance: 0.8 Ω typical • High Q: 3200 typical • Industry-standard 0402 footprint

free circuit diagram of USB modem

Abstract: BGA-64 pad LOG RX 2 1301 16 pin IC R01A SiW1602 latest bluetooth circuits diagrams free circuit diagram of bluetooth modem SiW1701 MC145481 SiW1502
Contextual Info: SiW1760 Baseband Processor Data Sheet 2 FEATURES • Small footprint 64-pin BGA packag9 6 x 6 mm . CLOCK and RESET LOGIC PWR1_EN PWR2_EN ENABLE_RM VSS_PLL VSS_USB VSS_C VSS_P VDD_S VDD_P VDD_C VDD_RM VDD_PLL VDD_USB VDD_UART CLK32K_OUT CLK32K_IN The SiW1760 Baseband Processor is part of Silicon

Contextual Info: AUIRF8736M2TR AUTOMOTIVE GRADE Automotive DirectFET Power MOSFET  •  V BR DSS RDS(on) typ. max. ID (Silicon Limited) Qg Advanced Process Technology Optimized for Automotive Motor Drive, DC-DC and other Heavy Load Applications Exceptionally Small Footprint and Low Profile

Contextual Info: AUIRF8736M2TR AUTOMOTIVE GRADE Automotive DirectFET Power MOSFET  •  V BR DSS RDS(on) typ. max. ID (Silicon Limited) Qg Advanced Process Technology Optimized for Automotive Motor Drive, DC-DC and other Heavy Load Applications Exceptionally Small Footprint and Low Profile

AUIRF7736M2

Abstract: AUIRF7736M2TR
Contextual Info: PD - 96316A AUTOMOTIVE GRADE DirectFET™ Power MOSFET ‚ V BR DSS 40V RDS(on) typ. 2.5mΩ max. 3.0mΩ ID (Silicon Limited) 108A Qg 72nC • Advanced Process Technology • Optimized for Automotive Motor Drive, DC-DC and other Heavy Load Applications • Exceptionally Small Footprint and Low Profile