SILVER AG WIRE BOND Search Results

C8C12

Contextual Info: Material Content Data Sheet Product Name Process Name of the part Package Base ASFLK-Series Material Ceramics Material Weight mg 46.89 Die Bonding IC Adhesive Wire Bonding Gold Wire Blank (base plating) Silicon EPOXY-1 Au SiO2 0.7 0.35 0.07 1.31 Blank Mounter

Contextual Info: ASV,ASVK,ASL Ceramic Type List of main material declaration Item Weight(mg) 183.7 INFORMATION Material Package Base Process Name of the part Package Base Ceramic SMD Material Ceramics Item Name Lead Free Material Au / Ni Material Weight(mg) 156 Die Bonding

TDS05160

Abstract: TDS05150 TDS03160 TDS03150 TDSR5150 9999 DIODE tsop1736 TLU02401 BPW2 silver ag wire Bond
Contextual Info: V I^ W Y Vishay Telefunken Table of Package Forms Part Number Package Form Part Number Package Form Part Number Package Form TLBR5410 8 TLHR4401 11 TLMH3100 1 TLDR4400 11 TLHR4405 11 TLMH3101 1 TLDR4900 11 TLHR4600 11 TLMK3100 1 TLDR5400 TLDR5800 8 TLHR4601

cd photo diode

Abstract: class H epoxy resin gold detector IC material composition of chip capacitors ic 555 use with metal detector epoxy resin lead frame resin compound copper bond wire CNY64
Contextual Info: Vishay Semiconductors The Constituents of Semiconductor Components Responsible electronic component and equipment manufacturers are already preparing for the time when the lifespan of their products comes to an end by scrutinizing the materials incorporated and their future

BORON

Abstract: BPW34 application BPW77NA BPW41N bpx43-6 BPW43 BPW17 BPW85 BPW34 BPW41N IR DATA
Contextual Info: Vishay Semiconductors The Constituents of Semiconductor Components Responsible electronic component and equipment manufacturers are already preparing for the time when the lifespan of their products comes to an end by scrutinizing the materials incorporated and their future

80110

Abstract: TCST1000 CNY70 TCPT1200 TCST1030 TCST1210 TCST1230 TCST5123 TCST5250 TCUT1200
Contextual Info: Vishay Semiconductors The Constituents of Semiconductor Components Responsible electronic component and equipment manufacturers are already preparing for the time when the lifespan of their products comes to an end by scrutinizing the materials incorporated and their future

ir photodetector

Abstract: CNY70 TCNT1000 TCPT1200 TCPT1200X01 TCRT1000 TCRT1010 TCRT5000 TCRT5000L TCSS1100
Contextual Info: Vishay Telefunken Packing and Order Information Part Number MOQ* pcs per Tube CNY70 TCNT1000 TCPT1200 TCPT1200X01 TCRT1000 TCRT1010 TCRT5000 TCRT5000L TCSS1100 TCSS2100 TCST1000 TCST2000 TCST1030 TCST1030L TCST1103 TCST1202 TCST1210 TCST1230 TCST1300 TCST2103

metal detector WITH IC 555

Abstract: ic 555 use with metal detector silver ag wire Bond TSAL6200 TSAL6400 TSHF5200 TSHF5400 TSOP21 TSAL4400 silver epoxy
Contextual Info: VISHAY Vishay Semiconductors Constituents of IR Receiver Modules Responsible electronic component and equipment manufacturers are already preparing for the time when the life span of their products comes to an end by scrutinizing the materials incorporated and their

d 9329

Abstract: MARKING Scw SOT23 gus-ss cel-9220 cel9220 scw marking code sot 23 PFC-W0805LF SCW-SC3LF WCA0804 PWC2512L
Contextual Info: Surface Mount QSOP Resistor Networks IRC Advanced Film Division QSOP Series • Reliable, no internal cavity • High resistor density - .025” lead spacing • Standard JEDEC 16, 20, and 24 pin packages • Ultra-stable TaNSil resistors on silicon substrates

Telefunken Electronic LED 3mm

Abstract: MG96
Contextual Info: Vishay Telefunken The Constituents of Semiconductor Components Responsible electronic component and equipment manufacturers are already preparing for the time when the lifespan of their products comes to an end by scrutinizing the materials incorporated and their future

Si3N4

Abstract: antimony trioxide epoxy molding TELEFUNKEN catalog
Contextual Info: Vishay Telefunken The Constituents of Semiconductor Components Document Number 82601 05.01 www.vishay.com 1 Vishay Telefunken Table of Contents The Constituents of Semiconductor Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

The Constituents of Semiconductor Components

Abstract: 80095 TDSR5160 TDSR5150 TDSR1160 TDSG5160 TDSG1150 TDSG1160 TDSG3150 TDSG3160
Contextual Info: Vishay Semiconductors The Constituents of Semiconductor Components Responsible electronic component and equipment manufacturers are already preparing for the time when the lifespan of their products comes to an end by scrutinizing the materials incorporated and their future

silver epoxy

Abstract: silver ag wire Bond telefunken germanium class H epoxy resin
Contextual Info: Vishay Telefunken The Constituents of Semiconductor Components Responsible electronic component and equipment manufacturers are already preparing for the time when the lifespan of their products comes to an end by scrutinizing the materials incorporated and their future

Contextual Info: NTC THERMISTORS F E N W A L d E L E C T R O N IC S NTC / PTC Thermistors STANDARD CHIP SERIES Without Leads • <* - v , .■ FEATURES May be surface m ounted by epoxy bonding or soldering 1Top and bottom surface electrode 1 Rapid response time 1Small size

TS0300

Abstract: H20E TS0500 84-1LMI MIL-F-14256 TS050
Contextual Info: Application Note 005 Chip Device Mounting Instructions Page 1 of 4 Application Note #005 Chip Device Mounting Instructions All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used

Ablestik 84-1LMI

Abstract: gold melting furnace 84-1LMI epoxy adhesive
Contextual Info: APPLICATION NOTES APPLICATION NOTE 005 - CHIP DEVICE MOUNTING INSTRUCTIONS All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used in RF and microwave applications. Some of these chips are offered with

opto fet

Abstract: ll90_3 JESD46-B LL85 LL90 transistor FET OS-PCN-2005-003-A
Contextual Info: Product / Process Change Notification For internal use only 2005-02-15 OS-PCN-2005-003-A Dear Customer, please find attached our OSRAM OS PCN: “Change of bond pad of field effect transistor FET and leadframe plating for laser SPL LLxx” Important information for your attention:

AWTN15

Abstract: 3PDT toggle switch wiring diagram F4TPA0904 FTN5904 A101T1ZB FTD0904 FTS0904 A201SYAB04 FTPA0904 N4004
Contextual Info: Toggle Switches Product Range Toggle Switches Toggle Switches • Tiny Toggles: TT and TST Series ■ Miniature Toggles: Gemini Series and Green Series ■ Power Toggles: F and AW Series Main features: ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ Up to 4 poles

MHP smd

Abstract: 330 197 MHP025
Contextual Info: Medium Power RF Multilayer Porcelain Capacitors High Frequency Power Ceramic Capacitors Series MPV Series MHP Summary Data ELECTRICAL CHARACTERISTICS Series Range CAPACITANCE RANGE pF 10 CAPACITANCE RANGE PER CASE SIZE pF 10 - 360 - 1000 390 - 1000 MPVC MPVS 81 MPVS 82 MPVS 83

ECF564A

Contextual Info: Technology A pplication Notes Chip Device Mounting Instructions A pplication N o te 003 Chip D evice Mounting Instructions All of the chip products in this catalog use thick film metallization for terminations - either platinum gold, gold, or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used

Contextual Info: APPLICATION NOTE 005 - CHIP DEVICE MOUNTING INSTRUCTIONS All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used in RF and microwave applications. Some of these chips are offered with

40039

Abstract: SOD-523 DO-219AB Germanium DO-35 DIODE 89901 cd 4553 material declaration vishay asbestos DO-219AB germanium diode SOD323
Contextual Info: VISHAY Vishay Semiconductors The Constituents of Semiconductor Components Responsible electronic component and equipment manufacturers are already preparing for the time when the lifespan of their products comes to an end by scrutinizing the materials incorporated and their

material declaration semiconductor package

Abstract: asbestos safety material declaration vishay 89901 DO-219AB 58018
Contextual Info: Vishay Semiconductors The Constituents of Semiconductor Components Responsible electronic component and equipment manufacturers are already preparing for the time when the lifespan of their products comes to an end by scrutinizing the materials incorporated and their

c06cf

Abstract: Di-Cap MIL-PRF-49464
Contextual Info: DiCap ® High Performance Single-Layer Capacitors for Functional Applications: Benefits: n DC Blocking Bypass n Filtering n Tuning n Submounts n n email sales@dilabs.com or europesales@dilabs.com or asiasales@dilabs.com n RF n n n Gold Metallization for wire bonding