SILVER-FILLED EPOXY Search Results

ASTM-D-2393

Abstract: amicon "good adhesive bonding starts" ASTM-D-257 amicon silver Cuming Amicon die attach adhesive Amicon D 125 ASTM-D-792 ASTMD257
Contextual Info: Technical Data Sheet AMICON C 850-6 Internet Address: www.emersoncuming.com Key Feature: • One component • Silver filled • Low viscosity Silver Filled, Epoxy Die Attach Adhesive Benefit: • Ease of use • Yields excellent electrical and thermal conductivities

Contextual Info: Technical Data Sheet Product 3888 July 2003 PRODUCT DESCRIPTION LOCTITE 3888 Silver Filled Conductive Adhesive provides the following product characteristics: Technology Epoxy Chemical Type Epoxy Appearance Resin Silver pasteLMS Appearance (Hardener) Clear to amber liquidLMS

IEC 68-2-27

Abstract: IEC 68-2-3 5A 125VAC 5A125VAC
Contextual Info: SPECIFICATIONS • CONSTRUCTION Washable miniature toggle switch for PC board. One pole. Designed for wave soldering. • MATERIALS Case and cover Contacts Actuator Terminal Seal : : : : UL94-V0 polyamide, glass filled orPES Silver Brass, nickel plated Epoxy

glass filled polyester physical properties

Abstract: screen emulsion PK100 Loctite LOCTITE PASTE
Contextual Info: Research, Development & Engineering Technical Data Sheet Product 3880 Tallaght Business Park, Dublin, Ireland Worldwide Version, October 1998 PRODUCT DESCRIPTION LOCTITE Product 3880 is a silver filled, one-component, epoxy adhesive that can be cured by heat. It combines high

TQFP 14X14

Contextual Info: Thermal Data  TQFP 14x14 44, 80,100 leads 44 to 100 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 3.9 W/cm°C die attach epoxy glue silver filled 10-40 µm 0.01 W/cm°C molding compound epoxy resin

cho-bond 1086

Abstract: cho-bond 1075 Cho-Bond 584-29 cho-bond 1029 584-29 cho-bond primer 1086 RTV silicone viscosity 51-00-1035-0000 50-02-1075-0000 CHO-SEAL 1285
Contextual Info: CONDUCTIVE COMPOUNDS CHO-BOND Conductive Adhesives Single- and two-component epoxy and silicone adhesives, with room temperature, elevated temperature or moisture cure mechanisms. Epoxies for Microelectronics Chomerics’ growing family of conductive epoxies now includes one-part, silver-filled pastes formulated for today’s

TQFP 64 PACKAGE rth

Abstract: 10X10
Contextual Info: Thermal Data  TQFP 10x10 44,64 leads 64 leads 44 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.27 mm 3.9 W/cm°C die attach epoxy glue silver filled

TQFP 14X14

Abstract: 14x14
Contextual Info: Thermal Data  TQFP 14x14 80,100 leads 80 to 100 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.15 mm 3.9 W/cm°C die attach epoxy glue silver filled 10-40 µm 0.01 W/cm°C molding compound epoxy resin 1.4 mm

tqfp 7x7

Contextual Info: Thermal Data  TQFP 7x7 32 leads 32 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 3.9 W/cm°C die attach epoxy glue silver filled 10-40 µm 0.01 W/cm°C molding compound epoxy resin 1.4 mm 0.0063W/cm°C

Contextual Info: Thermal Data DIP 14-16 14 leads 16 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filled 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C

12THERMAL

Contextual Info: Thermal Data  DIP 14-16 14 leads 16 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filled 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C

heat sink

Contextual Info: Thermal Data  POWER DIP 24 20+2+2 leads 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.6 W/cm°C die attach epoxy glue silver filled 15-50 µm 0.01 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C

gold cap a57

Abstract: 8261
Contextual Info: C&K 8060 Series Alternate Action and Momentary Pushbutton Switches Features/Benefits • Long travel • Available with LED • Long life contact design • Epoxy terminial seal Pushbutton A Typical Applications • Instrumentation • Computers and peripherals

RS-186E

Abstract: marking code Z3 marking CODE A3 8261SHZQE
Contextual Info: 8060 Series Alternate Action and Momentary Pushbutton Switches Features/Benefits • Long travel • Available with LED • Long life contact design • Epoxy terminial seal Pushbutton A Typical Applications • Instrumentation • Computers and peripherals

marking code 1AW

Abstract: tme57 E221SD1CGE h032
Contextual Info: Sealed* Snap-Acting Momentary Pushbutton Switches E020 Series •process sealed-withstands soldering and cleaning processes. SWITCHES WITH STANDARD OPTIONS C8K MARKING ON THIS SIDE EPOXY SEAL .030 TYP. 76 3 NC 2 NO “ 1 .1 8 5 TYP. T 4 , ?0) COMM. -^ .2 6 0 k (6,6 0)

RS-186E

Abstract: momentary SWITCH with cap PCB mount
Contextual Info: 8060 Series Alternate Action and Momentary Pushbutton Switches Features/Benefits • Long travel • Available with LED • Long life contact design • Epoxy terminial seal Pushbutton A Typical Applications • Instrumentation • Computers and peripherals

RS-186E

Contextual Info: 8060 Series Alternate Action and Momentary Pushbutton Switches Features/Benefits • Long travel • Available with LED • Long life contact design • Epoxy terminial seal Pushbutton A Typical Applications • Instrumentation • Computers and peripherals

Q 8060 p-5

Contextual Info: 8060 Series Alternate Action and Momentary Pushbutton Switches Features/Benefits • Long travel • Available with LED • Long life contact design • Epoxy terminial seal Pushbutton A Typical Applications • Instrumentation • Computers and peripherals

Contextual Info: 8060 Series Alternate Action and Momentary Pushbutton Switches Features/Benefits • Long travel • Available with LED • Long life contact design • Epoxy terminial seal Pushbutton A Typical Applications • Instrumentation • Computers and peripherals

Contextual Info: 8060 Series Alternate Action and Momentary Pushbutton Switches Features/Benefits • Long travel • Available with LED • Long life contact design • Epoxy terminal seal Pushbutton A Typical Applications • Instrumentation • Computers and peripherals

U840 diode

Abstract: SP45Y0 SP35W0 U2400 SP35S0 U2900 U2510 .122 marking
Contextual Info: SP series Washable snap-action pushbutton switches Distinctive features and specifications ❑ Sealed • Secure assembly of the two case parts • Internally sealed bushing • Epoxy sealed terminals ❑ Process compatible plain bushing models • Wave solderable

SP35WW

Abstract: SP45Y0 SP35W0 SP35P0 U2900
Contextual Info: SP series Washable snap-action pushbutton switches Distinctive features and specifications UG1006-A ❑ Process sealed • Secure assembly of the two case parts • Internally sealed bushing • Epoxy sealed terminals ❑ Process compatible plain bushing models

MCD 8940

Abstract: RS-186E 8168
Contextual Info: 8060 Series Alternate Action and Momentary Pushbutton Switches Features/Benefits • Long travel • Available with LED • Long life contact design • Epoxy terminial seal Pushbutton A Typical Applications • Instrumentation • Computers and peripherals

RS-186E

Abstract: panels
Contextual Info: 8060 Series Alternate Action and Momentary Pushbutton Switches Features/Benefits • Long travel • Available with LED • Long life contact design • Epoxy terminial seal Pushbutton A Typical Applications • Instrumentation • Computers and peripherals