SLCC SERIES Search Results

N681622

Abstract: W681388 TRANSISTOR Bf 310n N681387DG N681387 GKDF QFN-48 thermal resistance N681386 w684386 n681622yg
Contextual Info: N681386/87 Single Programmable Extended Codec/SLCC 1. DESCRIPTION The N681386/87, implements a single channel FXS telephone line interface optimized for short loop applications. It integrates SLCC Subscriber Line Control Circuit functionality with a programmable CODEC and a DC/DC controller.

Contextual Info: DENSE-PAC MICROSYSTEMS 64 Megabit FLASH EEPROM DP5Z4MX16Pn3 PRELIMINARY DESCRIPTION: The DP5Z4MX16Pn3 "SLC C " devices are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC . Available unleaded, straight leaded, "J" leaded, gullwing

Contextual Info: SLCC Vishay Sfernice Hermetic, 50 Mil Pitch, Leadless Chip Resistor Networks FEATURES • High stability Ultrafilm 0.05 % at 1000 h at 70 °C under Pn • Low noise < 35 dB • Hermetic package RoHS COMPLIANT TYPICAL PERFORMANCE ABS TRACKING Actual Size

FAH 32

Contextual Info: 32 Megabit FLASH EEPROM DP5Z1MW32PV3 DESCRIPTION: The DP5Z1MW32PV3 ‘’VERSA-STACK’’ module is a memory subsystem using DPAC Technologies’ ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers 32 Megabits of

DP5Z2MW16PA3

Abstract: DP5Z2MW16PH3 DP5Z2MW16PI3 DP5Z2MW16PJ3 DP5Z2MW16PY3
Contextual Info: 2Mx16, 120 - 200ns, STACK/PGA 30A161-22 A 32 Megabit FLASH EEPROM DP5Z2MW16Pn3 PRELIMINARY DESCRIPTION: SLCC Stack The DP5Z2MW16Pn3 ‘’SLCC’’ devices are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip

DP5Z2MW32PV3

Abstract: Dense-Pac Microsystems
Contextual Info: 64 Megabit FLASH EEPROM DP5Z2MW32PV3 PRELIMINARY DESCRIPTION: The DP5Z2MW32PV3 ‘’VERSA-STACK’’ module is a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It

11A16

Contextual Info: 32 Megabit FLASH EEPROM DP5Z1MW32PV3 DENSIE-PAC MI GR ÖS VST BMS PRELIMINARY DESCRIPTION: The DP5Z1MW32PV3 "VERSA-STACK" module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It

Contextual Info: DENSE-PAC 64 Megabit FLASH EEPROM DP5Z2MW32PV3 MICROSYSTEMS PRELIMINARY DESCRIPTION: The DP5Z2M W 32PV3 VERSA -STA CK module is a revolutionary new memory subsystem using Dense-Pac Microsystems ceram ic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It

Dense-Pac DP5Z1M

Abstract: 30A18
Contextual Info: 32 Megabit FLASH EEPROM DP5Z1MW32PV3 PRELIMINARY DESCRIPTION: The DP5Z1MW32PV3 ‘’VERSA-STACK’’ module is a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It

Contextual Info: Data sheet E 1/4.944 - 10497 SLCC 16 20 24 thin film leadless chip resistor networks Capable to meet characteristics of the MIL-R-83-401 these networks are available in a wide range of resistance values : several standard configurations are presented with feature such.

08AP

Contextual Info: Data sheet E 1/4.944 - 10497 SLCC 16 20 24 thin film leadless chip resistor networks Capable to meet characteristics of the MIL-R-83-401 these networks are available in a wide range of resistance values : several standard configurations are presented with feature such.

resistor 100k ohm

Contextual Info: SURFACE MOUNT NETWORKS SURFACE MOUNT SLCC Vishay Thin Film Hermetic, 50 Mil Pitch, Leadless Chip Resistor Networks FEATURES • High stability Ultrafilm • Low noise • Hermetic package TYPICAL PERFORMANCE ● Actual Size TCR Capable of meeting the characteristics of MIL-PRF-83401

Contextual Info: DENSE-PAC 32 Megabit FLASH EEPROM DP5Z2MW 16Pn3 MICROSYSTEMS PRELIMINARY DESCRIPTION: The DP5Z2M W 16Pn3 " S L C C " devices are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC . Available unleaded, straight leaded, "J" leaded, gullwing

Contextual Info: SLCC CNP www.vishay.com Vishay Sfernice Hermetic, 50 Mil Pitch, Leadless Chip Thin Film Resistor Networks FEATURES • High stability ultrafilm (0.05 % at 1000 h at + 70 °C under Pn) • Custom available (CNP) • Low noise < 35 dB • SMD • Hermetic package

Contextual Info: SURFACE MOUNT NETWORKS SURFACE MOUNT SLCC Vishay Thin Film Hermetic, 50 Mil Pitch, Leadless Chip Resistor Networks FEATURES • High stability Ultrafilm • Low noise • Hermetic package TYPICAL PERFORMANCE ● Actual Size TCR Capable of meeting the characteristics of MIL-PRF-83401

R0005

Abstract: SLCC20
Contextual Info: SLCC Vishay Sfernice Hermetic, 50 Mil Pitch, Leadless Chip Resistor Networks FEATURES • High stability Ultrafilm 0.05 % at 1000 hours at 70 °C under Pn • Low noise < 35 dB RoHS COMPLIANT • Hermetic package Actual Size TYPICAL PERFORMANCE Capable of meeting the characteristics of MIL-PRF-83401

DP5Z2MK16PA3

Abstract: DP5Z2MK16PH3 DP5Z2MK16PI3 DP5Z2MK16PJ3 DP5Z2MK16PY
Contextual Info: 2Mx16, 120 - 200ns, STACK/PGA 30A161-02 A 32 Megabit FLASH EEPROM DP5Z2MK16Pn3 PRELIMINARY DESCRIPTION: The DP5Z2MK16n3 ‘’SLCC’’ devices are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC . Available unleaded, straight leaded, ‘’J’’ leaded, gullwing

SLCC Series

Abstract: DP5Z2MX16PA3 DP5Z2MX16PH3 DP5Z2MX16PI3 DP5Z2MX16PJ3 DP5Z2MX16PY
Contextual Info: 2Mx16, 120 - 200ns, STACK/PGA 30A161-02 1 32 Megabit FLASH EEPROM DP5Z2MX16Pn3 PRELIMINARY DESCRIPTION: The DP5Z2MX16Pn3 ‘’SLCC’’ devices are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC . Available unleaded, straight leaded, ‘’J’’ leaded, gullwing

SMD A06

Abstract: R0005 20A06 A03 SMD
Contextual Info: SLCC CNP Vishay Sfernice Hermetic, 50 Mil Pitch, Leadless Chip Resistor Networks FEATURES • High stability ultrafilm (0.05 % at 1000 h at + 70 °C under Pn) • Custom available (CNP) • Low noise < 35 dB • SMD • Hermetic package Actual Size Capable of meeting the characteristics of MIL-PRF-83401

DP5Z2ME16PA3

Abstract: DP5Z2ME16PH3 DP5Z2ME16PI3 DP5Z2ME16PJ3 DP5Z2ME16PY
Contextual Info: 2Mx16, 120 - 200ns, STACK/PGA 30A161-02 A 32 Megabit FLASH EEPROM DP5Z2ME16Pn3 PRELIMINARY DESCRIPTION: The DP5Z2ME16Pn3 ‘’SLCC’’ devices are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC . Available unleaded, straight leaded, ‘’J’’ leaded, gullwing

resistor* 100k ohm

Abstract: 20A06 a06 transistor resistor 100k ohm
Contextual Info: P R E C I S I O N T H I N F I L M T E C H N O L O G Y SURFACE MOUNT NETWORKS Hermetic, 50 Mil Pitch, Leadless Chip Resistor Networks SLCC Series FEATURES • High stability Ultrafilm • Low noise • Hermetic package TYPICAL PERFORMANCE ● Actual Size

20A06

Abstract: R0005
Contextual Info: SLCC Vishay Sfernice Hermetic, 50 Mil Pitch, Leadless Chip Resistor Networks FEATURES • High stability ultrafilm 0.05 % at 1000 h at + 70 °C under Pn • Low noise < 35 dB RoHS COMPLIANT • Hermetic package Actual Size TYPICAL PERFORMANCE Capable of meeting the characteristics of MIL-PRF-83401

Contextual Info: DENSE-PAC MI C R O S Y S T E MS 32 Megabit FLASH EEPROM DP5Z1MW32PV3 PRELIMINARY DESCRIPTION: The DP5Z1MW32PV3 "VERSA-STACK" module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It

Contextual Info: SURFACE MOUNT NETWORKS SURFACE MOUNT SLCC Vishay Thin Film Hermetic, 50 Mil Pitch, Leadless Chip Resistor Networks FEATURES • High stability Ultrafilm • Low noise • Hermetic package TYPICAL PERFORMANCE Actual Size ● ABS TCR Capable to meet characteristics of the MIL-PRF-83401 these networks are