SMD 0J 157 CAPACITOR Search Results

Nichicon PC Series

Abstract: F551A686MSC SMD 0J 157 capacitor
Contextual Info: 機能性高分子タンタル固体電解コンデンサ Solid Organic Polymer Tantalum Electrolytic Capacitors TENTATIVE F55 ●小形・大容量 ● 低ESR（従来の二酸化マンガンの1/2） ● 高許容リプル電流 ● Miniature, large capacitance

D55 SMD CODE MARKING

Abstract: marking code H10 SMD Transistor smd code J10 SMD 0J 157 capacitor smd marking ks D55 MARKING CODE
Contextual Info: SURFACE MOUNT ALUMINUM ELECTROLYTIC CAPACITORS MV Series ● 85℃ 1,000~2,000Hrs assured. Solventproof ● Vertical SMD Type. ● General. ● RoHS compliant. ● Halogen-free capacitors are also available. WV ≤ 63VDC SPECIFICATIONS Item Characteristics

Contextual Info: TANTALUM ELECTROLYTIC CAPACITORS nidixcon Resin-molded Chip, Solid Organic Polymer Series For SMD Laminated caae prodnets • Specifications Item -5 5 -+ 1 0 5 C Capacitance Tolerance ± 2 0 % at 120Hz Dissipation Factor| 120Hz) S case 10% , „ . N case 8% (a11£0Hz)

MXT3216

Abstract: SMD 0J 157 capacitor
Contextual Info: Multilayer Chip LC Traps MXT Series This is the world-first multilayer chip LC trap having a completely monolithic structure in which ferrite paste and dielectric materials are layered and cofired. FEATURES • Closed magnetic circuit configuration avoids

Contextual Info: F72/F75 Series Low Profile and HiCV Conformal Coated Chip TECHNICAL SPECIFICATIONS Item Category Temperature Range Capacitance Tolerance Dissipation Factor ESR 100kHz LEAD-FREE COMPATIBLE COMPONENT Leakage Current FEATURES Capacitance Change by Temperature

SMD F75

Contextual Info: F72/F75 Series Low Profile and HiCV Conformal Coated Chip TECHNICAL SPECIFICATIONS Item Category Temperature Range Capacitance Tolerance Dissipation Factor ESR 100kHz LEAD-FREE COMPATIBLE COMPONENT Leakage Current FEATURES Capacitance Change by Temperature

capacitor SMD 157 10V

Contextual Info: F72/F75 Series Low Profile and HiCV Conformal Coated Chip FEATURES • Compliant to the RoHS2 directive 2011/65/EU • SMD Conformal • Small and low profile LEAD-FREE COMPATIBLE COMPONENT APPLICATIONS • Smartphone • Mobile phone • Wireless module • Hearing aid

Contextual Info: TANTALUM ELECTROLYTIC CAPACITORS nicKicon J U Resin-molded Chip, Built-in Fuse Series Um ® Far SMD • Specifications item Performance Characteristics O perating Tem perature Range — 5 5 — M 2 5 "C M ax. operating tem perature at rated voltage shaft be up to 8 5 ’C }

smd ic marking su

Abstract: VA MARKING
Contextual Info: aa SOLID TANTALUM ELECTROLYTIC CAPACITORS F91 LOW ESR Resin-molded Chip, For SMD For High Frequency n ic k x c o n For Pb Free Specifications Item P erfo rm an ce C h a ra cte ristics C a teg ory T e m p e ra tu re R ange ±20% , ±10% Lea kag e C urre n t

Contextual Info: F91 Series Low ESR, Resin-Molded Chip J-Lead TECHNICAL SPECIFICATIONS Item Category Temperature Range Capacitance Tolerance Dissipation Factor ESR 100kHz LEAD-FREE COMPATIBLE COMPONENT Leakage Current FEATURES Capacitance Change by Temperature • Compliant to the RoHS2 directive 2011/65/EU

Contextual Info: F91 Series Low ESR, Resin-Molded Chip J-Lead TECHNICAL SPECIFICATIONS Item Category Temperature Range Capacitance Tolerance Dissipation Factor ESR 100kHz LEAD-FREE COMPATIBLE COMPONENT Leakage Current FEATURES Capacitance Change by Temperature • Compliant to the RoHS directive (2002/95/EC)

Contextual Info: F91 Series Low ESR, Resin-Molded Chip J-Lead FEATURES • Compliant to the RoHS2 directive 2011/65/EU • SMD J-lead • Low ESR LEAD-FREE COMPATIBLE COMPONENT APPLICATIONS • General medium power DC/DC convertors L CASE DIMENSIONS: millimeters inches W1

Contextual Info: F92 Series Resin-Molded Chip, Low Profile J-Lead FEATURES • Compliant to the RoHS2 directive 2011/65/EU • SMD J-lead • Low profile case sizes LEAD-FREE COMPATIBLE COMPONENT APPLICATIONS • Handheld electronics • USB accessories L CASE DIMENSIONS: millimeters inches

Contextual Info: F92 Series Resin-Molded Chip, Low Profile J-Lead TECHNICAL SPECIFICATIONS Item Category Temperature Range Capacitance Tolerance Dissipation Factor ESR 100kHz LEAD-FREE COMPATIBLE COMPONENT Leakage Current FEATURES • Compliant to the RoHS2 directive 2011/65/EU

Contextual Info: AUDIO F95 Series Conformal Coated Chip Optimized for Audio Applications TECHNICAL SPECIFICATIONS Item Category Temperature Range Capacitance Tolerance Dissipation Factor ESR 100kHz LEAD-FREE COMPATIBLE COMPONENT Leakage Current FEATURES • Compliant to the RoHS2 directive 2011/65/EU

F931A106MBA

Contextual Info: SOLID TANTALUM ELECTROLYTIC CAPACITORS Resin-molded Chip, Standard Series r - > L • Specifications J Item For SMD Performance Characteristics For Pb Free Category Temperature Range —55— M25°C Rated temperature : 85°C Capacitance Tolerance Dissipation Factor

Contextual Info: ALUMINIUM ELECTROLYTIC CAPACITORS 2009 / 2010 Enjoy Reliable Success About us Since its foundation in 1959 Nantong Jianghai Capacitor Co., Ltd has developed to one of the ten leading manufacturers of professional electrolytic capacitors worldwide. Today more than 1400 employees produce approx. 2.5 billion components per year.

F950G107MAAAQ2

Contextual Info: F95 Series Standard Conformal Coated Chip FEATURES • Compliant to the RoHS2 directive 2011/65/EU • For high frequency • SMD Conformal • Small and high CV LEAD-FREE COMPATIBLE COMPONENT APPLICATIONS • Smartphone • Tablet PC • Wireless module • e-book

F950G107MAAAQ2

Contextual Info: F95 Series Standard Conformal Coated Chip TECHNICAL SPECIFICATIONS Item Category Temperature Range Capacitance Tolerance Dissipation Factor at 120Hz ESR (100kHz) LEAD-FREE COMPATIBLE COMPONENT Leakage Current FEATURES Capacitance Change by Temperature • Compliant to the RoHS2 directive 2011/65/EU

F950G107MAAAQ2

Contextual Info: F95 Series Standard Conformal Coated Chip TECHNICAL SPECIFICATIONS Item Category Temperature Range Capacitance Tolerance Dissipation Factor at 120Hz ESR (100kHz) LEAD-FREE COMPATIBLE COMPONENT Leakage Current FEATURES Capacitance Change by Temperature • Compliant to the RoHS directive (2002/95/EC)

Contextual Info: F93 Series Resin-Molded Chip, Standard Tantalum J-Lead FEATURES • Compliant to the RoHS2 directive 2011/65/EU • SMD J-lead LEAD-FREE COMPATIBLE COMPONENT APPLICATIONS • Low power DC/DC A, B CASE CASE DIMENSIONS: millimeters inches C, N CASE Code A

Contextual Info: F93 Series Resin-Molded Chip, Standard Tantalum J-Lead FEATURES • Compliant to the RoHS2 directive 2011/65/EU • SMD J-lead LEAD-FREE COMPATIBLE COMPONENT APPLICATIONS • Low power DC/DC A, B CASE CASE DIMENSIONS: millimeters inches C, N CASE Code A

Contextual Info: F93 Series Resin-Molded Chip, Standard Tantalum J-Lead TECHNICAL SPECIFICATIONS Item Category Temperature Range Capacitance Tolerance Dissipation Factor ESR 100kHz LEAD-FREE COMPATIBLE COMPONENT Leakage Current FEATURES Capacitance Change by Temperature

Contextual Info: F93 Series Resin-Molded Chip, Standard Tantalum J-Lead TECHNICAL SPECIFICATIONS Item Category Temperature Range Capacitance Tolerance Dissipation Factor ESR 100kHz LEAD-FREE COMPATIBLE COMPONENT Leakage Current FEATURES Capacitance Change by Temperature