SMD MFU Search Results

smd fuse marking H

Abstract: MFU0603FF05000P500 IR32V SMD code mfu 25 smd fuse marking code smd marking code T1 smd marking code mfu
Contextual Info: MFU Series Vishay Beyschlag Thin Film Chip Fuses FEATURES • Advanced thin film technology • Very quick acting fuse characteristics • Outstanding stability of fusing characteristics • Standard SMD sizes • Green product, supports lead Pb -free soldering

fuse smd code N

Abstract: smd fuse marking code G 560 m 13 MFU0603FF05000P500 smd fuse marking H A2S258 smd marking code mfu MFU C 207
Contextual Info: MFU Series Vishay Beyschlag Thin Film Chip Fuses FEATURES • Advanced thin film technology • Very quick acting fuse characteristics • Outstanding stability of fusing characteristics • Standard SMD sizes • Green product, supports lead Pb -free soldering

fuse smd code Y

Abstract: fuse smd code c SMD code mfu fuse smd code S SMD FUSE CODE M 1608M smd mFU FUSE SMD 0603 fuse smd code o fuse smd code 4
Contextual Info: MFU Series SMD Chip Fuse for Secondary Over-Current Protection FEATURES • Circuit protection • Very quick acting fuse characteristics • Outstanding stability of fusing characteristics • Supports lead Pb -free soldering • Meets requirements of IEC 60127-4 and UL 248-14

IEC 60127-1

Abstract: 1 smd fuse marking code n smd marking code mfu SMD code mfu 1 smd fuse marking code 32 fuse smd code N smd fuse marking code 20 1 smd fuse marking code fuse smd code h smd fuse marking H
Contextual Info: MFU 0805, MFU 0603 Vishay Beyschlag Thin Film Flat Chip Fuses FEATURES • Advanced thin film technology • Very quick acting fuse characteristics • Outstanding stability of fusing characteristics • Standard metric SMD sizes • Green product, supports lead Pb -free soldering

IEC 60127-1

Abstract: 1206F SMD code mfu 1 smd fuse marking code cv SMD fuse x 153 MFU0402 MFU04
Contextual Info: MFU Series - Thin Film Fuse Vishay Beyschlag Thin Film Flat Chip Fuses FEATURES • Advanced thin film technology • Very quick acting fuse characteristics • Outstanding stability of fusing characteristics • Standard metric SMD sizes • Green product, supports lead Pb -free soldering

smd fuse marking code 20

Abstract: smd 1a5 MFU 0603-FF P1 2A0 1 smd fuse marking code cv 25 smd fuse marking code fuse smd code N 1 smd fuse marking code 32 CT 101 K 104 B 1206 1 smd fuse marking code n smd fuse marking H
Contextual Info: MFU Series - Thin Film Fuse Vishay Beyschlag Thin Film Flat Chip Fuses FEATURES • Advanced thin film technology • Very quick acting fuse characteristics • Outstanding stability of fusing characteristics • Standard metric SMD sizes • Green product, supports lead Pb -free soldering

smd fuse marking code u

Abstract: fuse smd code N IEC 60127 MV-13 IEC 60127-1 smd fuse marking MFU 0603-FF PW 3A0 E01A0 SMD code mfu V50A
Contextual Info: MFU Series - Thin Film Fuse Vishay Beyschlag Thin Film Flat Chip Fuses FEATURES • Advanced thin film technology • Very quick acting fuse characteristics • Outstanding stability of fusing characteristics • Standard metric SMD sizes • Green product, supports lead Pb -free soldering

smd marking code mfu

Abstract: smd fuse marking code K m86m smd fuse marking code m smd fuse marking H IR511 SMD code mfu IEC 60127-1
Contextual Info: MFU 0805, MFU 0603 Vishay Beyschlag Thin Film Flat Chip Fuses FEATURES • Advanced thin film technology • Very quick acting fuse characteristics • Outstanding stability of fusing characteristics • Standard metric SMD sizes • Green product, supports lead Pb -free soldering

SMD code mfu

Abstract: smd marking code mfu 1 smd fuse marking code cv MFU0402 MFU04
Contextual Info: MFU Series - Thin Film Fuse Vishay Beyschlag Thin Film Flat Chip Fuses FEATURES • Advanced thin film technology • Very quick acting fuse characteristics • Outstanding stability of fusing characteristics • Standard metric SMD sizes • Compatible with Pb -free and lead containing soldering

1 smd fuse marking code cv

Abstract: fuse smd code N smd fuse marking code G 25 smd fuse marking code k smd fuse marking code smd 1a5 1 smd fuse marking code fuse smd code p MFU 0603-FF PW 3A0 1 smd fuse marking code n
Contextual Info: MFU Series - Thin Film Fuse Vishay Beyschlag Thin Film Flat Chip Fuses FEATURES • • • • • R Advanced thin film technology Very quick acting fuse characteristics Outstanding stability of fusing characteristics Standard metric SMD sizes Green product, supports Lead Pb -free soldering

fuse smd code N

Abstract: fuse smd code Y fuse smd code D fuse smd code c smd 1a5 SMD code mfu fuse smd code p SMD CODE E5 smd fuse p smd fuse m
Contextual Info: MFU Se r ie s Key Benefits • Circuit protection • Very quick acting fuse characteristics • Outstanding stability of fusing characteristics • Supports lead Pb -free soldering • Meets requirements of IEC 60127-4 and UL 248-14 • Standard metric SMD sizes

smd fuse marking H

Abstract: 1 smd fuse marking code cv smd fuse marking code f smd marking code mfu 3A15 smd 1a5 smd 2A5 fuse smd code 162 smd fuse marking code G marking mfu
Contextual Info: MFU Series - Thin Film Fuse Vishay Beyschlag Thin Film Flat Chip Fuses FEATURES • • • • • R Advanced thin film technology Very quick acting fuse characteristics Outstanding stability of fusing characteristics Standard metric SMD sizes Green product, supports Lead Pb -free soldering

Contextual Info: V is h ay I n tertec h n olo g y, I n c . I INNOVAT AND TEC O L OGY MFU Series N HN THIN FILM FUSE O 19 62-2012 Fuses - Quick Acting Fuse Characteristics SMD Chip Fuse for Secondary Over-Current Protection Key Benefits • • • • • • Circuit protection

MSMD020

Abstract: mSMD200 MF-MSMD010 MF-MSMD014 MF-MSMD020 MF-MSMD050 MF-MSMD075 MF-MSMD110 MF-MSMD125 MF-MSMD150
Contextual Info: Features Applications • 4.5mm SMD Fast tripping resettable circuit protection Surface mount packaging for automated assembly Reduced component size and resistance ■ Agency recognition: ■ ■ ■ High Density Circuit Board Applications: ■ Hard disk drives

smd marking w6

Abstract: SMD mark code H1
Contextual Info: Features Applications • 4.5mm SMD Fast tripping resettable circuit protection Surface mount packaging for automated assembly Reduced component size and resistance ■ Agency recognition: ■ ■ ■ High Density Circuit Board Applications: ■ Hard disk drives

Contextual Info: Features Applications • 4.5mm SMD Fast tripping resettable circuit protection Surface mount packaging for automated assembly Reduced component size and resistance ■ Agency recognition: ■ ■ ■ High Density Circuit Board Applications: ■ Hard disk drives

Contextual Info: Features Applications • 4.5mm SMD Fast tripping resettable circuit protection Surface mount packaging for automated assembly Reduced component size and resistance ■ Agency recognition: ■ ■ ■ High Density Circuit Board Applications: ■ Hard disk drives

MF-MSMD

Contextual Info: Features Applications • 4.5mm SMD Fast tripping resettable circuit protection Surface mount packaging for automated assembly Reduced component size and resistance ■ Agency recognition: ■ ■ ■ High Density Circuit Board Applications: ■ Hard disk drives

EIA rs 186

Abstract: mSMD200 MF-MSMD010 MF-MSMD014 MF-MSMD020 MF-MSMD030 MF-MSMD050 MF-MSMD075 MF-MSMD110 MF-MSMD125
Contextual Info: Features Applications • 4.5 mm SMD Fast tripping resettable circuit protection Surface mount packaging for automated assembly Reduced component size and resistance ■ Agency recognition: ■ ■ ■ High Density Circuit Board Applications: ■ Hard disk drives

Contextual Info: Features Applications • 4.5 mm SMD Fast tripping resettable circuit protection Surface mount packaging for automated assembly Reduced component size and resistance ■ Agency recognition: ■ ■ ■ High Density Circuit Board Applications: ■ Hard disk drives

MF-MSMD010

Abstract: MF-MSMD014 MF-MSMD020 MF-MSMD030 MF-MSMD050 MF-MSMD075 MF-MSMD110 MF-MSMD125 MF-MSMD150 MF-MSMD160
Contextual Info: Features • 4.5 mm SMD Fast tripping resettable circuit protection Surface mount packaging for automated assembly Reduced component size and resistance ■ Agency recognition: ■ ■ ■ The MF-MSMD Series is currently available, although not recommended

MF-MSMD030

Abstract: MF-MSMD050 MF-MSMD075 MF-MSMD110 MF-MSMD125 MF-MSMD150 MF-MSMD010 MF-MSMD014 MF-MSMD020
Contextual Info: Features Applications • 4.5 mm SMD Fast tripping resettable circuit protection Surface mount packaging for automated assembly Reduced component size and resistance ■ Agency recognition: ■ ■ ■ High Density Circuit Board Applications: ■ Hard disk drives

MF-MSMD010

Abstract: MF-MSMD014 MF-MSMD020 MF-MSMD030 MF-MSMD050 MF-MSMD075 MF-MSMD110 MF-MSMD125 MF-MSMD150 a 701 smd
Contextual Info: Features Applications • 4.5 mm SMD Fast tripping resettable circuit protection Surface mount packaging for automated assembly Reduced component size and resistance ■ Agency recognition: ■ ■ ■ High Density Circuit Board Applications: ■ Hard disk drives

Bourns Soldering Profile Sn-pb

Contextual Info: Multifuse Polymer PTC Soldering Recommendations Introduction The most important consideration in reliability is achieving a good solder bond between a surface mount device SMD and substrate since the solder provides the thermal path from the chip. A good