SO001 Search Results

Contextual Info: 10 15.24 ±0.25 DIM X + 0 .Z 5 - SEC TIO N A - A -KEEP OUT ZONE -165.00 MAX -148.00 MAX i 26.00 MAX 2X1 A 14.50 MIN (2X 4 127.83D A T E CODE (Y Y D D D )Z A A ^PAR T a - 5.00 NIN (2X) NO. 4222 □ E /11\ EX t PIN a 120- -PIN tt1 -11.50 NOTES: 1. -141.00-

Contextual Info: APPROVED: DATE:_TITLE: D SPECIFICATIONS: Material: Insulator: PA66, glass reinforced, rated UL 94V—2 Insulator color: White contact: Brass, Tin or Ni plated Electrical: Current rating: 7 Amps max Contact resistance: 20m ohm s max Insulation resistance: 1,0 0 0 Mohms min

Contextual Info: 10 4 3 2 1 NOTES: 1. M ATERIALS HOUSING - HIGH TEMP. NYLON UL 9 4 V -0 EJECTOR - HIGH TEMP. THERMOPLASTIC UL 9 4 V -0 TERMINAL - COPPER ALLOY 2. PLATING - SEE T A B L E IN SH EET 5 8 6. 3. CARD SLOT ACCEPTS 1.27±0.10 MM MODULE THICKNESS. MEASURED OVER P.C. PADS

Contextual Info: 10 NOTES: 1. MATERIALS HOUSING - HIGH TEMP. NYLON GLASS FILLED, UL 94V-0 COLOR: BLACK EJECTOR - HIGH TEMP. NYLON GLASS FILLED, UL 94V-0 COLOR: SEE TABLE TERMINAL - COPPER ALLOY 2. PLATING - SEE TABLE IN SHEET 5 & 6. 3. CARD SLOT ACCEPTS 1.27±0.10 MM MODULE THICKNESS.

JEDEC MO 224

Abstract: so dimm ddr2 connector MO-224 GS-12-195 DDR2 pcb design MO-237 SODIMM DDR2 Connector so-dimm 200 DDR2 DIMM dimm socket
Contextual Info: BOARD TO BOARD CONNECTORS DDR2 MEMORY MODULE SOCKETS DESCRIPTION DDR2 memory module sockets from FCI accept industrystandard FB-DIMM, DIMM, or SO-DIMM assemblies. The sockets allow convenient memory expansion in servers, workstations, desktop PCs, mobile PCs and embedded

Contextual Info: 10 NOTES: 1. M A T E R I A L S HOUSING - HIGH TE M P . N Y L O N G L A S S F I L L E D , U L 9 6 V - 0 COLOR: B L A C K E J E C T O R - HIGH TE M P . N Y L O N G L A S S R IL L E D , U L 9 A V - 0 COLOR: S E E T A B L E TE RM INAL - COPPER A L L O Y 2. P L A T I N G - S E E T A B L E IN S H E E T 5 X 6.

SH A 94V-0

Contextual Info: 10 4 I 3 I 2 I 1 NOTES: 1. MATERIALS HOUSING - HIGH TEMP. NYLON, G LA SS FILLED, UL 94V-0, BLACK EJECTOR - HIGH TEMP. NYLON, G LASS FILLED, UL 94V-0, NATURAL B A SE PLATE - HIGH TEMP. NYLON, G LA SS FILLED, UL 94V-0 TERMINAL - COPPER ALLOY 2. PLATING - S E E TABLE IN SH EET 5.

Contextual Info: 10 4 I 3 I 2 I 1 NOTES: 1. M A T E R IA LS HOUSING - HIGH TEMP. NYLON, G L A S S FILLED, UL 94V-0, BLACK EJECTO R - HIGH TEMP. NYLON, G L A S S FILLED, UL 94V-0, N A T U R A L B A S E P L A T E - HIGH TEMP. NYLON, G L A S S FILLED, UL 9 4 V -0 TERM IN AL - CO PPER A LLO Y

Contextual Info: Rev APPROVED: DATE:_ AWO# • Description Date RELEASED 5/03/10 Appr TITLE: -.228 [5.80] .311 [7.90] .270 [6.85] .270 [6.85] 0.120 [3.05] I— SPECIFICATIONS: Material: RECOMMENDED P.C.B. LAYOUT Insulator: PBT, gla ss reinforced, rated UL 9 4 V —0 Insulator color: Black

Contextual Info: 10 r—14.50 MIN 2 X / \ p5.00MIN (2X)/(\ 26.00MAX (2X)A % NOTES: 1. MATERIALS (2X) SECTION A -A HOUSING - HIGH TEMP LCP GLASS FILLED, UL 94V-0, BLACK EJECTORS - HIGH TEMP NYLON GLASS FILLED, UL 94V-0, BLACK TERMINALS - COPPER ALLOY 2. PLATING OPTION - PLS REFER TO SHEET 5.

ULN 2006

Contextual Info: 10 NOTES: 1. M A T E R IA LS HOUSING - HIGH TEMP. NYLON G LA S S FILLED , UL 94 V-0,BLACK. EJECTOR - HIGH TEMP. NYLON G LA S S FILLED, UL 94 V-0,BLACK. TERM IN AL - COPPER A LLO Y 2. PLATIN G - S E E T A B L E IN S H E E T 5. 3. CARD S LO T AC CEPTS 1.27 + 0.10 MM MODULE THICKNESS.

DK51 transistor

Abstract: transistor dk51 TRANSISTOR KATALOG CSC01 IEC61131-3 rj45 MB90F546 JTag Emulator MB90F497 EN954-1 RISM51 Renesas 61508
Contextual Info: Service ist unsere Stärke SYS TEC - Ihr Erfolgspartner! Ein beträchtlicher Teil der Innovation im Maschinen- und Anlagenbau geht von elektronischen Komponenten aus. Die SYS TEC electronic GmbH ist ein Systemhaus für Embedded Lösungen Prototyping und Serienfertigung Production on Demand. Elektronische Lösungen und gerade auch Lösungen der Automatisierungstechnik werden zunehmend komplexer. In Einzelfirmen ist es kaum möglich den raschen Innovationswandel für alle Komponenten umfangreicher Systeme nachzuvollziehen. Deshalb gewinnen Kooperationen und Outsourcing zunehmend an Bedeutung. Nutzen

Contextual Info: 10 NOTES: 1. M ATERIALS HOUSING - HIGH TEMP. NYLON GLASS FILLED, UL 94 V -0 , BLACK. EJECTOR - HIGH TEMP. NYLON GLASS FILLED, UL 94 V -0 , BLACK. TERMINAL - COPPER ALLOY 2. PLATING - SEE T A B L E IN S H EET 5. 3. CARD SLOT ACCEPTS 1.27 + 0.10 MM MODULE THICKNESS.

Contextual Info: 10 14.50 MIN 2 X / \ 5.00MIN (2X)/j\ 26.00MAX (2X)A % NOTES: 1. MATERIALS <2X) SECTION A-A HOUSING - HIGH TEMP LCP GLASS FILLED, UL 94V-0, BLACK EJECTORS - HIGH TEMP NYLON GLASS FILLED, UL 94V-0, BLACK TERMINALS - COPPER ALLOY 2. PLATING OPTION - PLS REFER TO SHEET 5.

ic. uln 2003

Abstract: ULN 2003 E 5309N
Contextual Info: 10 NO TES: 1. M A T E R IA L S H O USIN G - HIGH T E M P . N Y L O N G L A S S F IL L E D , U L 9 A V - 0 CO LO R: B L A C K EJE C TO R - HIGH T E M P . N Y L O N G L A S S CO LO R: S E E T E R M IN A L 2. P L A T IN G - CO PPER - SEE 3. C A R D S L O T ALLO Y