SOCKET YAMAICHI IC107 Search Results

Yamaichi ic354

Abstract: IC354 IC51-2084-1052-36 IC51-0484-806 Enplas OTS-32-0.5-01 sumitomo 3m Enplas fpq 352 IC235-0442 fpq-64-0.5-06 Enplas fpq 240
Contextual Info: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 8. RELATED INFORMATION This document is Chapter 8 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 8. RELATED INFORMATION 8. RELATED INFORMATION

LGA 1155 Socket PIN diagram

Abstract: marking code smd fujitsu Yamaichi ic354 marking code smd semiconductor fujitsu pitch 0.4 QFP 256p SMD transistor M05 YAMAICHI ic234 smd code 38P fpq-144-0.5-03 smd p08
Contextual Info: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and

SMD MARKING CODE 071 A01

Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
Contextual Info: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods

IC107

Abstract: IC114 IC118 IC189 IC120 IC191 IC438 socket Yamaichi IC201 socket Yamaichi ic53
Contextual Info: Receptacles Design Rules Acceptable Sockets Application: The receptacle is used as an additional adapter between the PCB and the Test and Burn-In socket, therefore making the socket removable Terminal Length: Minimum pin length 2.4mm Maximum pin length 3.8mm

IC107

Abstract: IC107-2803-24xx-G socket Yamaichi ic107 300MIL
Contextual Info: IC107 Series Live Bug Insertion Small Outline J-Lead Package (SOJ) Specifications Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Current Rating: Operating Temperature Range: Mating Cycles: Part Number (Details) IC107 - 26 03 - * * xx - G

IC107

Abstract: IC107-3203 IC107-4204 IC107-4404 300MIL IC107-26035-20G
Contextual Info: IC107 Series Small Outline J-Lead Package SOJ - Live Bug Insertion Specifications Part Number (Details) 1,000M Ω min. at 500V DC Insulation Resistance: Dielectric Withstanding Voltage: 700V AC for 1 minute 30m Ω max. at 10mA/20mV max. Contact Resistance:

Contextual Info: YAMAICHI RECEPTACLES • CHARACTERISTICS Insulation Resistance Dielectric W ithstanding Voltage INSULATOR MATERIAL Polyetherimide. No Glass ULTEM 1,000 at 500 VDC 500 VAC for one minute ■ CONTACT MATERIAL Inner Contact Beryllium Copper 172 Heat treated.

ICT-083-S-TG

Abstract: NSH-06DB-S2-TG ADS56004 DSP56002 DSP56004 JG11 SBL-02-S-TG AES EBU CONVERTER NSH-40DB-S2-TG30 socket s1
Contextual Info: CHAPTER 9 DSP56004 APPLICATION DEVELOPMENT MODULE HARDWARE DESCRIPTION 9.1 BOARD ARCHITECTURE The DSP56004 ADM has various options to facilitate evaluation of the different features of the chip. These options are outlined in this chapter with a statement on the default factory jumpers the ADM will be shipped with.

LGA 1156 PIN OUT diagram

Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
Contextual Info: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)