SOD323 WAVE SOLDERING Search Results

sod323 wave soldering

Contextual Info: Wave soldering footprint Footprint information for wave soldering of plastic surface-mounted, 2 leads package SOD323 5 2.9 1.5 2x 2.75 1.2 (2×) preferred transport direction during soldering solder land solder resist occupied area Dimensions in mm www.nxp.com

reflow profile 00802

Abstract: sod323 reflow sod323 wave soldering
Contextual Info: SIEM EN S Notes on Processing Table 1 Solderability Test to Siemens Standard Test criterion Solder bath temperature °C Dwell time in bath s Components for wave and reflow soldering Wetting 215 ± 3 3 ±0.3 Dewetting and leaching 260 ± 5 30 ±1 Components for reflow soldering only

CHHZ260GP

Abstract: CHHZ270GP CHHZ280GP CHHZ290GP CHHZ300GP CHHZ310GP
Contextual Info: CHHZ260GP CHENMKO ENTERPRISE CO.,LTD THRU SURFACE MOUNT ZENER SILICON PLANAR POWER ZENER DIODES VOLTAGE RANGE 260V TO 310V CHHZ310GP FEATURE * * * * * * High temperature soldering type. ESD rating of class 3 >16 kV per human body model. Silicon planar zener diodes.

sod323 wave soldering

Abstract: sod323 reflow reflow profile 00802 sot363 wave soldering HLG05516 HLG05517 HLG05520 HLG05521 HLG05818 HLG05820
Contextual Info: Notes on Processing Component Placement HLG0 5414 The ability to place semiconductors depends very much on the type involved. Up to a pitch size of 1.27 mm, mechanical centering by tools of an automatic component placement machine suffices, e.g. jaws and centering units. Multiple-pin ICs have to be placed

CDBV120

Abstract: CDBV130 CDBV140 sod323 wave soldering
Contextual Info: Surface Mount Schottky Barrier Rectifier COMCHIP www.comchiptech.com CDBV120 THRU CDBV140 Voltage Range 20 to 40V Current 1.0 Ampere Features High current capability Extremely Low Thermall Resestance For Surface Mount Application High Temp Soldering : 250oC for 10

zener diode 182

Abstract: MMPZ5221SPT mmpz5269spt MMPZ5226S mmpz5257spt MMPZ5265SPT zener 7.5 B zener diode on 822 Zener Diode SOD-323 MMPZ5233SPT
Contextual Info: MMPZ5221SPT CHENMKO ENTERPRISE CO.,LTD THRU SURFACE MOUNT ZENER SILICON PLANAR POWER ZENER DIODES VOLTAGE RANGE 2.4V TO 91V MMPZ5270SPT FEATURE * * * * * * High temperature soldering type. ESD rating of class 3 >16 kV per human body model. Silicon planar zener diodes.

MMPZ5232BPT

Abstract: MMPZ5226BPT MMPZ5235BPT MMPZ5242BPT MMPZ5253BPT MMPZ5250BPT MMPZ MMPZ5221BPT MMPZ5236B MMPZ5240B
Contextual Info: MMPZ5221BPT CHENMKO ENTERPRISE CO.,LTD THRU SURFACE MOUNT ZENER SILICON PLANAR POWER ZENER DIODES VOLTAGE RANGE 2.4V TO 91V MMPZ5270BPT FEATURE * * * * * * High temperature soldering type. ESD rating of class 3 >16 kV per human body model. Silicon planar zener diodes.

MMPZ5270SGP

Abstract: MMPZ5221SGP MMPZ5222SGP MMPZ5223SGP MMPZ5224SGP MMPZ5225SGP MMPZ5226SGP MMPZ5227SGP MMPZ5228SGP MMPZ5229SGP
Contextual Info: MMPZ5221SGP CHENMKO ENTERPRISE CO.,LTD THRU SURFACE MOUNT ZENER SILICON PLANAR POWER ZENER DIODES VOLTAGE RANGE 2.4V TO 91V MMPZ5270SGP FEATURE * * * * * * High temperature soldering type. ESD rating of class 3 >16 kV per human body model. Silicon planar zener diodes.

SOD110 footprint

Abstract: MSA430 SOD523 footprint MSA428 sot23 footprint SC-76 flux. PHILIPS AN-450 surface mounting methods
Contextual Info: Philips Semiconductors Mounting and Soldering General MOUNTING AND SOLDERING Screen printing Mounting methods This is the best high-volume production method of solder paste application. An emulsion-coated, fine mesh screen with apertures etched in the emulsion to coincide with the

mmpz5221bgp

Abstract: MMPZ5222BGP MMPZ5223BGP MMPZ5224BGP MMPZ5225BGP MMPZ5226BGP MMPZ5227BGP MMPZ5228BGP MMPZ5229BGP MMPZ5230BGP
Contextual Info: MMPZ5221BGP CHENMKO ENTERPRISE CO.,LTD THRU SURFACE MOUNT ZENER SILICON PLANAR POWER ZENER DIODES VOLTAGE RANGE 2.4V TO 91V MMPZ5270BGP FEATURE * * * * * * High temperature soldering type. ESD rating of class 3 >16 kV per human body model. Silicon planar zener diodes.

All smd Packages sct-595 sot-23

Abstract: HLG05531 HLG05532 HLG09054 SCT-595
Contextual Info: Notes on Processing Component Placement The ability to place semiconductors depends very much on the type involved. Up to a pitch size of 1.27 mm, mechanical centering by tools of an automatic component placement machine suffices, e.g. jaws and centering units. Multiple-pin ICs have to be placed

SOT323 reflow

Abstract: All smd Packages sct-595 sot-23 dual infrared transistor CECC 00802 reflow profile 00802 SC-75 SCT-595 sod323 reflow
Contextual Info: Notes on Processing Component Placement The ability to place semiconductors depends very much on the type involved. Up to a pitch size of 1.27 mm, mechanical centering by tools of an automatic component placement machine suffices, e.g. jaws and centering units. Multiple-pin ICs have to be

smd diode sod-323 marking code L2

Abstract: smd diode sod-323 marking code l3
Contextual Info: Formosa MS Low VF Chip Schottky Barrier Rectifier SL12-N THRU SL14-N List List. 1 Package outline. 2

smd diode sod-323 marking code L2

Abstract: marking code L2 SL24-N SOD323 L4 marking
Contextual Info: Formosa MS Low VF Chip Schottky Barrier Rectifier SL22-N THRU SL24-N List List. 1 Package outline. 2

FM0520-N

Abstract: FM0530-N FM0540-N FM0550-N FM0560-N
Contextual Info: Formosa MS Chip Schottky Barrier Rectifier FM0520-N THRU FM0560-N List List. 1 Package outline. 2

Sony Semiconductor Replacement Handbook 1991

Abstract: 2sc5088 horizontal transistors tcxo philips 4322 20000w audio amplifier circuit diagram replacement for 2sc5088 horizontal transistors motorola power fet rf databook 2SK170BL Funkamateur transistor 1060 schematic diagram tv sony
Contextual Info: Philips RF Manual product & design manual for RF small signal discretes 3 edition July 2003 rd / discretes/documentation/rf_manual Document number: 4322 252 06384 Date of release: July 2003 3rd edition

Contextual Info: Formosa MS Chip Schottky Barrier Rectifier FM120-N THRU FM1100-N List List. 1 Package outline. 2

sod323 wave soldering

Contextual Info: Bulletin PD-20210 rev. A 07/02 MBRX0540 0.5 Amp SCHOTTKY DIODE 2 1 SOD323 Major Ratings and Characteristics Characteristics Value Units IF AV (DC) 0.5 A VRRM 40 V IFSM @ tp= 10 ms sine 5.5 A VF @ 0.5Apk, TJ= 100°C 0.38 V Pd Power Dissipation @ TA = 25°C

SOD80 footprint

Abstract: SOD87 footprint land pattern sot346 SOD110 footprint SOD106 land pattern sod110 land do-41 footprint MSA435 DO-35 land pattern how epoxy can contribute to meniscus
Contextual Info: SECTION 17 MOUNTING AND SOLDERING contents page INTRODUCTION 17 - 2 AXIAL AND RADIAL LEADED DEVICES 17 - 2 Handling 17 - 2 Soldering 17 - 2 Mounting 17 - 3 SURFACE-MOUNT DEVICES 17 - 3 Reflow soldering process 17 - 3 Double-wave soldering process 17 - 7 Hand soldering of microminiature components

MBRX0540

Abstract: B0902
Contextual Info: Bulletin PD-20210 rev. B 09/02 MBRX0540 0.5 Amp SCHOTTKY DIODE 2 1 SOD323 Major Ratings and Characteristics Characteristics Description/ Features Value Units IF AV (DC) 0.5 A VRRM 40 V IFSM @ tp= 10 ms sine 5.5 A Small footprint, surface mountable Very low forward voltage drop

JEDEC sod323

Abstract: smd schottky diode s3 S3 marking DIODE PMEG1020EA PMEG2010EA PMEG2020AEA SC-76 sod323 marking NO sod323 wave soldering
Contextual Info: DISCRETE SEMICONDUCTORS DATA SHEET handbook, halfpage M3D049 PMEG2020AEA 20 V, 2 A very low VF MEGA Schottky barrier rectifier in SOD323 SC-76 package Product specification 2004 Feb 26 Philips Semiconductors Product specification 20 V, 2 A very low VF MEGA Schottky

TVSP24VCESGP

Contextual Info: CHENMKO ENTERPRISE CO.,LTD TVSP24VCESGP STANDARD CAPACITANCE TVS VOLTAGE 24V 350 WATTS PEAK PULSE POWER FEATURES *Bidirectional *350W peak pulse power dissipation rating at tp= 8X20uSec * Low leakage current * ESD Voltage HBM Wavefrom was 30KV SC-76/SOD-323

NXP SMD ZENER DIODE MARKING CODE

Abstract: BZB100A SC-76 ZENER diode sc76 Zener diode smd marking codes 1.2 Zener diode smd marking code ja
Contextual Info: BZB100A Dual back-to-back Zener diode Rev. 01 — 28 January 2008 Product data sheet 1. Product profile 1.1 General description Dual back-to-back Zener diode in a SOD323 SC-76 very small Surface-Mounted Device (SMD) plastic package. 1.2 Features • ■

sc-76 package

Abstract: smd schottky diode s3 sod323 wave soldering
Contextual Info: DISCRETE SEMICONDUCTORS DATA SHEET handbook, halfpage M3D049 PMEG2020AEA 20 V, 2 A very low VF MEGA Schottky barrier rectifier in SOD323 SC-76 package Product data sheet 2004 Feb 26 NXP Semiconductors Product data sheet 20 V, 2 A very low VF MEGA Schottky