SOIC 14 Search Results

SN65HVD33-EP

Abstract: TSB89 SN65HVD37DR
Contextual Info: RHL QFN D-8 (SOIC) D-14 (SOIC) SN65HVD30 – SN65HVD35 www.ti.com SLLS665I – SEPTEMBER 2005 – REVISED APRIL 2010 3.3 V FULL-DUPLEX RS-485 DRIVERS AND RECEIVERS Check for Samples: SN65HVD30 – SN65HVD35 FEATURES 1 • • • • • • • • •

ltc4151

Contextual Info: RELIABILITY DATA LTC4151 / LTC6101 / LTC6102 / LTC6103 / LTC6104 8/13/2009 • OPERATING LIFE TEST PACKAGE TYPE SAMPLE SIZE SOIC/SOT/MSOP QFN/DFN 505 154 659 • PRESSURE COOKER TEST AT 15 PSIG, +121°C PACKAGE TYPE SAMPLE SIZE SOIC/SOT/MSOP QFN/DFN 10,427

DS1233 a5

Abstract: e8 sot223 9915 dallas 25010 DN819 densit DS1232L ds1232l datasheet DS1869 DK815282AAB
Contextual Info: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY DATE PRODUCT REV JOB NO CODE FACILITY LOT NO. DS1621 A7 JUN '99 24325 9915 ATP Anam, PI DK815282AAB SOIC 50 45 DS1621 A7 SEP '99 24466 9930 ATP (Anam, PI) DK906731AAC SOIC

Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 26-Sep-2005 Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LS151DR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS151DRE4 ACTIVE SOIC D 16 2500 Green (RoHS &

Contextual Info: PACKAGE OPTION ADDENDUM www.ti.com 26-Sep-2005 Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LS151DR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS151DRE4 ACTIVE SOIC D 16 2500 Green (RoHS &

IL213AT

Contextual Info: IL211AT, IL212AT, IL213AT Vishay Semiconductors Optocoupler, Phototransistor Output, with Base Connection in SOIC-8 A 1 8 NC K 2 7 B NC 3 6 C NC 4 5 E FEATURES • Isolation test voltage, 4000 VRMS • Industry standard SOIC-8 surface mountable package • Compatible with dual wave, vapor phase and IR

51597A

Abstract: DIP14 footprint MCP2120 MCP42010 MCP42050 SOIC-14 MOSFET R3D SOT23 R2P MARK R2C SOT-23 r2e sot 23
Contextual Info: 14-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide 2006 Microchip Technology Inc. DS51597A Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet.

100-16L

Abstract: DS1803-010 DS1803E-010 DS1803-050 DS1803 DS1803-100
Contextual Info: DS1803 Addressable Dual Digital Potentiometer www.dalsemi.com PIN ASSIGNMENT FEATURES § 3V or 5V Power Supplies § Ultra-low power consumption § Two digitally controlled, 256-position potentiometers § 14-Pin TSSOP 173 mil and 16-Pin SOIC (150 mil) packaging available for surface

MMAD1106

Contextual Info: MMAD1106 8700 E. Thomas Road Scottsdale, AZ 85251 Tel: 602 941-6300 Fax (602) 947-1503 Switching Diode Array FEATURES • • • 8 Isolated lines of protection Common Anode SOIC 14 pin Surface Mount Package UL 94V-0 Flammability Classification MECHANICAL

NTE859

Abstract: NTE859SM NTE85
Contextual Info: NTE859/NTE859SM Integrated Circuit Quad, Low Noise, JFET Input Operational Amplifier Description: The NTE859 14−Lead DIP and NTE859SM (SOIC−14 Surface Mount) JFET−input operational amplifiers are low noise amplifiers with low noise input bias, offset currents, and fast slew rate. The low

DM74LS28

Abstract: DM74LS28M M14A
Contextual Info: Revised January 2001 DM74LS28 Quad 2-Input NOR Buffer General Description The DM74LS28 contains four independent gates each of which perform the logic NOR function. Ordering Code: Order Number DM74LS28M Package Number M14A Package Description 14-Lead Small Outline Integrated Circuit SOIC , JEDEC MS-012, 0.150 Narrow

MPR 55 F resistor ceramic

Abstract: dsp radiation tolerance
Contextual Info: LM4050QML Precision Micropower Shunt Voltage Reference General Description Key Specifications The LM4050QML precision voltage reference is available in a 10 Lead Ceramic SOIC package. The LM4050QML's design eliminates the need for an external stabilizing capacitor

PIC12C5XX

Abstract: EE20 PIC12C508 PIC12C508A PIC12C509 PIC12C509A PIC12CE518 PIC12CE519
Contextual Info: PIC12C5XX In-Circuit Serial Programming for PIC12C5XX OTP MCUs This document includes the programming specifications for the following devices: 1.0 • PIC12C508A • PIC12C509A • PIC12CE518 • PIC12CE519 PROGRAMMING THE PIC12C5XX PDIP, SOIC, JW VDD

WiMAX transceivers

Abstract: ah225
Contextual Info: AH225 1W High Linearity InGaP HBT Amplifier Applications Repeaters Base Station Transceivers High Power Amplifiers Mobile Infrastructure LTE / WCDMA / CDMA / WiMAX SOIC-8 Package Product Features Functional Block Diagram 400-2700 MHz 15.5 dB Gain @ 2140 MHz

one time programmable ENCODER REMOTE

Abstract: 200B HCS200 HCS300 HCS200 transmitter circuit diagram of Garage Door Openers Simple Code Hopping Decode
Contextual Info: HCS200 KEELOQ Code Hopping Encoder Product Brief* FEATURES PACKAGE TYPES Security • • • • • • • • PDIP, SOIC Programmable 28-bit serial number Programmable 64-bit encryption key Each transmission is unique 66-bit transmission code length

TBD1206

Abstract: ADuM6000 TSW-104-08-T-D TBD0805 fci terminal block connectors 22UF 68UF AN-0971 QSOP16 ADUM5000
Contextual Info: Evaluation Board User Guide UG-042 One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106, U.S.A. • Tel: 781.329.4700 • Fax: 781.461.3113 • www.analog.com Evaluating 16-Lead SOIC and 16-Lead QSOP Digital Isolators FEATURES SUPPORTED iCoupler MODELS

MARCONI antennas

Abstract: marconi company 5V STANDBY grounded MARCONI antennas M198 NN12
Contextual Info: M198 CUSTOM SWITCH DRIVER FOR WIRELESS LAN AND OTHER GaAs MESFET CONTROL APPLICATIONS Features • 3 Complimentary outputs for GaAs MESFET switch control applications • Pin out compatibility with P35-4700 series wireless LAN • Narrow body SOIC 16 pin surface mount

44PIN

Abstract: AN1012 BR1225 E89556 M4T28-BR12SH M4T32-BR12SH M4TXX-BR12SH
Contextual Info: M4T28-BR12SH M4T32-BR12SH TIMEKEEPER SNAPHAT® Battery & Crystal FEATURES SUMMARY • PROVIDES BATTERY BACKUP POWER FOR NON-VOLATILE TIMEKEEPER® and SUPERVISOR DEVICES IN THE 28- OR 44PIN SNAPHAT SOIC PACKAGE ■ REMOVABLE BATTERY AVOIDS HEAT ASSOCIATED WITH SURFACE MOUNT

108B

Abstract: 2981 A2982SLWTR-T 29310P UDN2981A-T UDN2982At UDN2982A-T UDN2981 application note udn-2982a-t A2982
Contextual Info: 2981 and 2982 8-Channel Source Drivers Features and Benefits Description ▪ TTL, DTL, PMOS, or CMOS compatible inputs ▪ 500 mA output source current capability ▪ Transient-protected outputs ▪ Output breakdown voltage to 50 V ▪ DIP or SOIC packaging

infra-red burglar alarm circuit diagram

Abstract: seed key HCS360 200B HCS300 automatic door infrared BPW 40 pin connection in circuit
Contextual Info: HCS360 Code Hopping Encoder Product Brief* FEATURES PACKAGE TYPES PDIP, SOIC • • • • • • • • Programmable 28/32-bit serial number Programmable 64-bit encryption key Each transmission is unique 67-bit transmission code length 32-bit hopping code

Contextual Info: ACPL-M71T and ACPL-M72T High Speed, Low Power Digital Optocouplers with R2Coupler Isolation and AEC-Q100 Grade 1 Qualification Data Sheet Description Features The Avago ACPL-M71T and ACPL-M72T are high temperature, digital CMOS optocouplers in SOIC-5 packages.

1N914

Abstract: SLMA002 TDA1517P TPA1517 TPA1517DWP TPA1517DWPG4 TPA1517DWPR TPA1517NE TPA1517NE equivalent
Contextual Info: TPA1517 www.ti.com SLOS162D – MARCH 1997 – REVISED FEBRUARY 2007 6-W STEREO AUDIO POWER AMPLIFIER • • • • FEATURES • • • TDA1517P Compatible High Power Outputs 6 W/Channel Surface Mount Availability 20-Pin Thermal SOIC PowerPAD Thermal Protection

ICC11

Abstract: X40626 MARK 14L
Contextual Info: X40626 64K, 8K x 8 Bit Data Sheet PRELIMINARY March 28, 2005 Dual Voltage CPU Supervisor with 64K Serial EEPROM FN8119.0 • 2.7V to 5.5V power supply operation • Available Packages —14-lead SOIC —14-lead TSSOP FEATURES • Dual voltage monitoring

RF3807

Abstract: RF3807TR13 DCS1800 GSM900 PCS1900 RF3807PCK-410 RF3807PCK-411 RF3807PCK-412 UMTS2100
Contextual Info: RF3807 RF3807GaAs HBT Pre-Driver Amplifier GaAs HBT PRE-DRIVER AMPLIFIER Package Style: SOIC-8 Features „ Output Power > 0.5 W P1dB „ High Linearity „ High Power-Added Efficiency „ Thermally-Enhanced Packaging „ Broadband Platform Design Approach, 450 MHz to 2700 MHz