SOIC 8 FOOTPRINT Search Results

18013

Contextual Info: SOIC-to-JEDEC TO Adapter FEATURES • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. IC now available only in 8-position SOIC packages, can be readily mounted on boards having JEDEC TO thru-hole footprints without having to

1109814

Contextual Info: SOIC-to-JEDEC TO Adapter FEATURES • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO male pin footprint on the bottom. IC now available only in 8-position SOIC packages, can be readily mounted on boards having JEDEC TO thru-hole footprints without having to

Contextual Info: SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.

18012

Contextual Info: SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.

Contextual Info: SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.

1109814

Contextual Info: SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.

Contextual Info: NTMS3P03R2 Power MOSFET -3.05 Amps, -30 Volts P-Channel SOIC-8 http://onsemi.com Features •ăHigh Efficiency Components in a Single SOIC-8 Package •ăHigh Density Power MOSFET with Low RDS on •ăMiniature SOIC-8 Surface Mount Package - Saves Board Space

E3P03

Abstract: NTMS3P03R2 NTMS3P03R2G
Contextual Info: NTMS3P03R2 Power MOSFET -3.05 Amps, -30 Volts P-Channel SOIC-8 http://onsemi.com Features •ăHigh Efficiency Components in a Single SOIC-8 Package •ăHigh Density Power MOSFET with Low RDS on •ăMiniature SOIC-8 Surface Mount Package - Saves Board Space

1109814

Abstract: 8 soic pcb footprint 18012 ASTM-B16-85
Contextual Info: Part No. 1109814/4102-113-18 SOIC to TO Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.

Contextual Info: Part No. 1109814/1109902 SOIC TO to Adapter FEATURES: • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.

8 soic pcb footprint

Abstract: IPC4101A 1109814
Contextual Info: SOIC to TO Adapter RoHs Compliant FEATURES: • Lead Free RoHs/WEEE Compliant • 8-position SOIC footprint on the top and a circular, 8-pin TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.

Contextual Info: RoHs/WEEE-Compliant SOIC-to-JEDEC TO Adapter FEATURES • Pb-Free RoHs/WEEE-compliant • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having JEDEC TO thru-hole footprints without having to

IPC 4101A

Abstract: IS410 4101A
Contextual Info: RoHs/WEEE-Compliant SOIC-to-JEDEC TO Adapter FEATURES • Pb-Free RoHs/WEEE-compliant • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having JEDEC TO thru-hole footprints without having to

Contextual Info: Surface Mount SOIC Resistor Networks Surface Mount SOIC Resistor • Tested for COTSNetworks applications SOIC Series · Both narrow and wide body versions available · Standard SOIC Series JEDEC 8, 14, 16, and 20 pin packages Ultra-stable TaNSil resistors on silicon substrates

HP 2630 optocoupler

Abstract: hp 2631 OPTOCOUPLER hp 2631 HP 2630 a 2630 pin diagram optocoupler hp 2630 datasheet HP 2631 optocoupler LED 5630 2631 optocoupler a 2631 optocoupler
Contextual Info: H Dual Channel, High CMR, High Speed, TTL Compatible Optocouplers 8 Pin DIP and SOIC-8 HCPL-2630 HCPL-0630 HCPL-2631 HCPL-0631 HCPL-4661 HCPL-0661 Technical Data Features • Available in 8 Pin DIP and SOIC-8 • Internal Shield for High Common Mode Rejection

OZ 9966

Abstract: ci573 C4493 c5588 JS-05(N)K 16 soic pcb footprint MIL-T-10727 soic footprint 8 soic pcb footprint IT43
Contextual Info: 300 RRIES Electronics Europe Tel: + 4 4 1 9 0 8 2 6 0 0 0 7 Unit 3, Furtho Court Towcesler Road, Old Stratford Milton Keynes MK19 6AQ F a x : + 441908 2 6 0 0 0 8 SOIC to DIP Adapters Converts SOIC footprint to DIL footprint ^ 8 to 28 pins 'S 8 to 24 pin version is Universal,

4701N

Abstract: NTMFS4701N NTMFS4701NT1G NTMFS4701NT3G
Contextual Info: NTMFS4701N Power MOSFET 30 V, 20 A, Single N-Channel, SOIC-8 Flat Lead Package Features •ăThermally and Electrically Enhanced Packaging Compatible with Standard SOIC-8 http://onsemi.com •ăNew Package Provides Capability of Inspection and Probe After

Contextual Info: NTMD4820N Power MOSFET 30 V, 8 A, Dual N-Channel, SOIC-8 Features •ăLow RDS on to Minimize Conduction Losses •ăLow Capacitance to Minimize Driver Losses •ăOptimized Gate Charge to Minimize Switching Losses •ăDual SOIC-8 Surface Mount Package Saves Board Space

HP 2531 optocoupler

Abstract: l 0534 HCPL 443
Contextual Info: Whpl HEW LETT 1 "HM PACKARD Dual Channel, High Speed Optocouplers 8 Pin DIP and SOIC-8 Technical Data Features • Available in 8 Pin DIP and SOIC-8 packages • High Speed: 1 Mb/s • TTL Compatible • Very High Common Mode Transient Immunity: 15000 V/jis @VCM= 1500 V

32K243-40M

Abstract: MC100EL23D MC10EL3 MC10EL32 nb6l11d MC10EP08D MC100EL23 32K2 MC100EP89
Contextual Info: ECLSOIC8EVB Evaluation Board User's Manual for High Frequency SOIC 8 http://onsemi.com EVAL BOARD USER’S MANUAL INTRODUCTION ON Semiconductor has developed an evaluation board for the devices in 8−lead SOIC package. These evaluation boards are offered as a convenience for the customers

32K243-40M

Abstract: ROSENBERGER 32K243 ROSENBERGER 32K243 32K243-40ME3 FOOTPRINTS CONNECTOR 2 PIN sma connector footprint r6j7 MC10EL58D MC10EL33D
Contextual Info: ECLSOIC8EVB Evaluation Board Manual for High Frequency SOIC 8 http://onsemi.com EVALUATION BOARD MANUAL Board Lay−Up INTRODUCTION ON Semiconductor has developed an evaluation board for the devices in 8−lead SOIC package. These evaluation boards are offered as a convenience for the customers

4840N

Abstract: NTMD4840NR2G NTMD4840 NTMD4840N
Contextual Info: NTMD4840N Power MOSFET 30 V, 7.5 A, Dual N-Channel, SOIC-8 Features •ăLow RDS on to Minimize Conduction Losses •ăLow Capacitance to Minimize Driver Losses •ăOptimized Gate Charge to Minimize Switching Losses •ăDual SOIC-8 Surface Mount Package Saves Board Space

4707n

Abstract: 4707n mosfet NTMFS4707NT3G NTMFS4707N NTMFS4707NT1G
Contextual Info: NTMFS4707N Power MOSFET 30 V, 17 A, Single N-Channel, SOIC-8 Flat Lead Features •ăFast Switching Times •ăLow Gate Charge •ăLow RDS on •ăLow Inductance SOIC-8 Package •ăThese are Pb-Free Devices http://onsemi.com V(BR)DSS RDS(on) Typ 10 mW @ 10 V

Contextual Info: Transient Voltage Suppressors for ESD Protection SLVU2.8-4 Series > SOIC-8 RoHS Low Capacitance SLVU2.8-4 Series Description The SLVU2.8-4 is in an SOIC-8 package and may be used to protect two high-speed line pairs. The " flow-thru” design minimizes trace inductance and reduces voltage overshoot