SOLDER JOINT Search Results

Contextual Info: HIGH DENSITY PGA Sockets with Solder Preforms PGA Series * Provides an excellent cost effective method for applying solder to inaccessible joints * Insures a reliable solder joint by prc ing an exact amount of solder 9 Eliminates the need for solder paste

Robinson Nugent

Abstract: Robinson Nugent pga 18x18 Nugent
Contextual Info: HIGH DENSITY_ PGA Sockets with Solder Preforms PGA Series * Provides an excellent cost effective method for applying solder to inaccessible joints 9 Insures a reliable solder joint by provid­ ing an exact amount of solder * Eliminates the need for solder paste and

all ic data

Abstract: EIAJ SO 8 solder heating profile intel 80486 DX4 INTEL DX4 paste profile SMT Process dx4 208 SQFP 80c196kb 1988 diode databook intel 80486
Contextual Info: Board Solder Reflow Process Recommendations - Leaded SMT 9.1 9 Introduction In reflowed board assemblies, the solder joint quality is affected by several variables including the component, SMT Surface Mount Technology assembly conditions, solder paste, reflow profile

Contextual Info: PC Card and CompactFlash Connectors with Solder-Flux Bearing Leads Innovative, award winning technology. Interconnection Systems ▲ A precise amount of flux-core solder ▲ Proven, consistent solder-joint reliability attached to each lead allows automated soldering

all ic data

Abstract: land pattern for TSOP 2 pace craft 100 82425EX intel 80486 80486 DX4 80c196kb 1988 QFP PACKAGE thermal resistance 55A5 TSOP infrared
Contextual Info: CHAPTER 9 BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS INTRODUCTION In reflowed board assemblies the solder joint quality is affected by several variables such as board design SMT Surface Mount Technology assembly equipment solder paste component and reflow profile

ad-1565

Abstract: D-602-0141 ES-61199 D-602-0122 D-602-0150 D-602-0151 raychem ad-1494 D-602-0140 AT-1319-78 Raychem D 602 0278
Contextual Info: Shielded Contacts SolderTacts Shielded One-Piece Solder Contacts Product Facts • ■ ■ ■ ■ Reliable one-piece solder contacts: through-connector shielding reduces crosstalk, and improves signal transmission One-step installation Solder joints are strong and

Contextual Info: S O L D E R IN G A N D C L E A N IN G PROCESSES 1 — Solder Paste Printing Roflow GENERAL Use the optimum solder paste for the pattern, printing pi-ocess, solderpaste density and solder joint quality. RECOMMENDED Use Sn 63% Pb 37% solder paste. Use 8 to 10 mil thickness for

TEKAS00056

Contextual Info: PC Card and CompactFlash Connectors with Solder-Flux Bearing Leads Innovative, award winning technology. Interconnection Systems ▲ A precise amount of flux-core solder ▲ Proven, consistent solder-joint reliability attached to each lead allows automated soldering

Intel reflow soldering profile BGA

Abstract: all ic data infrared heating gun 82425EX 80c196kb 1988 28F010 80C196KB pcb warpage after reflow Intel reflow soldering profile BGA intel conveyor belt alignment
Contextual Info: Board Solder Reflow Process Recommendations 9.1 9 Introduction In reflowed board assemblies, the solder joint quality is affected by several variables such as the component, SMT Surface Mount Technology assembly conditions, solder paste, reflow profile and board design.

Contextual Info: MAXIMUM solutions Mill-Max Solder Pre-forms Mill-Max now offers solder pre-forms. Solder pre-forms enhance the assembly of large pin grid array PGA sockets. The main benefit of solder pre-forms is the placement of solder directly between the lead and the hole. This ensures a

mutoh ip-220

Contextual Info: Database for Properties of Lead-Free Solder Alloys DATABASE FOR PROPERTIES OF LEAD-FREE SOLDER ALLOYS Version 1.0 This database is a joint project of ELFNET and COST 531 Action. COST 531 ACTION ON LEAD-FREE SOLDER ALLOYS EURPEAN LEAD-FREE SOLDERING NETWORK

Contextual Info: MAXIMUM solutions Mill-Max Solder Pre-forms Mill-Max now offers solder pre-forms. Solder pre-forms enhance the assembly of large pin grid array PGA sockets. The main benefit of solder pre-forms is the placement of solder directly between the lead and the hole. This ensures a

heraeus pd944

Abstract: heraeus pd945 Amicon d125f D125F3 PD945 PD944 AMICON D125F AmiconD125F TSSOP footprint
Contextual Info: CHAPTER 4 THROUGH-HOLE MOUNTING METHODS page Soldering by dipping or solder wave 4-2 Repairing soldered joints 4-2 Philips Semiconductors IC Packages Through-hole mounting methods Chapter 4 SOLDERING BY DIPPING OR SOLDER WAVE The maximum temperature of the solder must not exceed

all ic data

Abstract: Intel reflow soldering profile BGA infrared heating gun 82425EX intel 80486 DX4 hot air bga land pattern for TSOP TSOP infrared 80c196kb 1988 land pattern QFP 208
Contextual Info: 2 9 Board Solder Reflow Process Recommendations 1/16/97 5:29 PM CH09WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 9 BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS 9.1. INTRODUCTION In reflowed board assemblies, the solder joint quality is affected by several variables such as

Solder paste volume

Contextual Info: HSDL-2XXX Surface Mount Technology Assembly Application Note 1138 Solder Pad, Mask and Metal Solder Stencil Aperture METAL STENCIL FOR SOLDER PASTE PRINTING STENCIL APERTURE LAND PATTERN SOLDER MASK PCBA Figure 1. Stencil and PCBA Recommended Land Pattern for HSDL-2XXX

3.5mm Stereo Chassis Socket

Abstract: FDZ BT PCB Mounted 6.5mm Stereo Socket trs stereo jack female jack 3.5mm Stereo plug FEMALE PCB MOUNT 6.35mm audio black Socket 5 pin PCB Mounted 3.5mm Stereo jack TRS jack CONNECTOR Stereo phone plug solder 3.5MM PCB Mounted 3.5mm Stereo plug 4 pole switch
Contextual Info: CONTENTS CONTENTS CATEGORY SUB CATEGORY AX SERIES XLR CABLE CONNECTORS PAGE 3 METAL SHELL TYPE - SOLDER AC SERIES XLR CABLE CONNECTORS PAGE 9 METAL SHELL TYPE - SOLDER THERMOPLASTIC SHELL TYPE - SOLDER METAL SHELL TYPE RIGHT ANGLE - SOLDER METAL SHELL TYPE - IDC SOLDERLESS

PCB Mounted 6.5mm Stereo Socket

Abstract: 3.5mm Stereo plug FEMALE PCB MOUNT 3.5mm Stereo Chassis Socket trs stereo jack female jack layout pcb stk 070 PCB Mounted 3.5mm Stereo Socket chassis STEREO FEMALE CONNECTOR 3.5MM PCB MOUNT 6.35mm audio black Socket XLR-5 connector amphenol CHASSIS MOUNT d sub CONNECTORS
Contextual Info: CONTENTS CONTENTS CATEGORY SUB CATEGORY AX SERIES XLR CABLE CONNECTORS PAGE 3 METAL SHELL TYPE - SOLDER AC SERIES XLR CABLE CONNECTORS PAGE 9 METAL SHELL TYPE - SOLDER THERMOPLASTIC SHELL TYPE - SOLDER METAL SHELL TYPE RIGHT ANGLE - SOLDER METAL SHELL TYPE - IDC SOLDERLESS

Contextual Info: Solder reflow recommendations Solder reflow profiles consist of four stages. They are: • Preheat • Pre-flow • Reflow • Cool down It is critical to have the rate of temperature change, maximum temperature, and time duration within each stage controlled to create solder joints that have flowed properly. An example of a

GR-78-CORE

Abstract: J-STD-005 multicore solder paste GR78-CORE GR-78-CORE PCB solder powder J-STD-004 paste J-STD-004 MSDS bellcore GR-78 MCF800
Contextual Info: Technical Data Sheet MP200 Solder Paste February 2005 HIGH-SPEED PRINTING, NO-CLEAN SOLDER PASTE PRODUCT DESCRIPTION Multicore MP200 solder pastes have been formulated as no-clean solder pastes for high speed printing and reflow in both air and nitrogen. The products were specifically formulated to have increased

Contextual Info: Lead Free Solder Page 1 of 2 Lead Free Solder Sn99 4901 99.3% tin and 0.7% copper M.G. Chemicals no clean Lead-Free Solder was designed with Sn/Cu Tin/Copper alloys as a lead-free alternative for the standard Tin and Lead solder. These alloys conform to

sn63pb37 solder wire

Abstract: SN63PB37 ROSIN FLUX TYPE ROL0 kester Sn63pB37 sn63pb37 solder wire flux 232
Contextual Info: 2011RECOMMENDED RECOMMENDED 2012 ElectronicsAssembly Assembly Materials Materials Electronics Table of Contents Table of Contents 2 Products Pages Solder Paste Fluxes Solder Wire Bar Solder Additional Flux Materials TSF Products Other products Helpful Information

bellcore GR-78

Abstract: J-STD-006 SAC305
Contextual Info: Lead Free Solder SAC305 Page 1 of 2 Lead Free Solder Sn96 SAC 305 4900 96.3% tin, 0.7% copper and 3% silver M.G. Chemicals no clean Lead-Free Solder was designed with Sn/Ag/Cu (Tin/Silver/Copper) alloys as a lead-free alternative for the standard Tin and Lead solder.

BKC Semiconductors

Contextual Info: Summer 1999 Application Notes Plated and Solder Dipped Finishes for Semiconductor Components Plated or hot-solder-dipped coatings have been used for semiconductor component external solder terminations for many years in both commercial and military applications.

CU-106A

Abstract: entek plus cu 106a anova general cross references TI Cross Reference Search HC373 Au Sn eutectic gold embrittlement
Contextual Info: Pb-Free Solder Joint Evaluation Contact Us Buy About TI TI Worldwide my.TI Advanced Search Keyword Part Number >> Semiconductor Home > Products > Digital Logic > Digital Logic Overview > Texas Instruments Palladium Lead Finish Pb-Free Solder Joint Evaluation