SOLDER REFLOW POWER RF Search Results

AN1907

Abstract: MRF9045NR1 RF Power Devices
Contextual Info: Freescale Semiconductor Application Note AN1907 Rev. 1, 6/2006 Solder Reflow Attach Method for High Power RF Devices in Plastic Packages By: Wendi Stemmons, Jerry Mason, Rich Wetz, Tom Woods, Mahesh Shah and David Runton INTRODUCTION This application note describes a process to solder attach

VIMOS RF Power Transistor Mounting

Contextual Info: RF Power Transistor Mounting VIMOS Product Portfolio I. SM200 Package Surface Mount Substrate ASI Semiconductor recommends using the solder reflow criteria as specified in JEDEC Standard J-STD-020D.1 shown below. VIMOS RF Power Transistor Mounting Profile

Contextual Info: Surface Mount High Dynamic Range Mixer 1830 - 2030 MHz, Up Converter Package Style 20 XMFG8-20D3 Key Features • • • IP3 +38 dBm LO Power + 22 dBm Solder Reflow to 240°C Guaranteed Specifications Frequency Range RF OUTPUT 1830-2030 LO INPUT 1710-1777

Contextual Info: Surface Mount High Dynamic Range Mixer 1930-1990 MHz, Upconverter, High IP3 Package Style 20 XMFF6-20G7 Key Features • • • IP3 +33 dBm LO Power +17dBm Solder Reflow to +240°C Guaranteed Specifications Frequency Range RF output LO input IF input 1930-1990

Contextual Info: Surface Mount High Dynamic Range Mixer 1830 - 2030 MHz, Down Converter Package Style 20 XMFG8-20D2 Key Features • • • IP3 +38 dBm LO Power + 25 dBm Solder Reflow to 240°C Guaranteed Specifications Frequency Range RF INPUT 1830-2030 LO INPUT 1710-1770

95Sn5Sb

Abstract: HP 3478A Copper Alloy C151 bts 2140 AN1907 C101 C102 C151 SAC305 ausi die attach
Contextual Info: Freescale Semiconductor Application Note AN1907 Rev. 3, 5/2009 Solder Reflow Attach Method for High Power RF Devices in Over - Molded Plastic Packages By: Keith Nelson, Quan Li, Lu Li, and Mahesh Shah INTRODUCTION TERMINOLOGY DEFINITIONS The purpose of this application note is to provide

40R2

Contextual Info: Surface Mount Downconverting Mixer 1227 and 1575 MHz, Low Harmonics Package Style 40 XMFF6-40R2 Key Features • • • • IP3 +36 dBm LO Power +16 dBm Harmonics –65 dBc Solder Reflow to +240 C Guaranteed Specifications Frequency Range RF input LO input

20C5

Contextual Info: Surface Mount High Dynamic Range Mixer 45.75 MHz Package Style 20 XMCC6-20C5 Key Features • • • IP3 +32 dBm LO Power +17 dBm Solder Reflow to +240°C Guaranteed Specifications Frequency Range RF 45.75 MHz LO 47.54 IF 1.79 MHz MHz MHz Conversion Loss dB

20B3

Abstract: 20B3 diode XMGG7-20B3
Contextual Info: Surface Mount High Dynamic Range Mixer 3400-3600 MHz, Upconverter, High IP3 Package Style 20 XMGG7-20B3 Key Features • • • IP3 +34 dBm LO Power +21 dBm Solder Reflow to +240°C Guaranteed Specifications Frequency Range RF output LO input IF input 3400-3600

Contextual Info: Surface Mount High Dynamic Range Mixer 180 - 260 MHz, Up Converter Package Style 20 XMDD8-20D2 Key Features • • • IP3 +38 dBm LO Power + 25 dBm Solder Reflow to 240°C Guaranteed Specifications Frequency Range RF OUTPUT 180-260 LO INPUT 310 IF INPUT

Contextual Info: Surface Mount High Dynamic Range Mixer 857 MHz, Upconverter, High IP3 Package Style 20 XMEE6-20G7 Key Features • • • IP3 +33 dBm LO Power +17dBm Solder Reflow to +240°C Guaranteed Specifications Frequency Range RF output LO input IF input 857 ± 5 787

rf down converter 30 mhz

Contextual Info: Surface Mount High Dynamic Range Mixer 180 - 260 MHz, Down Converter Package Style 20 XMDD7-20D4 Key Features • • • IP3 +34 dBm LO Power + 20 dBm Solder Reflow to 240°C Guaranteed Specifications Frequency Range RF INPUT 180-260 LO INPUT 265-310 IF OUTPUT

20A8

Contextual Info: Surface Mount High Dynamic Range Mixer 2200 - 2650 MHz Package Style 20 XMGG7-20A8 Key Features • • • IP3 +32 dBm LO Power +19 dBm Solder Reflow to 240°C Guaranteed Specifications Frequency Range RF input 2200-2650 LO input 1750-2150 IF output 88-860

MIXER 210

Contextual Info: Surface Mount High Dynamic Range Mixer 210 - 230 MHz, Down Converter Package Style 20 XMDD8-20D3 Key Features • • • IP3 +38 dBm LO Power + 25 dBm Solder Reflow to 240°C Guaranteed Specifications Frequency Range RF INPUT 210-230 LO INPUT 197.5 IF OUTPUT

Contextual Info: Surface Mount High Dynamic Range Mixer 1805-1880 MHz Package Style 20 XMFF8-20N8 Key Features • • • IP3 +38 dBm LO Power +26 dBm Solder Reflow to +240°C Guaranteed Specifications Frequency Range RF output 1805-1880 LO input 1929-1969 IF input 89-124

TB370

Abstract: to252 footprint wave soldering TB334 stencil tension
Contextual Info: Guidelines for Soldering Discrete Power Surface Mount Components to PC Boards Semiconductor Technical Brief January 1999 TB370 Authors: John Coronati, Blake Gillett, Don Pavinski, Stephen Vahey Introduction Solder Plating of Surface Mount Packages Proper reflow soldering of surface mount packages to

Contextual Info: Surface Mount High Dynamic Range Mixer 925-960 MHz, Very High Isolation Package Style 84 XMEE4-84N5 Key Features • • • • SOIC-8 Package “Drop In Equivalent” LO to RF Isolation 60 dB LO Power +12 +\- 2 dBm Solder Reflow to +240 C Guaranteed Specifications

XMFF6-20H3

Contextual Info: Surface Mount High Dynamic Range Mixer 1800-1920 MHz Package Style 20 XMFF6-20H3 Key Features • • • * IP3 +32 dBm LO Power +17 dBm Solder Reflow to 240°C Guaranteed Specifications Frequency Range RF 1800-1920 LO 1530-1650 IF 270 MHz MHz MHz Conversion Loss dB

XMGG6-20H2

Contextual Info: Surface Mount High Dynamic Range Mixer 2400-2500 MHz Package Style 20 XMGG6-20H2 Key Features • • • * IP3 +34 dBm LO Power +17 dBm Solder Reflow to 240°C Guaranteed Specifications Frequency Range RF 2400-2500 LO 2190-2290 IF 210 MHz MHz MHz Conversion Loss dB

XMFF2-20T6

Contextual Info: Surface Mount High Isolation Mixer 1800-2000 MHz Package Style 20 XMFF2-20T6 Key Features • • • High LO to RF Isolation LO Power +7 dBm Solder Reflow to 240°C Guaranteed Specifications Frequency Range RF 1800-2000 LO 1800-2000 IF 10-200 MHz MHz MHz

XMGG6-20H3

Contextual Info: Surface Mount High Dynamic Range Mixer 2400-2500 MHz Package Style 20 XMGG6-20H3 Key Features • • • * IP3 +34 dBm LO Power +17 dBm Solder Reflow to 240°C Guaranteed Specifications Frequency Range RF 2400-2500 LO 2130-2230 IF 270 MHz MHz MHz Conversion Loss dB

XMFF7-20H2

Contextual Info: Surface Mount High Dynamic Range Mixer 1800-1920 MHz Package Style 20 XMFF7-20H2 Key Features • • • IP3 +38 dBm LO Power +21 dBm Solder Reflow to 240°C Guaranteed Specifications Frequency Range RF 1800-1920 LO 1590-1710 IF 210 MHz MHz MHz Conversion Loss dB

LR 3960

Abstract: XMGG4-20A9
Contextual Info: Surface Mount High Dynamic Range Mixer 3590 – 3960 MHz Package Style 20 XMGG4-20A9 Key Features • • • IP3 +24 dBm LO Power +15 to +17 dBm Solder Reflow to 240°C Guaranteed Specifications Frequency Range RF LO IF 3590-3960 3100 499-860 MHz MHz MHz

Contextual Info: Surface Mount Broadband Mixer 50-4000 MHz Package Style 30 XMAG7-30LK Key Features • • • IP3 +32 dBm LO Power +23 dBm Solder Reflow to 240°C Guaranteed Specifications Frequency Range RF LO IF 50-4000 50-4000 50-3000 MHz MHz MHz Conversion Loss dB