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    SOLDERING GUIDELINES Search Results

    SOLDERING GUIDELINES Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CN-AC3MMDZBAU Amphenol Cables on Demand 3-Pin XLR Male Panel Mount Connector - Amphenol AC3MMDZB-AU - Solder Type (Black + Gold Contacts) Datasheet
    CN-DSUB50PIN0-000 Amphenol Cables on Demand Amphenol CN-DSUB50PIN0-000 D-Subminiature (DB50 Male D-Sub) Connector, 50-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD62PN-000 Amphenol Cables on Demand Amphenol CN-DSUBHD62PN-000 High-Density D-Subminiature (HD62 Male D-Sub) Connector, 62-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUB25SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB25SKT0-000 D-Subminiature (DB25 Female D-Sub) Connector, 25-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD26SK-000 Amphenol Cables on Demand Amphenol CN-DSUBHD26SK-000 High-Density D-Subminiature (HD26 Female D-Sub) Connector, 26-Position Socket Contacts, Solder-Cup Terminals Datasheet

    SOLDERING GUIDELINES Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: SOLDERING INSTRUCTIONS FOR THROUGH HOLE LEDs DIP AND WAVE SOLDERING Temperature Maximum of the Soldering Soldering Bath Time IRON SOLDERING with 1.5mm IRON TIP Distance from Solder Joint to Case Temperature of the Soldering Iron Maximum Soldering Time Distance From


    Original     		PDF 260oC 880nm 940nm

    "Solid State Relay"

    Abstract: No abstract text available
    Text: • Solid State Relay : Lead-free part soldering conditions DIP6pin SMD / DIP8pin(SMD) ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time.


    Original     		PDF

    phototriac

    Abstract: No abstract text available
    Text: • Phototriaccoupler : Lead-free part soldering conditions SOP4pin ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice.


    Original     		PDF

    SOP4

    Abstract: No abstract text available
    Text: • Photocoupler : Lead-free part soldering conditions DIP4pin SMD / DIP6pin(SMD) / DIP8pin(SMD) / DIP16pin(SMD) ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time.


    Original     		PDF DIP16pin SOP4

    JEDEC J-STD-020d.1

    Abstract: paste profile J-STD-020d.1 JEDEC SMT reflow profile Altera ROHS AN81 J-STD-020D J-STD-033
    Text: Reflow Soldering Guidelines for Lead-Free and RoHS-Compliant Packages AN-353-3.0 Application Note This application note describes the differences between conventional soldering and lead-free soldering and provides guidelines and recommendations for reflow


    Original     		PDF AN-353-3 JEDEC J-STD-020d.1 paste profile J-STD-020d.1 JEDEC SMT reflow profile Altera ROHS AN81 J-STD-020D J-STD-033

    Untitled

    Abstract: No abstract text available
    Text: TAP Technical Summary and Application Guidelines SECTION 4: APPLICATION GUIDELINES FOR TANTALUM CAPACITORS 4.1 SOLDERING CONDITIONS AND BOARD ATTACHMENT 4.2 RECOMMENDED SOLDERING PROFILES The soldering temperature and time should be the minimum for a good connection.


    Original     		PDF

    ssop24 footprint

    Abstract: PowerMos transistors TO220 package SSOP16 SSOP24 SSOP24 300 1 footprint sot89 stencil
    Text: DISCRETE SEMICONDUCTORS Mounting and soldering PowerMOS transistors 1998 Dec 02 Philips Semiconductors PowerMOS transistors Mounting and soldering MOUNTING AND SOLDERING Page INTRODUCTION LEADED DEVICES Handling Soldering GENERAL DATA AND INSTRUCTIONS FOR THE


    Original     		PDF OT186A; OT263; 220AB MLC747 SSOP16 OT338-1) SSOP24 OT340-1) OT338-1 ssop24 footprint PowerMos transistors TO220 package SSOP16 SSOP24 SSOP24 300 1 footprint sot89 stencil

    JEDEC J-STD-020d.1

    Abstract: GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE pcb warpage in ipc standard Soldering guidelines J-STD-020D pcb warpage* in smt reflow Lead Free reflow soldering profile BGA
    Text: AN 353: Reflow Soldering Guidelines for Lead-Free Packages February 2009 AN-353-2.0 Introduction This application note describes the differences between conventional soldering and lead-free soldering and provides guidelines and recommendations for reflow


    Original     		PDF AN-353-2 JEDEC J-STD-020d.1 GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE pcb warpage in ipc standard Soldering guidelines J-STD-020D pcb warpage* in smt reflow Lead Free reflow soldering profile BGA

    SOD80 footprint

    Abstract: SOD87 footprint land pattern sot346 SOD110 footprint SOD106 land pattern sod110 land do-41 footprint MSA435 DO-35 land pattern how epoxy can contribute to meniscus
    Text: SECTION 17 MOUNTING AND SOLDERING contents page INTRODUCTION 17 - 2 AXIAL AND RADIAL LEADED DEVICES 17 - 2 Handling 17 - 2 Soldering 17 - 2 Mounting 17 - 3 SURFACE-MOUNT DEVICES 17 - 3 Reflow soldering process 17 - 3 Double-wave soldering process 17 - 7 Hand soldering of microminiature components


    Original     		PDF MSB461 OT163-1) MLC745 SOD80 footprint SOD87 footprint land pattern sot346 SOD110 footprint SOD106 land pattern sod110 land do-41 footprint MSA435 DO-35 land pattern how epoxy can contribute to meniscus

    Untitled

    Abstract: No abstract text available
    Text: Recommended soldering condition OS-CON Line-up Guidelines and precautions Selection guide Recommended reflow soldering temperature profile Temperature on the surface of capacitor The cycles of reflow soldering: Twice max Peak temperature 5s max 240℃


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Recommended soldering condition OS-CON Line-up Guidelines and precautions Selection guide Recommended reflow soldering temperature profile Temperature on the surface of capacitor The cycles of reflow soldering: Twice max Peak temperature 5s max 240℃


    Original     		PDF

    AN10896

    Abstract: No abstract text available
    Text: AN10896 Mounting and Soldering of RF transistors Rev. 2 — 13 Nov 2012 Application note Document information Info Content Keywords Surface mount, reflow soldering, bolt down Abstract This application note provides bolt down and soldering guidelines for NXP’s RF transistor packages


    Original     		PDF AN10896 AN10896

    AN10896

    Abstract: finger print sensor pcb with circuit Mounting and Soldering of RF transistors heller 1700 ipc 610D JEDEC J-STD-020d Moisture/Reflow sensitivity HVQFN48 J-STD-020D bga rework graphite thermal spreader
    Text: AN10896 Mounting and Soldering of RF transistors Rev. 01 — 17 May 2010 Application note Document information Info Content Keywords Surface mount, reflow soldering, bolt down Abstract This application note provides bolt down and soldering guidelines for NXP’s RF transistor packages


    Original     		PDF AN10896 AN10896 finger print sensor pcb with circuit Mounting and Soldering of RF transistors heller 1700 ipc 610D JEDEC J-STD-020d Moisture/Reflow sensitivity HVQFN48 J-STD-020D bga rework graphite thermal spreader

    MARKING 217

    Abstract: of capacitor soldering reflow
    Text: Recommended soldering condition Recommended reflow soldering temperature profile The cycles of reflow soldering: Twice max 5s max 240℃ 200℃ 40s max 150℃ 120s max 30s max Time(sec.) Peak temperature 250℃ lead free reflow soldering profile The cycles of reflow soldering: Twice (max)


    Original     		PDF

    STR3234

    Abstract: D1268 NL-5700 M130 D-12681 K1306 k1306 datasheet V23814-U1306-M130 V23815-K1306-M230 V23815-N1306-M130
    Text: Hot-Bar Soldering and Hot-Air Soldering for PAROLI =Modules Appnote 76 by Arun Agarwal, updated by Elmar Dröge DESCRIPTION OVERVIEW OF SURFACE MOUNT SOLDERING METHODS This technical note provides information on the two soldering methods recommended for Infineon PAROLI Parallel Optical


    Original     		PDF D-13623, STR3234 D1268 NL-5700 M130 D-12681 K1306 k1306 datasheet V23814-U1306-M130 V23815-K1306-M230 V23815-N1306-M130

    qfp 32 land pattern

    Abstract: SSOP16 SSOP24
    Text: Philips Semiconductors PowerMOS transistors Mounting and soldering MOUNTING AND SOLDERING Page INTRODUCTION LEADED DEVICES Handling Soldering GENERAL DATA AND INSTRUCTIONS FOR THE SOT186A; SOT263; TO 220AB General rules Mounting methods Heatsink requirements


    Original     		PDF OT186A; OT263; 220AB components24 MLC747 SSOP16 OT338-1) SSOP24 OT340-1) qfp 32 land pattern SSOP16 SSOP24

    SOD80 footprint

    Abstract: SOD87 footprint Soldering guidelines and SMD footprint design SMD footprint design SOD106 land pattern land pattern sot346 SOD110 footprint SOD87 footprint pcb MLC745 smd footprint
    Text: DISCRETE SEMICONDUCTORS DATA SHEET Chapter 4 Soldering guidelines and SMD footprint design Discrete Semiconductor Packages File under Discrete Semiconductors, SC18 July 1997 Philips Semiconductors Discrete Semiconductor Packages Soldering guidelines and SMD


    Original     		PDF MGK391 MSC422 OT457 SC-74) MSC423 SOD80 footprint SOD87 footprint Soldering guidelines and SMD footprint design SMD footprint design SOD106 land pattern land pattern sot346 SOD110 footprint SOD87 footprint pcb MLC745 smd footprint

    MICRON 63

    Abstract: SOLDERING REFLOW smt
    Text: TN-00-15: Recommended Soldering Parameters Introduction Technical Note Recommended Soldering Parameters Introduction This technical note defines the recommended soldering techniques and parameters for Micron Technology, Inc., products. Using these techniques and parameters will prevent


    Original     		PDF TN-00-15: 09005aef809140c7/Source: 09005aef80914088 MICRON 63 SOLDERING REFLOW smt

    Reflow Soldering Guide

    Abstract: berex
    Text: BeRex Reflow Soldering Guide Application Note RF MMIC Innovator www.berex.com Classification: Reflow Soldering Document Number: Reflow61110 Revision code: 0.1 Reflow Soldering Guide for Surface Mount Devices Name Writer Date Signature BY KIM JH Bae OK Dr. Yoo


    Original     		PDF Reflow61110 B61110 Reflow Soldering Guide berex

    ipc 610 Class 3 pin protrusion

    Abstract: flux ef 2202 ipc 610D ipc 610 Class 3 IPC-A-610D ipc 610 non-wetting IPCA610D ipc 610 IPC-A-610-D IPC-A610D
    Text: Application Note AN:017 RoHS-Compliant Through-Hole V•I Chip Soldering Recommendations By Ankur Patel, Associate Product Line Engineer Introduction Contents Page Introduction 1 Wave Soldering 1 Hand Soldering 3 Pin/Lead Protrusion 4 Board Cleaning 4 Solder Joint Inspection


    Original     		PDF IPC-A-610 ipc 610 Class 3 pin protrusion flux ef 2202 ipc 610D ipc 610 Class 3 IPC-A-610D ipc 610 non-wetting IPCA610D ipc 610 IPC-A-610-D IPC-A610D

    flux ef 2202

    Abstract: ipc 610D ipc 610 Class 3 pin protrusion ipc 610 non-wetting IPC-A610D ipc 610 Class 3 IPC-A-610D ipc 610 AN017 IPC-A-610-D
    Text: Application Note AN:017 RoHS-Compliant Through-Hole V•I Chip Soldering Recommendations By Ankur Patel, Associate Product Line Engineer Introduction Contents Page Introduction 1 Wave Soldering 1 Hand Soldering 3 Pin/Lead Protrusion 4 Board Cleaning 4 Solder Joint Inspection


    Original     		PDF IPC-A-610 flux ef 2202 ipc 610D ipc 610 Class 3 pin protrusion ipc 610 non-wetting IPC-A610D ipc 610 Class 3 IPC-A-610D ipc 610 AN017 IPC-A-610-D

    Cu3Sn

    Abstract: Solder Paste, Indium, Type 3 SSOP20 LAND PATTERN Solder Paste Indium reflow process control Solder Paste, Indium 5.1, Type 3 HVQFN48 SSOP20 philips pb-free products SOT266-1 LAND PATTERN
    Text: AN10365 Surface mount reflow soldering description Rev. 02 — 26 July 2006 Application note Document information Info Content Keywords surface mount reflow soldering Abstract This application note provides guidelines for the board mounting of IC packages.


    Original     		PDF AN10365 AN10365 Cu3Sn Solder Paste, Indium, Type 3 SSOP20 LAND PATTERN Solder Paste Indium reflow process control Solder Paste, Indium 5.1, Type 3 HVQFN48 SSOP20 philips pb-free products SOT266-1 LAND PATTERN

    sot89 stencil

    Abstract: No abstract text available
    Text: Philips Semiconductors PowerMOS transistors Mounting and soldering MOUNTING AND SOLDERING Page INTRODUCTION 1898 LEADED DEVICES Handling Soldering 1898 GENERAL DATA AND INSTRUCTIONS FOR THE SOT186A; SOT263; TO 220AB General rules Mounting methods Heatsink requirements


    OCR Scan     		PDF OT186A; OT263; 220AB T0220 SSOP16 SSOP24 OT338-1 OT34Q-1 sot89 stencil

    MFK Series

    Abstract: No abstract text available
    Text: Soldering Surface Mount Reflow Surface Mount Capacitors. Recommended Reflow Soldering Conditions The following conditions are recommended for reflow soldering of surface mount capacitors onto a glass epoxy circuit board of 90 x 50 x 0.8 mm with resist by cream solder (eutectic solder).


    OCR Scan     		PDF