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    SOP14 PACKAGE Search Results

    SOP14 PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TC74HC14AF
    		Toshiba Electronic Devices & Storage Corporation CMOS Logic IC, Inverter, SOP14 Visit Toshiba Electronic Devices & Storage Corporation
    TPH9R00CQH
    		Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH9R00CQ5
    		Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 150 V, 64 A, 0.009 Ω@10 V, High-speed diode, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH1R306PL
    		Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 100 A, 0.00134 Ω@10 V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPHR8504PL
    		Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 40 V, 150 A, 0.00085 Ω@10 V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    SOP14 PACKAGE Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF PDF Size Page count
    SOP14 Package
    		ROHM Lsi Assembly Original PDF 33.26KB 2

    SOP14 PACKAGE Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    Contextual Info: Reliability Tests Report Product Name: TC74VHC10F Package Name: SOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		TC74VHC10F PDF

    Contextual Info: Reliability Tests Report Product Name: TC74HC03AF Package Name: SOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		TC74HC03AF PDF

    Contextual Info: Reliability Tests Report Product Name: TC74HC393AF Package Name: SOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		TC74HC393AF PDF

    Contextual Info: Reliability Tests Report Product Name: TC74HCT02AF Package Name: SOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		TC74HCT02AF PDF

    Contextual Info: Reliability Tests Report Product Name: TC74VHC393F Package Name: SOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		TC74VHC393F PDF

    Contextual Info: Reliability Tests Report Product Name: TC74LCX02F Package Name: SOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		TC74LCX02F PDF

    Contextual Info: Reliability Tests Report Product Name: TC74HC4024AF Package Name: SOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		TC74HC4024AF PDF

    Contextual Info: Reliability Tests Report Product Name: TC74VHC74F Package Name: SOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		TC74VHC74F PDF

    MA1015

    Contextual Info: BU4011B BU4011BF Quad 2-input NAND gate The BU4011B and BU4011BF consist of four NAND gates in a single structure. They are suitable for CMOS circuits. Features • available in DIP14 and SOP14 packages. • low power consumption • wide supply voltage range


    OCR Scan     		BU4011B BU4011BF BU4011BF DIP14 BU4011B DIP14) BU4011B, MA1015 PDF

    Contextual Info: Reliability Tests Report Product Name: TC74LCX00F Package Name: SOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		TC74LCX00F PDF

    Contextual Info: Reliability Tests Report Product Name: TC74HCU04AF Package Name: SOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		TC74HCU04AF PDF

    Contextual Info: Reliability Tests Report Product Name: TC74HC125AF Package Name: SOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		TC74HC125AF PDF

    Contextual Info: Reliability Tests Report Product Name: TC74VHCU04F Package Name: SOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		TC74VHCU04F PDF

    Contextual Info: Reliability Tests Report Product Name: TC74HC107AF Package Name: SOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		TC74HC107AF PDF

    Contextual Info: Reliability Tests Report Product Name: TC74HCT7007AF Package Name: SOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		TC74HCT7007AF PDF

    Contextual Info: Reliability Tests Report Product Name: TC74LCX125F Package Name: SOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		TC74LCX125F PDF

    Contextual Info: Reliability Tests Report Product Name: TC74VHCT74AF Package Name: SOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		TC74VHCT74AF PDF

    Contextual Info: Reliability Tests Report Product Name: TC74HCT08AF Package Name: SOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		TC74HCT08AF PDF

    ba10339fv

    Abstract: BA10339 BA10339F
    Contextual Info: BA10339 BA10339F BA10339FV Quad comparators The BA10339, BA10339F, and BA10339FV each consist of four comparators in a single package. The open-collector output allows a wired OR connection. Dimensions Units : mm BA10339 (DIP14) o Features available in DIP14, SOP14, and


    OCR Scan     		BA10339 BA10339F BA10339FV BA10339, BA10339F, BA10339FV DIP14, SSOP-B14 BA10339 DIP14) PDF

    4069UBF

    Abstract: 4069U 4069UB BU4069UB
    Contextual Info: BU4069UB BU4069UBF Hex inverter The BU4069UB and 4069UBF consist of 6 inverters in a single package. Dimensions Units : mm BU4069B (DIP14) They are suitable for use in CMOS circuits. 19.4± 0.3 Features • available in DIP14 and SOP14 packages • low power consumption


    OCR Scan     		BU4069UB BU4069UBF 4069UBF DIP14 BU4069B DIP14) BU4069BF BU4000B BU4069UB, 4069U 4069UB PDF

    Contextual Info: Reliability Tests Report Product Name: TC74LVX125F Package Name: SOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		TC74LVX125F PDF

    Contextual Info: Reliability Tests Report Product Name: TC74HC86AF Package Name: SOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		TC74HC86AF PDF

    Contextual Info: Reliability Tests Report Product Name: TC74VHC11F Package Name: SOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		TC74VHC11F PDF

    Contextual Info: Reliability Tests Report Product Name: TC74VHC20F Package Name: SOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


    Original     		TC74VHC20F PDF