| SOT1130A |
|
NXP Semiconductors
|
Flanged ceramic package; 2 mounting holes; 4 leads |
Original |
PDF
|
225.76KB |
1 |
| SOT1131-1 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT1131-1 |
Original |
PDF
|
317.9KB |
1 |
| SOT1133-1_515 |
|
NXP Semiconductors
|
HXQFN60(U); Reel dry pack; SMD, 7"Q1/T1 Standard product orientationOrderable part number ending ,515 or ZOrdering code (12NC) ending 515 |
Original |
PDF
|
181.35KB |
4 |
| SOT1134-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced extremely thin quad flat package; no leads; 60 terminals |
Original |
PDF
|
230.82KB |
1 |
| SOT1134-1 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT1134-1 |
Original |
PDF
|
248.46KB |
1 |
| SOT1134-1_518 |
|
NXP Semiconductors
|
Standard product orientation 12NC ending 518 |
Original |
PDF
|
118.63KB |
5 |
| SOT1134-2 |
|
NXP Semiconductors
|
Plastic compatible thermal enhanced extremely thin quad flat package; no leads |
Original |
PDF
|
363.51KB |
1 |
| SOT1134-2 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT1134-2 |
Original |
PDF
|
325.13KB |
1 |
| SOT1135A |
|
NXP Semiconductors
|
Flanged ceramic package; 2 mounting holes; 2 leads |
Original |
PDF
|
223.17KB |
1 |
| SOT1135B |
|
NXP Semiconductors
|
earless flanged ceramic package; 2 leads |
Original |
PDF
|
218.23KB |
1 |
| SOT1136-1 |
|
NXP Semiconductors
|
Plastic ball grid array package; 420 balls |
Original |
PDF
|
276.87KB |
1 |
| SOT1138 |
|
NXP Semiconductors
|
OMP 4 leads (flat) |
Original |
PDF
|
340.39KB |
1 |
| SOT1138-1 |
|
NXP Semiconductors
|
Plastic, heatsink small outline package; 4 leads(flat) |
Original |
PDF
|
341.74KB |
1 |
| SOT1139-1 |
|
NXP Semiconductors
|
Plastic ball grid array package; 582 balls |
Original |
PDF
|
294.79KB |
1 |
