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SOT480-1
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NXP Semiconductors
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Plastic thin shrink small outline package; 48 leads; body width 4.4 mm; lead pitch 0.4 mm |
Original |
PDF
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231.68KB |
1 |
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SOT481-2
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NXP Semiconductors
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Plastic thin shrink small outline package; 56 leads; body width 4.4 mm |
Original |
PDF
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237.15KB |
1 |
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SOT482B
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NXP Semiconductors
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leadless surface mounted package; plastic cap; 4 terminations |
Original |
PDF
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224.95KB |
1 |
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SOT482C
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NXP Semiconductors
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leadless surface mounted package; plastic cap; 4 terminations |
Original |
PDF
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224.89KB |
1 |
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SOT486-1
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NXP Semiconductors
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Plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm |
Original |
PDF
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238.91KB |
1 |
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SOT487-1
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NXP Semiconductors
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Footprint for reflow soldering |
Original |
PDF
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16.86KB |
2 |
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SOT487-1
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NXP Semiconductors
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Plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm |
Original |
PDF
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232.73KB |
1 |
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SOT489-1
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NXP Semiconductors
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Plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm |
Original |
PDF
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262.95KB |
1 |
