SOT750a |
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NXP Semiconductors
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leadless surface mounted package; plastic cap; 28 terminations |
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Original |
PDF
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225.69KB |
1 |
SOT751-1 |
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NXP Semiconductors
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Plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 1.05 mm |
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Original |
PDF
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245.36KB |
1 |
SOT751-1 |
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NXP Semiconductors
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Footprint for reflow soldering SOT751-1 |
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Original |
PDF
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11.34KB |
1 |
SOT751-2 |
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NXP Semiconductors
|
Footprint for reflow soldering SOT751-2 |
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Original |
PDF
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11.34KB |
1 |
SOT751-2 |
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NXP Semiconductors
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Plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 0.9 mm |
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Original |
PDF
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245.73KB |
1 |
SOT753 |
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NXP Semiconductors
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Plastic surface-mounted package; 5 leads |
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Original |
PDF
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220.96KB |
1 |
SOT753 |
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NXP Semiconductors
|
Footprint for reflow soldering SOT753 |
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Original |
PDF
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8.04KB |
1 |
SOT753 |
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NXP Semiconductors
|
Footprint for wave soldering SOT753 |
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Original |
PDF
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7.71KB |
1 |
SOT753_125 |
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NXP Semiconductors
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Tape reel SMD; reversed product orientation 12NC ending 125 |
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Original |
PDF
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188.6KB |
2 |
SOT754-1 |
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NXP Semiconductors
|
Footprint for reflow soldering SOT754-1 |
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Original |
PDF
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11.49KB |
1 |
SOT754-1 |
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NXP Semiconductors
|
Plastic thin fine-pitch ball grid array package; 256 balls; body 15 x 15 x 0.8 mm |
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Original |
PDF
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274.98KB |
1 |
SOT758-1 |
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NXP Semiconductors
|
Footprint for reflow soldering SOT758-1 |
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Original |
PDF
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324.75KB |
1 |
SOT758-1_118 |
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NXP Semiconductors
|
HVQFN16; Reel pack; SMD, 13"Q1/T1 Standard product orientationOrderable part number ending ,118 or JOrdering code (12NC) ending 118 |
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Original |
PDF
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265.4KB |
4 |
SOT758-2 |
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NXP Semiconductors
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HVQFN16: plastic thermal enhanced very thin quad flat package |
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Original |
PDF
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226.95KB |
1 |
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SOT758-3 |
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NXP Semiconductors
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Footprint for reflow soldering SOT758-3 |
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Original |
PDF
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324.73KB |
1 |
SOT758-3 |
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NXP Semiconductors
|
Plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 3 x 3 x 0.85 mm |
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Original |
PDF
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227.8KB |
1 |
SOT759-1 |
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NXP Semiconductors
|
Plastic low profile fine-pitch ball grid array package; 228 balls; body 12 x 12 x 1.05 mm |
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Original |
PDF
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263.03KB |
1 |