SOT78 |
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NXP Semiconductors
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AN11172 - Mounting instructions for SOT78 (TO-220AB); SOT186A (TO-220F) |
Original |
PDF
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1.32MB |
11 |
SOT780-1 |
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NXP Semiconductors
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Plastic thermal enhanced thin quad flat package; 52 leads; body 10 x 10 x 1 mm; exposed die pad |
Original |
PDF
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238.96KB |
1 |
SOT78_127 |
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NXP Semiconductors
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Tube pack; standard product orientation; 12NC ending 127 |
Original |
PDF
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118.55KB |
2 |
SOT782-1 |
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NXP Semiconductors
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Plastic thermal enhanced very thin small outline package; no leads; 8 terminals |
Original |
PDF
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223.06KB |
1 |
SOT782-1 |
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NXP Semiconductors
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Footprint for reflow soldering SOT782-1 |
Original |
PDF
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319.53KB |
1 |
SOT782-1_115 |
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NXP Semiconductors
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HVSON8; reel pack; standard product orientation; 12NC ending 115 |
Original |
PDF
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304.12KB |
4 |
SOT782-1_118 |
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NXP Semiconductors
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HVSON8; reel pack; SMD; 13"; standard product orientation Orderable part number ending, 118 or J Ordering code (12NC) ending 118 |
Original |
PDF
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266.05KB |
4 |
SOT782-2 |
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NXP Semiconductors
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Footprint for reflow soldering SOT782-2 |
Original |
PDF
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307.51KB |
1 |
SOT782-2 |
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NXP Semiconductors
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Plastic thermal enhanced very thin small outline package; no leads; 8 terminals |
Original |
PDF
|
334.83KB |
1 |
SOT784-1 |
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NXP Semiconductors
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Footprint for reflow soldering SOT784-1 |
Original |
PDF
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11.49KB |
1 |
SOT784-1 |
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NXP Semiconductors
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Plastic low profile quad flat package; 100 leads; body 14 x 20 x 1.4 mm |
Original |
PDF
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240.86KB |
1 |
SOT785-1 |
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NXP Semiconductors
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Plastic low profile fine-pitch ball grid array package; 180 balls; body 14 x 14 x 0.9 mm |
Original |
PDF
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248.03KB |
1 |
SOT785-2 |
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NXP Semiconductors
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Plastic low profile fine-pitch ball grid array package; 180 balls; body 14 x 14 x 1 mm |
Original |
PDF
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244.66KB |
1 |
SOT786-2 |
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NXP Semiconductors
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Plastic thermal enhanced small outline package; 8 leads; body width 3.9 mm; exposed die pad |
Original |
PDF
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359.32KB |
1 |
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SOT786-3 |
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NXP Semiconductors
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Plastic thermal enhanced small outline package; 8 leads; body width 3.9 mm; exposed die pad |
Original |
PDF
|
354.46KB |
1 |
SOT788-1 |
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NXP Semiconductors
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Footprint for reflow soldering SOT788-1 |
Original |
PDF
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19.25KB |
1 |
SOT788-1 |
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NXP Semiconductors
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Plastic thermal enhanced very thin quad flat package; no leads; 28 terminals; body 6 x 6 x 0.85 mm |
Original |
PDF
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228.68KB |
1 |
SOT788-1_118 |
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NXP Semiconductors
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HVQFN28; Reel pack; SMD, 13"Q1/T1 Standard product orientationOrderable part number ending ,118 or JOrdering code (12NC) ending 118 |
Original |
PDF
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184.14KB |
4 |
SOT789a |
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NXP Semiconductors
|
leadless surface mounted package; plastic cap; 32 terminations |
Original |
PDF
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231.88KB |
1 |