SOT800-1 |
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NXP Semiconductors
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Flanged ceramic package; 2 mounting holes; 4 leads |
Original |
PDF
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341.72KB |
1 |
SOT800-2 |
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NXP Semiconductors
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Flanged ceramic package; 2 mounting holes; 4 leads |
Original |
PDF
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341.4KB |
1 |
SOT800a |
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NXP Semiconductors
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Flanged double-ended ceramic package; 2 mounting holes; 4 leads |
Original |
PDF
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229.14KB |
1 |
SOT802-1 |
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NXP Semiconductors
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Plastic thin fine-pitch ball grid array package; 160 balls; body 9 x 13 x 0.8 mm |
Original |
PDF
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243.28KB |
1 |
SOT802-2 |
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NXP Semiconductors
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Plastic thin fine-pitch ball grid array package; 160 balls; body 9 x 13 x 0.7 mm |
Original |
PDF
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243.39KB |
1 |
SOT803-1 |
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NXP Semiconductors
|
Footprint for reflow soldering SOT803-1 |
Original |
PDF
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11.49KB |
1 |
SOT803-1 |
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NXP Semiconductors
|
Plastic quad flat package; 44 leads (lead length 1.6 mm); body 10 x 10 x 2 mm |
Original |
PDF
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239.49KB |
1 |
SOT804-1 |
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NXP Semiconductors
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Plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 x 9 x 0.85 mm |
Original |
PDF
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235.54KB |
1 |
SOT804-1 |
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NXP Semiconductors
|
Footprint for reflow soldering SOT804-1 |
Original |
PDF
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19.25KB |
1 |
SOT804-2 |
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NXP Semiconductors
|
Plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 x 9 x 0.85 mm |
Original |
PDF
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234.9KB |
1 |
SOT804-3 |
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NXP Semiconductors
|
Plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 x 9 x 0.85 mm |
Original |
PDF
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230.34KB |
1 |
SOT804-4 |
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NXP Semiconductors
|
Plastic thermal enhanced very thin quad flat package; no leads; 64 terminals |
Original |
PDF
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225.98KB |
1 |
SOT804-5 |
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NXP Semiconductors
|
Plastic thermal enhanced very thin quad flat package; no leads; 64 terminals |
Original |
PDF
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356.96KB |
1 |
SOT807-1 |
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NXP Semiconductors
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Plastic thermal enhanced ball grid array package; 156 balls; body 15 x 15 x 1.15 mm; heatsink |
Original |
PDF
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245.83KB |
1 |
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SOT807-1 |
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NXP Semiconductors
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Footprint for reflow soldering SOT807-1 |
Original |
PDF
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11.56KB |
1 |
SOT809-1 |
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NXP Semiconductors
|
Plastic low profile ball grid array package; 224 balls; body 17 x 17 x 1.05 mm |
Original |
PDF
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282.07KB |
1 |