SOT119 Search Results

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of HXSON4 package SOT1194-1 1.2 1.15 0.65 0.25 0.48 45° 1.55 0.5 1.2 1.3 0.025 0.48 r= 0.05 solder land solder land plus solder paste solder paste deposit solder resist occupied area Dimensions in mm

Contextual Info: Package outline DFN2626-10: plastic thermal enhanced extremely thin small outline package; no leads; 10 terminals; body 2.6 x 2.6 x 0.5 mm SOT1197-1 X A B D A E A1 A3 terminal 1 index area detail X e1 terminal 1 index area e 1 5 C C A B C v w b y y1 C L k

Contextual Info: Package outline VFBGA24: plastic very thin fine-pitch ball grid array package; 24 balls; body 3 x 3 x 0.65 mm B D SOT1199-1 A ball A1 index area A2 A E A1 detail X e1 e C C A B C Øv Øw b y y1 C E e D e2 C B A ball A1 index area 1 2 3 4 X 5 1 Dimensions Unit

Contextual Info: SOT119A CDFM6; blister pack packing method; standard product orientation 12NC ending 112 Rev. 1 — 1 October 2012 Packing information 1. Packing method Blister cover ESD Label Foam Blister bottom ESD Label Printed plano box Space for additional label Preprinted ESD warning

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of DFN2626-10 package SOT1197-1 Hx Gx D P 0.025 0.025 Ay Gy By SPy SLy nSPy Hy nSPx SPx SLx Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit

Contextual Info: Package outline SO12: plastic small outline package; 12 leads; body width 3.9 mm SOT1196-1 D E A X c HE y v A Z 12 7 A2 A A3 A1 pin 1 index θ Lp 1 L 6 e1 e2 w bp 1 detail X 2 A A1 A2 A3 bp c D 1 max 1.75 0.25 1.45 0.49 0.25 8.75 nom 0.18 1.35 0.25 0.43 0.22 8.65

Contextual Info: Package outline HUSON4: plastic thermal enhanced ultra thin small outline package; no leads; 4 terminals; body 1 x 1 x 0.55 mm SOT1194-1 X A B D A E A1 A3 terminal 1 index area detail X e 1 2 C C A B C v w b y1 C y E D h h k terminal 1 index area L 4 3 1 mm

Contextual Info: Package outline XQFN8: plastic, extremely thin quad flat package; no leads; 8 terminals; body 1.6 x 1.6 x 0.5 mm SOT1193-1 X A B D terminal 1 index area E A A1 detail X e ∅v ∅w b 4 3 C C A B C y y1 C 5 e1 2 6 1 7 terminal 1 index area 8 L metal area not for soldering

Contextual Info: Package outline LFBGA144: plastic low profile fine-pitch ball grid array package; 144 balls; A B D SOT1190-1 ball A1 index area E A A2 A1 detail X e1 e C C A B C Æv Æw b 1/2 e y y1 C M L K J e H G e2 F 1/2 e E D C B A ball A1 index area 1 2 3 4 5 6 7 8 9 10 11 12

Contextual Info: Package outline XQFN8: plastic, extremely thin quad flat package; no leads; 8 terminals; body 1.6 x 1.6 x 0.5 mm SOT1193-2 X A B D terminal 1 index area E A A1 detail X e ∅v ∅w b 4 3 C C A B C y y1 C 5 e1 2 6 1 7 terminal 1 index area 8 L L1 1 Dimensions

q 1257 h1

Abstract: sot119a q 1257 b1w3
Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline Flanged ceramic package; 2 mounting holes; 6 leads SOT119A A F q C U1 B w2 M C M H1 b2 2 H c 4 6 p U2 D1 U3 D w1 M A M B M A 1 3 5 b1 w3 M b Q e 5 10 mm scale DIMENSIONS millimetre dimensions are derived from the original inch dimensions

Contextual Info: Package outline LFBGA144: plastic low profile fine-pitch ball grid array package; 144 balls; A B D SOT1190-2 ball A1 index area A E A2 A1 detail X e1 e ∅v ∅w b 1/2 e C C A B C y y1 C M L K J e H G e2 F 1/2 e E D C B A ball A1 index area 1 2 3 4 5 6 7 8

Contextual Info: Our broad package range provides maximum flexibility Very small 2 Pins Ultra small DSN0603-2 3 Pins SOT883B (SOT883) 4/5 Pins 1.0 x 0.6 x 0.37 (SOT1215) (SOT1194) Medium power SOD323F SOD323 SOD123F SOD123W SOD128 1.7 x 1.25 x 0.7 1.7 x 1.25 x 0.95 2.6 x 1.6 x 1.1

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of HXSON4 package SOT1192-1 1.2 1.15 0.65 0.25 0.48 45° 1.55 0.5 1.2 1.3 0.025 0.48 www.nxp.com r= 0.05 solder land solder land plus solder paste solder paste deposit solder resist occupied area

Contextual Info: Package outline HXSON4: plastic thermal enhanced extremely thin small outline package; no leads; 4 terminals; body 1 x 1 x 0.5 mm SOT1192-1 X A B D A E A1 A3 terminal 1 index area detail X e 1 2 C C A B C v w b y1 C y E D h h k terminal 1 index area L 4 3

A1797

Contextual Info: DISCRETE SEMICONDUCTORS DAT M3D058 BLF346 VHF power MOS transistor Product specification Supersedes data of 1996 Oct 02 2003 Sep 26 Philips Semiconductors Product specification VHF power MOS transistor BLF346 PINNING - SOT119A FEATURES • High power gain

BLV33F

Abstract: RF POWER TRANSISTOR NPN vhf
Contextual Info: Philips Semiconductors Product specification VHF linear power transistor BLV33F FEATURES PINNING - SOT119A • Internally matched input for wideband operation and high power gain PIN SYMBOL • Diffused emitter ballasting resistors fo r an optimum temperature profile

XQFN-10

Contextual Info: Package outline XQFN10: plastic, extremely thin quad flat package; no leads; 10 terminals; body 1.55 x 2.00 x 0.50 mm SOT1191-1 X A B D terminal 1 index area E A A1 c detail X ∅v ∅w b 5 C C A B C y1 C y 6 4 e1 e 9 b1 1 10 terminal 1 index area L1 L 1 Dimensions

Contextual Info: Package outline Flanged ceramic package; 2 mounting holes; 6 leads SOT119A A F q C U1 B w2 M C M H1 b2 2 H c 4 6 p U2 D1 U3 D w1 M A M B M A 1 3 5 b1 w3 M b Q e 5 10 mm scale DIMENSIONS millimetre dimensions are derived from the original inch dimensions

Contextual Info: Package outline HVQFN54R: plastic thermal enhanced very thin quad flat package; no leads; 54 terminals; resin based; body 5.5 x 10 x 0.8 mm A B D SOT1198-1 terminal 1 index area E A detail X e L1 L e1 19 27 18 C C A B C v w b y1 C y 28 e e2 Eh 1/2 e 1 terminal 1

BLF346

Abstract: capacitor 0.01 k 400 V philips
Contextual Info: DISCRETE SEMICONDUCTORS DATA SHEET M3D058 BLF346 VHF power MOS transistor Product specification Supersedes data of 1996 Oct 02 2003 Sep 26 Philips Semiconductors Product specification VHF power MOS transistor BLF346 FEATURES PINNING - SOT119A • High power gain

BLF346

Contextual Info: DISCRETE SEMICONDUCTORS DATA SHEET BLF346 VHF power MOS transistor Product specification Supersedes data of September 1992 1996 Oct 02 Philips Semiconductors Product specification VHF power MOS transistor BLF346 FEATURES PINNING-SOT119 • High power gain

HDMI to ethernet chip

Abstract: dfn2510 lvds displayport IP4786 LVDS to hdmi IP4786CZ32 USB3 esd protection HDMI to USB3.0 chip DFN2110-9 DFN5050-32
Contextual Info: NXP solutions for consumer and computing interfaces Best-in-class protection and signal conditioning As the leading supplier of ESD protection ICs, NXP now offers ESD and surge protection, as well as signal conditioning, with added features such as level shifting. Designed for today’s most

2222-809-05002

Abstract: philips e3 Philips Electrolytic Capacitor 16v BLU60-12 B6PN
Contextual Info: PHILIPS INTERNAT IO NAL bSE D E3 7110ÖSb DDLE7S1 =131 BLU60/12 l U.H.F. POWER TRANSISTOR N-P-N silicon planar epitaxial transistor in SOT-119 envelope prim arily intended fo r use in mobile radio transmitters in the 470 MHz communications band. Features • multi-base structure and emitter-ballasting resistors fo r an optim um temperature profile.